Patents by Inventor Kohji SUZUMURA

Kohji SUZUMURA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Moisture-curable reactive hot-melt adhesive composition and method for producing the same
    Patent number: 11624016
    Abstract: A moisture-curable reactive hot-melt adhesive composition comprises: a urethane prepolymer having an isocyanate group, the urethane prepolymer being a reaction product of a polyol component comprising a polyester polyol, a polyether polyol and a polybutadiene polyol with an isocyanate component; and an antioxidant.
    Type: Grant
    Filed: April 11, 2017
    Date of Patent: April 11, 2023
    Assignee: SHOWA DENKO MATERIALS CO., LTD.
    Inventors: Chika Kuramochi, Souichirou Komiya, Kazuyuki Magome, Kohji Suzumura
  • MOISTURE-CURABLE REACTIVE HOT-MELT ADHESIVE COMPOSITION AND METHOD FOR PRODUCING THE SAME
    Publication number: 20190127618
    Abstract: A moisture-curable reactive hot-melt adhesive composition comprises: a urethane prepolymer having an isocyanate group, the urethane prepolymer being a reaction product of a polyol component comprising a polyester polyol, a polyether polyol and a polybutadiene polyol with an isocyanate component; and an antioxidant.
    Type: Application
    Filed: April 11, 2017
    Publication date: May 2, 2019
    Inventors: Chika KURAMOCHI, Souichirou KOMIYA, Kazuyuki MAGOME, Kohji SUZUMURA