Abstract: A synchrotron exposure includes a synchrotron radiation source for generating a synchrotron radiation beam, and exposure unit having a mask stage for holding a mask and a wafer stage for holding a waver, a beam port for directing the radiation beam to the exposure unit, a mirror unit having a mirror for reflecting the radiation beam, a pre-alignment system for aligning the wafer relative to the wafer stage, a fine-alignment system for aligning the wafer held by the wafer stage relative to the mask held by the mask stage, a mask storage apparatus for storing the mask, a wafer storage apparatus for storing the wafer, a mask conveying apparatus for conveying the mask between the mask storage apparatus and the mask stage and a wafer conveying apparatus for conveying a wafer between the wafer storage apparatus and the wafer stage.

Abstract: A semiconductor device manufacturing SOR X-ray exposure apparatus wherein, after a mask and a semiconductor wafer are aligned, and SOR X-ray is used to transfer a semiconductor device pattern on the mask onto a resist on the semiconductor wafer. The apparatus includes a mirror unit and an exposure unit for exposing the wafer through the mask to the X-ray from the mirror unit. The mirror unit includes an X-ray mirror for diverging the X-ray in a desired direction, a first chamber for providing a desired vacuum ambience around the X-ray mirror and a first supporting device for supplying the X-ray mirror. The exposure unit includes a shutter for controlling the exposure, a mask stage for holding the mask, a wafer stage for holding the wafer, a second chamber for providing a desired He ambience around the mask stage and the wafer stage, a frame structure for mounting the mask stage and the wafer stage and a second supporting device for supporting the frame structure.