Abstract: It is made possible to use a lens array including common lenses as a lens array that collects beams of light from light-emitting units, regardless of the number of light-emitting elements included in each light-emitting unit, thereby reducing the manufacturing cost of a light-emitting device. The light-emitting device includes a substrate, light-emitting units arranged on the substrate, and a lens array including lenses provided corresponding to the light-emitting units, respectively, to collect beams of emission light from the respective light-emitting units, the lens array being arranged on the light-emitting units. Each of the light-emitting units has light-emitting elements that are mounted on the substrate in a lattice pattern and are series-parallel connected to one another in a mount region whose shape is common in the light-emitting units so as to include a predetermined number of series connections and a predetermined number of parallel connections which are set for the light-emitting unit.

Abstract: A mounting board including a pair of patterned electrodes, a lower surface and an upper surface opposed thereto on which a substrate of an electronic component is to be mounted, a pass-through hole penetrating through the upper surface and the lower surface, and a peripheral side surface that defines the pass-through hole. The pass-through hole includes a plurality of penetrating grooves that are cut into the mounting board and penetrate through the upper and lower surfaces. The plurality of penetrating grooves electrically split the pair of patterned electrodes. The pair of patterned electrodes is partly positioned inside the peripheral side surface, and a connection portion connecting the at least one pair of patterned electrodes and at least one pair of patterned electrodes provided on the upper surface of the substrate of the electronic component is to be disposed inside the peripheral side surface that defines the pass-through hole.

Abstract: A mounting board including a pair of patterned electrodes, a lower surface and an upper surface opposed thereto on which a substrate of an electronic component is to be mounted, a pass-through hole penetrating through the upper surface and the lower surface, and a peripheral side surface that defines the pass-through hole. The pass-through hole includes a plurality of penetrating grooves that are cut into the mounting board and penetrate through the upper and lower surfaces. The plurality of penetrating grooves electrically split the pair of patterned electrodes. The pair of patterned electrodes is partly positioned inside the peripheral side surface, and a connection portion connecting the at least one pair of patterned electrodes and at least one pair of patterned electrodes provided on the upper surface of the substrate of the electronic component is to be disposed inside the peripheral side surface that defines the pass-through hole.