Abstract: A photoelectric conversion device adopts the structure reflecting the finding that color separation by the photoelectric conversion, which utilizes the difference of the PN junction depth of a semiconductor region, has the strong tendency that separation of a B signal is easy but separation of a G signal and an R signal becomes imperfect. That is, to cope with the tendency of the imperfect color separation of a G signal and an R signal, PN junction surfaces (JNC_B, JNC_R) of two photodiodes (PDs) for R light and B light are superimposed in the depth direction, and PD to G light is arranged independently. Accordingly, the color separation property of each RGB light wavelength band can be improved, the occupying area can be reduced compared with the case where each PD of RGB light is dispersed in the plane direction, and simplification of the semiconductor layer structure can be realized.

Abstract: A solid state imaging apparatus includes a solid state imaging element, an optical lens held by a frame, and a flexible printed circuit board having first and second surfaces. The solid state imaging element is mounted on the first surface of the flexible printed circuit board and the frame is mounted on the second surface.

Abstract: A photoelectric conversion device adopts the structure reflecting the finding that color separation by the photoelectric conversion, which utilizes the difference of the PN junction depth of a semiconductor region, has the strong tendency that separation of a B signal is easy but separation of a G signal and an R signal becomes imperfect. That is, to cope with the tendency of the imperfect color separation of a G signal and an R signal, PN junction surfaces (JNC_B, JNC_R) of two photodiodes (PDs) for R light and B light are superimposed in the depth direction, and PD to G light is arranged independently. Accordingly, the color separation property of each RGB light wavelength band can be improved, the occupying area can be reduced compared with the case where each PD of RGB light is dispersed in the plane direction, and simplification of the semiconductor layer structure can be realized.

Abstract: Each of a pair of power supply electric lines (11 and 12) connected to power supply pads of a solid state image sensor (1) and a pair of power supply electric lines (13 and 14) connected to power supply pads of an integrated circuit chip (2) is arranged so that the power supply electric lines included in each power supply electric line pair are in parallel with each other and has a very small gap between them. The power supply electric lines (11 to 14) have a certain width and bend portions that are curved smoothly with a predetermined curvature or less and are formed on a flexible wiring board (3). In each of the solid state image sensor (1) and the integrated circuit chip (2), the high-potential and low-potential power supply pads are arranged side by side.

Abstract: An integrated circuit chip module includes a first integrated circuit chip including a first power source pad for a first power voltage and an adjacent second power source pad for a second power voltage, the first power voltage being higher than the second power voltage, a second integrated circuit chip including a third power source pad for the first power voltage and an adjacent fourth power source pad for the second power voltage, and a wiring board including a first power source wire electrically connected to the first power source pad, a second power source wire electrically connected to the second power source pad, a third power source wire electrically connected to the third power source pad, and a fourth power source wire electrically connected to the fourth power source pad.

Abstract: A solid state imaging apparatus includes a solid state imaging element, an optical lens held by a frame, and a flexible printed circuit board having first and second surfaces. The solid state imaging element is mounted on the first surface of the flexible printed circuit board and the frame is mounted on the second surface.

Abstract: A solid state imaging apparatus includes a solid state imaging element, an optical lens held by a frame, and a flexible printed circuit board having first and second surfaces. The solid state imaging element is mounted on the first surface of the flexible printed circuit board and the frame is mounted on the second surface.

Abstract: An integrated circuit chip module includes a first integrated circuit chip including a first power source pad for a first power voltage and an adjacent second power source pad for a second power voltage, the first power voltage being higher than the second power voltage, a second integrated circuit chip including a third power source pad for the first power voltage and an adjacent fourth power source pad for the second power voltage, and a wiring board including a first power source wire electrically connected to the first power source pad, a second power source wire electrically connected to the second power source pad, a third power source wire electrically connected to the third power source pad, and a fourth power source wire electrically connected to the fourth power source pad.

Abstract: A portable telephone including an integrated circuit chip module with a first integrated circuit chip including a first power source pad for a first power voltage and an adjacent second power source pad for a second power voltage, the first power voltage being higher than the second power voltage, a second integrated circuit chip including a third power source pad for the first power voltage and an adjacent fourth power source pad for the second power voltage, and a wiring board including a first power source wire electrically connected to the first power source pad, a second power source wire electrically connected to the second power source pad, a third power source wire electrically connected to the third power source pad, and a fourth power source wire electrically connected to the fourth power source pad.

