Abstract: Sufficient yield strength is achieved against tensile, compressive and shearing forces working on steel frame columns and steel frame girders by using simply configured connective fittings to reduce costs and construction periods. For this purpose, a connective structure of highly rigid steel frame columns and steel frame girders formed by connecting steel frame columns and steel frame girders each having a web part and flange parts with connective fittings is provided. Each of the connective fittings has a bottom plate part and, on a surface of the bottom plate part, side plate parts which rise at a substantially right angle to the bottom plate part and have inserting areas extending farther than a tip of the bottom plate part in the state of rising at the substantially right angle.

Abstract: Sufficient yield strength is achieved against tensile, compressive and shearing forces working on steel frame columns and steel frame girders by using simply configured connective fittings to reduce costs and construction periods. For this purpose, a connective structure of highly rigid steel frame columns and steel frame girders formed by connecting steel frame columns and steel frame girders each having a web part and flange parts with connective fittings is provided. Each of the connective fittings has a bottom plate part and, on a surface of the bottom plate part, side plate parts which rise at a substantially right angle to the bottom plate part and have inserting areas extending farther than a tip of the bottom plate part in the state of rising at the substantially right angle.

Abstract: In a method of producing a printed wiring board, solder layers are formed on pads beforehand. After the solder layers have been covered with a solder resist, the solder layers are caused to flow so as to render only the portion of the solder resist overlying the pads fragile. Then, the fragile portions of the solder resist are removed by roughening with the result that solder resist dams for preventing the solder from flowing are formed. This kind of procedure allows thick solder layers to be formed simultaneously with the solder resist dams without resorting to a great number of steps or an extra mask.