Patents by Inventor Kohki Ogawa

Kohki Ogawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Wiring board and capacitor
    Patent number: 7742314
    Abstract: A wiring board comprising: a board core (11) having a core main surface (12) and a core reverse surface (13); a capacitor (101, 101A, 101B, 101C, 101D, 101E, 101F, 101G, 101H, 101J, 1101, 1101?, 1101?, 1101??, 1101??, 1101???) having a capacitor main surface (102) and a capacitor reverse surface (103) and having a structure in which first inner electrode layers (141) and second inner electrode layers (142) are alternately laminated and arranged via a dielectric layer (105), the capacitor (101, 101A, 101B, 101C, 101D, 101E, 101F, 101G, 101H, 101J, 1101, 1101?, 1101?, 1101??, 1101??, 1101???) being accommodated in the board core (11) in a state in which the core main surface (12) and the capacitor main surface (102) are oriented on a same side; and a wiring laminated portion (31) having a structure in which interlayer insulating layers (33, 35) and conductor layers (42) are alternately laminated on the core main surface (12) and the capacitor main surface (102), wherein an inductor (251, 252, 253) or a resistor
    Type: Grant
    Filed: August 31, 2006
    Date of Patent: June 22, 2010
    Assignee: NGK Spark Plug Co., Ltd.
    Inventors: Kazuhiro Urashima, Shinji Yuri, Manabu Sato, Kohki Ogawa
  • Wiring board and capacitor
    Publication number: 20070076392
    Abstract: A wiring board comprising: a board core (11) having a core main surface (12) and a core reverse surface (13); a capacitor (101, 101A, 101B, 101C, 101D, 101E, 101F, 101G, 101H, 101J, 1101, 1101?, 1101?, 1101??, 1101??, 1101???) having a capacitor main surface (102) and a capacitor reverse surface (103) and having a structure in which first inner electrode layers (141) and second inner electrode layers (142) are alternately laminated and arranged via a dielectric layer (105), the capacitor (101, 101A, 101B, 101C, 101D, 101E, 101F, 101G, 101H, 101J, 1101, 1101?, 1101?, 1101??, 1101??, 1101???) being accommodated in the board core (11) in a state in which the core main surface (12) and the capacitor main surface (102) are oriented on a same side; and a wiring laminated portion (31) having a structure in which interlayer insulating layers (33, 35) and conductor layers (42) are alternately laminated on the core main surface (12) and the capacitor main surface (102), wherein an inductor (251, 252, 253) or a resistor
    Type: Application
    Filed: August 31, 2006
    Publication date: April 5, 2007
    Inventors: Kazuhiro Urashima, Shinji Yuri, Manabu Sato, Kohki Ogawa