Patents by Inventor Kohsei Nozawa

Kohsei Nozawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8507069
    Abstract: A vehicle deck board 1 is molded in such a manner that a lower die 21 and an upper die 22 are clamped together in a state where foamed resins 13 and reinforcements 20 are interposed between a back surface side sheet material 16 and a front surface side sheet material 15, whereby the back surface side sheet material 16 and the front surface side sheet material 15 are welded to each other to thereby form a laminated member 26 with height-increasing bridge members included therein, compressed air is injected into an inside of the laminated member 26 with the height-increasing bridge members included therein, which is formed by welding the back surface side sheet material 16 and the front surface side sheet 15, while individually vacuum-sucking the back surface side sheet material 16 and the front surface side sheet material 15 to the lower die 21 and the upper die 22, and the laminated member 26 concerned is subjected to blow molding.
    Type: Grant
    Filed: November 27, 2012
    Date of Patent: August 13, 2013
    Assignee: Meiwa Industry Co., Ltd.
    Inventors: Sen Kitano, Hiroyuki Kiuchi, Ichiro Yuzawa, Kohsei Nozawa
  • Patent number: 8343610
    Abstract: A vehicle deck board 1 is molded in such a manner that a lower die 21 and an upper die 22 are clamped together in a state where foamed resins 13 and reinforcements 20 are interposed between a back surface side sheet material 16 and a front surface side sheet material 15, whereby the back surface side sheet material 16 and the front surface side sheet material 15 are welded to each other to thereby form a laminated member 26 with height-increasing bridge members included therein, compressed air is injected into an inside of the laminated member 26 with the height-increasing bridge members included therein, which is formed by welding the back surface side sheet material 16 and the front surface side sheet 15, while individually vacuum-sucking the back surface side sheet material 16 and the front surface side sheet material 15 to the lower die 21 and the upper die 22, and the laminated member 26 concerned is subjected to blow molding.
    Type: Grant
    Filed: March 21, 2008
    Date of Patent: January 1, 2013
    Assignee: Meiwa Industry Co., Ltd.
    Inventors: Sen Kitano, Hiroyuki Kiuchi, Ichiro Yuzawa, Kohsei Nozawa
  • Publication number: 20100104788
    Abstract: A vehicle deck board 1 is molded in such a manner that a lower die 21 and an upper die 22 are clamped together in a state where foamed resins 13 and reinforcements 20 are interposed between a back surface side sheet material 16 and a front surface side sheet material 15, whereby the back surface side sheet material 16 and the front surface side sheet material 15 are welded to each other to thereby form a laminated member 26 with height-increasing bridge members included therein, compressed air is injected into an inside of the laminated member 26 with the height-increasing bridge members included therein, which is formed by welding the back surface side sheet material 16 and the front surface side sheet 15, while individually vacuum-sucking the back surface side sheet material 16 and the front surface side sheet material 15 to the lower die 21 and the upper die 22, and the laminated member 26 concerned is subjected to blow molding.
    Type: Application
    Filed: March 21, 2008
    Publication date: April 29, 2010
    Inventors: Sen Kitano, Hiroyuki Kiuchi, Ichiro Yuzawa, Kohsei Nozawa