Abstract: A solid state imaging apparatus includes a solid state imaging element, an optical lens held by a frame, and a flexible printed circuit board having first and second surfaces. The solid state imaging element is mounted on the first surface of the flexible printed circuit board and the frame is mounted on the second surface.

Abstract: A solid state imaging apparatus includes a solid state imaging element, an optical lens held by a frame, and a flexible printed circuit board having first and second surfaces. The solid state imaging element is mounted on the first surface of the flexible printed circuit board and the frame is mounted on the surface.

Abstract: A solid-state image pickup apparatus includes a solid-state image pickup device having a layer of microlenses above a color filter. The solid-state image pickup device is mounted on a side of a flexible printed circuit board by flip-chip bonding, opposite the opening. An adhesive in a gap between the solid-state image pickup device and the flexible printed circuit board strengthens the apparatus. The distance between the edge of the microlens layer and the edge of the flexible printed circuit board defining the opening and nearest to the microlens layer is 2.5 to 10 times wider than the gap between the solid-state image pickup device and the flexible printed circuit board.

Abstract: A portable telephone including an integrated circuit chip module with a first integrated circuit chip including a first power source pad for a first power voltage and an adjacent second power source pad for a second power voltage, the first power voltage being higher than the second power voltage, a second integrated circuit chip including a third power source pad for the first power voltage and an adjacent fourth power source pad for the second power voltage, and a wiring board including a first power source wire electrically connected to the first power source pad, a second power source wire electrically connected to the second power source pad, a third power source wire electrically connected to the third power source pad, and a fourth power source wire electrically connected to the fourth power source pad.

Abstract: On the circuit surfaces of integrated circuit chips, there are adjacently laid out a power source pad for a power source wire at a plus voltage side and a power source pad for a power source wire at a minus voltage side. On a single-surface printed wiring board, a first set of two power source wires and a second set of two power source wires respectively are flip-chip mounted to two power source pads of the integrated circuit chips. The first and second sets of the power source wires are substantially parallel to each other, with substantially constant wire widths and with a substantially constant wire interval. Near the outer periphery of the printed wiring board, the first and second sets of the power source wires are bent smoothly and follow the periphery of the printed wiring board.

Abstract: Each of a pair of power supply electric lines (11 and 12) connected to power supply pads of a solid state image sensor (1) and a pair of power supply electric lines (13 and 14) connected to power supply pads of an integrated circuit chip (2) is arranged so that the power supply electric lines included in each power supply electric line pair are in parallel with each other and has a very small gap between them. The power supply electric lines (11 to 14) have a certain width and bend portions that are curved smoothly with a predetermined curvature or less and are formed on a flexible wiring board (3). In each of the solid state image sensor (1) and the integrated circuit chip (2), the high-potential and low-potential power supply pads are arranged side by side.

Abstract: A method of producing a solid image pickup device including a solid image pickup element, and an optical lens held in a housing that is mounted on a flexible wiring board. A fixing device fixes the flexible wiring board in a folded state corresponding to an external shape of the solid image pickup device during bonding of the flexible wiring board.

Abstract: A solid image pickup apparatus includes a flexible printed circuit board. A solid image pickup element and an optical lens held in a casing are disposed on the flexible printed circuit board. The flexible printed circuit board has a surface on which a capacitor is formed.

Abstract: On the circuit surfaces of integrated circuit chips, there are adjacently laid out a power source pad for a power source wire at a plus voltage side and a power source pad for a power source wire at a minus voltage side. On a single-surface printed wiring board, a first set of two power source wires and a second set of two power source wires are flip-chip mounted with two power source pads of the integrated circuit chips respectively. The first and second sets of the power source wires are formed substantially in parallel with each other, by maintaining substantially constant wire widths and substantially constant wire interval. Near the outer periphery of the printed wiring board, the first and second sets of the power source wires are bent smoothly to follow the periphery.

Abstract: A solid image pickup apparatus comprises a flexible printed circuit board. A solid image pickup element and an optical lens held in a casing are disposed on the flexible printed circuit board. The flexible printed circuit board has a surface on which a capacitor is formed.

Abstract: The production method provides a method of producing a solid image pickup device. The solid image pickup device comprises a solid image pickup element, and an optical lens held in a housing provided in a flexible wiring board. The fixing device bonds and fixes the flexible wiring board in a folded state corresponding to an external shape of the solid image pickup device.