Abstract: A magnetic material and an inductor capable of attaining both higher magnetic permeability and improved DC superposition characteristics. A composite magnetic material contains metal magnetic particles, in which the metal magnetic particles include first particles having a median diameter D50 of 1.3 ?m or more and 5.0 ?m or less (i.e., from 1.3 ?m to 5.0 ?m), and second particles having a median diameter D50 larger than the first particles. The first and second particles each include a core portion made of a metal magnetic material, and an insulating film provided on a surface of the core portion. The insulating film of the second particles has an average thickness of 40 nm or more and 100 nm or less (i.e., from 40 nm to 100 nm). The insulating film of the first particles has an average thickness smaller than that of the insulating film of the second particles.

Abstract: A coil component that can maintain a high magnetic permeability and improve a DC superposition characteristic, and a method for producing a magnetic powder-containing resin material used to provide such a coil component. A coil component according includes an element body including a coil conductor and a magnetic portion. The coil conductor is formed of a wound conductor wire. The magnetic portion containing metal magnetic material grains covered with an insulating coating, a resin, and insulator grains. The coil component further includes an external electrode electrically connected to an extended portion of the coil conductor and disposed on a surface of the element body. The insulator grains have a relative permeability lower than a relative permeability of the metal magnetic material grains, and the insulator grains and the insulating coating are a compound whose main component is the same.

Abstract: A magnetic material and an inductor capable of attaining both higher magnetic permeability and improved DC superposition characteristics. A composite magnetic material contains metal magnetic particles, in which the metal magnetic particles include first particles having a median diameter D50 of 1.3 µm or more and 5.0 µm or less (i.e., from 1.3 µm to 5.0 µm), and second particles having a median diameter D50 larger than the first particles. The first and second particles each include a core portion made of a metal magnetic material, and an insulating film provided on a surface of the core portion. The insulating film of the second particles has an average thickness of 40 nm or more and 100 nm or less (i.e., from 40 nm to 100 nm). The insulating film of the first particles has an average thickness smaller than that of the insulating film of the second particles.

Abstract: A magnetic material and an inductor capable of attaining both higher magnetic permeability and improved DC superposition characteristics. A composite magnetic material contains metal magnetic particles, in which the metal magnetic particles include first particles having a median diameter D50 of 1.3 ?m or more and 5.0 ?m or less (i.e., from 1.3 ?m to 5.0 ?m), and second particles having a median diameter D50 larger than the first particles. The first and second particles each include a core portion made of a metal magnetic material, and an insulating film provided on a surface of the core portion. The insulating film of the second particles has an average thickness of 40 nm or more and 100 nm or less (i.e., from 40 nm to 100 nm). The insulating film of the first particles has an average thickness smaller than that of the insulating film of the second particles.

Abstract: A soft magnetic powder includes soft magnetic particles each having a nucleus that contains a soft magnetic metal and an insulating film on the surface of the nucleus. The insulating film contains Si and a hydrocarbon group having a C8 or longer linear-chain moiety, and the ratio by weight of Si to C in the insulating film is 7.6 or more and 42.8 or less (i.e., from 7.6 to 42.8).

Abstract: A coil component that can maintain a high magnetic permeability and improve a DC superposition characteristic, and a method for producing a magnetic powder-containing resin material used to provide such a coil component. A coil component according includes an element body including a coil conductor and a magnetic portion. The coil conductor is formed of a wound conductor wire. The magnetic portion containing metal magnetic material grains covered with an insulating coating, a resin, and insulator grains. The coil component further includes an external electrode electrically connected to an extended portion of the coil conductor and disposed on a surface of the element body. The insulator grains have a relative permeability lower than a relative permeability of the metal magnetic material grains, and the insulator grains and the insulating coating are a compound whose main component is the same.

Abstract: A magnetic material and an inductor capable of attaining both higher magnetic permeability and improved DC superposition characteristics. A composite magnetic material contains metal magnetic particles, in which the metal magnetic particles include first particles having a median diameter D50 of 1.3 ?m or more and 5.0 ?m or less (i.e., from 1.3 ?m to 5.0 ?m), and second particles having a median diameter D50 larger than the first particles. The first and second particles each include a core portion made of a metal magnetic material, and an insulating film provided on a surface of the core portion. The insulating film of the second particles has an average thickness of 40 nm or more and 100 nm or less (i.e., from 40 nm to 100 nm). The insulating film of the first particles has an average thickness smaller than that of the insulating film of the second particles.

