Abstract: A light-sensitive composition is described, containing: (A) a light-sensitive diazo compound, (B) a combination of Polymer (B-1) and Polymer (B-2), and (C) an epoxy resin. Polymer (B-1) is a polymer having the structural units of the general formulae (i), (ii) and (iii). Polymer (B-2) is a polymer having the structural units of the general formulae (iv), (v) and (vi). ##STR1## wherein R.sup.1 is a hydrogen atom or a methyl group, R.sup.2 is an unsubstituted or substituted benzyl group, a lower alkyl group, or a halogen-substituted lower alkyl group, R.sup.3 is a hydrogen atom, a lower alkyl group, or a halogen-substituted lower alkyl group, R.sup.4 is a tert- or iso-butyl group, and R.sup.5 is a lower alkyl group. This composition is a negative-type light-sensitive composition and is used to prepare a lithographic printing plate, for example. This printing plate is superior in lipophilic nature and also in mechanical properties such as abrasion resistance.

Abstract: A resist material for micro-fabrication comprising a polymer in which the polymer backbone has thereon a moiety of the formula (I) ##STR1## wherein R represents a hydrogen atom, an alkyl group, an alkenyl group or an aryl group or an aralkyl group, the resist material being curable by electromagnetic radiation such as electron beams, X-rays or deep ultraviolet light with a wave length of less than about 3000A and being particularly suitable as a micro-fabrication resist material.

Abstract: A resist material curable by irradiation with high energy radiation such as electron beams, X-rays, ion beams, neutron beams, .gamma.-rays or deep ultraviolet light but substantially non-curable by irradiation with light having a wavelength of about 300 nm or more, the resist material comprising, as a main component, a solvent-soluble polymer containing an ethylenically unsaturated double bond, the polymer being obtained by reacting (a) a polymer having a plurality of oxirane rings therein and (b) a monomer containing (i) at least one ethylenically unsaturated double bond and (ii) one functional group capable of opening the oxirane rings, and then opening the unreacted oxirane rings.

Abstract: A photocurable composition comprising a first copolymer having a recurring unit of general formula (I): ##STR1## wherein Ar represents a substituted or unsubstituted phenyl group, R.sub.1 represents a lower alkyl group, and m.sub.1 and m.sub.2 are positive numbers with m.sub.1 being greater than or equal to m.sub.2 ;and a second copolymer having a recurring unit of general formula (II): ##STR2## wherein R.sub.2 represents a lower alkyl group, X represents a hydrogen atom or a methyl group, and R.sub.3 represents an isobutyl group, a t-butyl group or a --CH.sub.2 Ar group where Ar represents a substituted or unsubstituted phenyl group and when R.sub.3 is --CH.sub.2 Ar, R.sub.2 can also be t-butyl and isobutyl, and n.sub.1, n.sub.2 and n.sub.3 are positive numbers but n.sub.1 can be zero and (n.sub.1 +n.sub.2)/n.sub.3 equals to about 0.5 to 20; and containing suitable amounts of a cross-linking agent and a photoactivator.

Abstract: A resist material for micro-fabrication comprising a polymer in which the polymer backbone has thereon a moiety of the formula (I) ##STR1## wherein R represents a hydrogen atom, an alkyl group, an alkenyl group or an aryl group or an aralkyl group, the resist material being curable by electromagnetic radiation such as electron beams, X-rays or deep ultraviolet light with a wave length of less than about 3000A and being particularly suitable as a micro-fabrication resist material.

Abstract: A resin composition is disclosed comprising, as essential ingredients, (I) a urethanized epoxy resin or a urethanized epoxy resin acrylate or methacrylate, (II) a ketone resin and (III) a cross-linkable or polymerizable compound containing at least two ethylenically unsaturated groups.