Abstract: A semiconductor light emitting unit is provided which comprises: a support 1 formed with longitudinal side walls 15 disposed opposite to each other for forming a pair of light reflective surfaces 9, and a bottom wall 16 connected to longitudinal side walls 15 for forming a mount surface 3a between light reflective surfaces 9 to form a channel 3 by longitudinal side walls 15 and bottom wall 16 above mount surface 3a. Formed at either end of channel 3 in the longitudinal direction of support 1 is a vertical opening 18 which serves to directly communicate channels 3 of adjacent light emitting units when plural semiconductor light emitting units are lengthwise arranged, so that there is no lateral side wall 15 obstructing path of light radiated from LED chips 2 toward outside to thereby irradiate uniform light to outside along the longitudinal direction of linear light source.

Abstract: A semiconductor light emitting device is provided which comprises: a semiconductor light emitting chip 2 mounted on a top surface 12 of a support plate 1, wiring conductors 3 disposed adjacent to side surfaces 11 of support plate 1, and a plastic encapsulant 6 for sealing side surfaces 11 of support plate 1 and wiring conductors 3. Each of wiring conductors 3 has one end 13 electrically connected to an electrode 2a of semiconductor light emitting chip 2 and the other end 14 extending away from support plate 1.

Abstract: A semiconductor light emitting device is provided which comprises: a semiconductor light emitting chip 2 mounted on a top surface 12 of a support plate 1, wiring conductors 3 disposed adjacent to side surfaces 11 of support plate 1, and a plastic encapsulant 6 for sealing side surfaces 11 of support plate 1 and wiring conductors 3. Each of wiring conductors 3 has one end 13 electrically connected to an electrode 2a of semiconductor light emitting chip 2 and the other end 14 extending away from support plate 1.

Abstract: A semiconductor light emitting unit is provided which comprises: a support 1 formed with longitudinal side walls 15 disposed opposite to each other for forming a pair of light reflective surfaces 9, and a bottom wall 16 connected to longitudinal side walls 15 for forming a mount surface 3a between light reflective surfaces 9 to form a channel 3 by longitudinal side walls 15 and bottom wall 16 above mount surface 3a. Formed at either end of channel 3 in the longitudinal direction of support 1 is a vertical opening 18 which serves to directly communicate channels 3 of adjacent light emitting units when plural semiconductor light emitting units are lengthwise arranged, so that there is no lateral side wall 15 obstructing path of light radiated from LED chips 2 toward outside to thereby irradiate uniform light to outside along the longitudinal direction of linear light source.

Abstract: A semiconductor light emitting device is provided which comprises a metallic support plate 1; a semiconductor light emitting diode chip 2 mounted on a support surface 13a defined on an upper surface 13 of support plate 1; wiring conductors 4 mounted on side and upper surfaces 12, 13 of support plate 1 via insulators 6; and a plastic encapsulant 3 for sealing side and upper surfaces 12 and 13 of support plate 1 and a part of wiring conductors 4. As support plate 1 comprises at least one projection 16 extending from side surface 12 of support plate 1 through a notch 3a formed in plastic encapsulant 3 for outward exposure, heat from diode chip 2 can be efficiently diffused to the outside through projections 16 of support plate 1 extending through notch 3a of plastic encapsulant 3 for outward exposure, when heavy current flows through diode chip 2 through wiring conductors 4 for stronger lighting.

Abstract: A semiconductor light emitting device is provided which comprises a metallic support plate 1; a semiconductor light emitting diode chip 2 mounted on a support surface 13a defined on an upper surface 13 of support plate 1; wiring conductors 4 mounted on side and upper surfaces 12, 13 of support plate 1 via insulators 6; and a plastic encapsulant 3 for sealing side and upper surfaces 12 and 13 of support plate 1 and a part of wiring conductors 4. As support plate 1 comprises at least one projection 16 extending from side surface 12 of support plate 1 through a notch 3a formed in plastic encapsulant 3 for outward exposure, heat from diode chip 2 can be efficiently diffused to the outside through projections 16 of support plate 1 extending through notch 3a of plastic encapsulant 3 for outward exposure, when heavy current flows through diode chip 2 through wiring conductors 4 for stronger lighting.