Patents by Inventor Kohsoku Nagata

Kohsoku Nagata has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Dispersion strengthened copper alloy and a method of manufacturing the same
    Patent number: 5004498
    Abstract: A dispersion strengthened copper alloy containing a copper matrix, and dispersion particles dispersed in the copper matrix within a range of 0.5 to 6 vol %. In this alloy, an average diameter of a matrix region where the dispersion particles are not present is 0.3 .mu.m or less, and the total amount of solid solution elements contained in the copper matrix is determined such that, when this amount of the solid solution elements is added to pure copper, the electric conductivity of the matrix is lowered by 5% IACS or less.
    Type: Grant
    Filed: October 10, 1989
    Date of Patent: April 2, 1991
    Assignee: Kabushiki Kaisha Toshiba
    Inventors: Keizo Shimamura, Kagetaka Amano, Tatsuyoshi Aisaka, Satoshi Hanai, Kohsoku Nagata