Abstract: An electronic component includes a coil, or a coiled conductor, and a molded body including a sealant containing resin and magnetic powder, and encapsulating the coil. The coil is coated with a cured product of a thermosetting composition, and the coated body is embedded in the molded body. A method of manufacturing the electronic component includes forming a coil by winding a conductor, applying a thermosetting composition on the coil, heat treating the coil on which the composition is applied to obtain a coated body, embedding the coated body into a sealant containing resin and magnetic powder, and applying pressure to the sealant to form a molded body.

Abstract: An electronic component includes a coil, or a coiled conductor, and a molded body including a sealant containing resin and magnetic powder, and encapsulating the coil. The coil is coated with a cured product of a thermosetting composition, and the coated body is embedded in the molded body. A method of manufacturing the electronic component includes forming a coil by winding a conductor, applying a thermosetting composition on the coil, heat treating the coil on which the composition is applied to obtain a coated body, embedding the coated body into a sealant containing resin and magnetic powder, and applying pressure to the sealant to form a molded body.

Abstract: A surface-mount inductor with a lower-surface electrode structure is provided. In the surface-mount inductor, a winding wire is buried in such a manner as to allow each of terminal ends of the winding wire to be exposed on a respective one of the end surfaces of an element body. An external electrode is provided in the end surfaces, the upper and lower surfaces, and at an end portion of each of the opposed side surfaces of an element body. The element body has an outer periphery coated with an insulating resin, except for at least the lower surface.

Abstract: A high-density impurity diffused layer of an identical conduction type to the semiconductor substrate on which the impurity is doped higher in density than the semiconductor substrate around the diffuse resistance region is provided, one side of the electrodes is formed extending to the high-density impurity diffused layer and the diffused resistance region and the high-density impurity diffused layer are connected in a semiconductor strain gauge that is formed on the surface of the semiconductor substrate of a fixed conduction type and is provided with the diffused resistance region of opposite conduction type to the semiconductor substrate and is provided with electrodes on both ends of the diffused resistance region.

Abstract: A high-density impurity diffused layer of an identical conduction type to the semiconductor substrate on which the impurity is doped higher in density than the semiconductor substrate around the diffuse resistance region is provided, one side of the electrodes is formed extending to the high-density impurity diffused layer and the diffused resistance region and the high-density impurity diffused layer are connected in a semiconductor strain gauge that is formed on the surface of the semiconductor substrate of a fixed conduction type and is provided with the diffused resistance region of opposite conduction type to the semiconductor substrate and is provided with electrodes on both ends of the diffused resistance region.

Abstract: A high-density impurity diffused layer of an identical conduction type to the semiconductor substrate on which the impurity is doped higher in density than the semiconductor substrate around the diffuse resistance region is provided, one side of the electrodes is formed extending to the high-density impurity diffused layer and the diffused resistance region and the high-density impurity diffused layer are connected in a semiconductor strain gauge that is formed on the surface of the semiconductor substrate of a fixed conduction type and is provided with the diffused resistance region of opposite conduction type to the semiconductor substrate and is provided with electrodes on both ends of the diffused resistance region.

Abstract: A high-density impurity diff-used layer of an identical conduction type to the semiconductor substrate on which the impurity is doped higher in density than the semiconductor substrate around the diffuse resistance region is provided, one side of the electrodes is formed extending to the high-density impurity diffused layer and the diffused resistance region and the high-density impurity diff-used layer are connected in a semiconductor strain gauge that is formed on the surface of the semiconductor substrate of a fixed conduction type and is provided with the diffused resistance region of opposite conduction type to the semiconductor substrate and is provided with electrodes on both ends of the diffused resistance region.

Abstract: In an optical pickup apparatus comprising a light source for applying a light beam to an optical memory medium, a beam splitter disposed in the optical path from the light source to the medium to separate the reflected beam from the medium from the beam from the light source, and a photodetector for detecting the separated reflected beam, having a surface opposed to that surface of the beam splitter which faces the photodetector is formed so as to form an angle different from the perpendicular with respect to the optic axis of the separated reflected beam.