Patents by Inventor Kohzo Abe

Kohzo Abe has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6504615
    Abstract: A pair of optical profile measuring systems 10, 20 are located at positions facing to both surfaces of a wafer 1 vertically supported at its edge. A thickness gauge 50 having one or more sensors is located between the optical systems 10, 20 for measuring thickness at several points on the wafer 1. Each optical system 10, 20 comprises a light emitter 11, 21 for discharging a measuring light beam 12, 22, a collimator lens 14, 24 for rectifying the light beam 12, 22 into a collimated beam, an optical flat 15, 25 for transmitting the collimated light beam 12, 22, a light detector 16, 26 receiving the light beams 12, 22 reflected on a surface of the wafer 1 and on a referential plane of the optical flat 15, 25 through the collimator lens 14, 24 and a computer 17, 27 for processing interference fringes which occur between the surface of the wafer 1 and the referential plane of the optical flat 15, 25.
    Type: Grant
    Filed: November 8, 1999
    Date of Patent: January 7, 2003
    Assignees: Super Silicon Crystal Research Institute Corporation, Kuroda Precision Industries, Ltd.
    Inventors: Kohzo Abe, Nobuaki Iguchi
  • Patent number: 6343980
    Abstract: Three columns 10, 20, 30 are set up in an approximately triangle arrangement. A saddle 51, which fixes a main spindle 50 thereto, is held in contact with a side face of the column 10, 20 or 30 or a brace 40 which unitarily connects two or three of the columns 10, 20, 30. A plurality of chucking tables 4a, 4b are installed in an indexing table 2a. When a work piece 5b attracted onto one chucking table 4b is carried to a position below the main spindle 50, the other chucking table 4a is located at a loading-unloading position. Since the main spindle 50 is located at a geometrical gravity center of a triangle defined by the columns 10, 20, 30, a reaction force which is generated during machining is uniformly distributed to each of the columns 10, 20, 30. Consequently, the columns 10, 20, 30 are prevented from deformation which causes inclination of the main spindle 50, and the machined work piece has superior flatness.
    Type: Grant
    Filed: November 1, 1999
    Date of Patent: February 5, 2002
    Assignees: Supersilicon Crystal Research Institute Corporation, Disco Corporation
    Inventors: Kohzo Abe, Yutaka Koma
  • Patent number: 6165054
    Abstract: A double side grinding apparatus and a double side polishing apparatus, with a narrow tolerance range, reduces pitching errors, and ensures a sufficient level of rigidity against the force of reaction to machining, while enhancing positioning accuracy. The double side grinding apparatus or a double side polishing apparatus includes a plurality of guideways for supporting and shifting main spindles, and these plural guideways on end define a geometric center matched with the center of gravity of the main spindles. The number of the guideways is preferably three in order not to obstruct the mounting and removal of a workpiece.
    Type: Grant
    Filed: February 18, 1999
    Date of Patent: December 26, 2000
    Assignees: Super Silicon Crystal Research Institute Corp., Sumitomo Heavy Industries, Ltd.
    Inventors: Kohzo Abe, Sho Isobe, Yoshiyuki Tomita, Kazutoshi Hara, Ryuzo Masaki, Akio Iwase, Hiroshi Nagata
  • Patent number: 5995226
    Abstract: A pair of optical profile measuring systems 10, 20 are provided at positions faced to both sides of a wafer 1 vertically supported at its edge. Each system 10, 20 includes a light emitter 11, 21 for discharging a measuring light beam 12, 22, a collimator lens 14, 24 for rectifying the light beam 12, 22 into a collimated beam, an optical flat 15, 25 for transmitting the collimated light beam 12, 22, a light detector 16, 26 receiving the light beams 12, 22 reflected on a surface of the wafer 1 and on a referential plane of the optical flat 15, 25 through the collimator lens 14, 24 and a computer 17, 27 for processing interference fringes which occur between the surface of the wafer 1 and the referential plane of the optical flat 15, 25. Profiles of main and back surfaces of the wafer as well as its thickness variation are easily measured utilizing light interference fringes corresponding to both sides of a wafer.
    Type: Grant
    Filed: June 8, 1998
    Date of Patent: November 30, 1999
    Assignees: Super Silicon Crystal Research Institute Corporation, Kuroda Precision Industries Ltd.
    Inventors: Kohzo Abe, Nobuaki Iguchi