Patents by Inventor Koichi Izawa

Koichi Izawa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9761970
    Abstract: A housing is configured to receive a plug that includes an upper face, a lower face, and a front face. The housing also includes a cutout portion that traverses the upper face and the lower face, opens to the front face of the housing, extends for a length of the plug, and is formed in a direction of insertion of the plug. An opening is configured to receive the plug, which is formed on the front face of the housing and connected to the cutout so that a plug is received by the opening. A distance from the upper face to the lower face of the housing is approximately equal to a diameter of the plug.
    Type: Grant
    Filed: November 14, 2014
    Date of Patent: September 12, 2017
    Assignees: Sony Corporation, Sony Mobile Communications Inc.
    Inventors: Koichi Izawa, Kiyohito Masuda
  • Publication number: 20160141779
    Abstract: A housing is configured to receive a plug that includes an upper face, a lower face, and a front face. The housing also includes a cutout portion that traverses the upper face and the lower face, opens to the front face of the housing, extends for a length of the plug, and is formed in a direction of insertion of the plug. An opening is configured to receive the plug, which is formed on the front face of the housing and connected to the cutout so that a plug is received by the opening. A distance from the upper face to the lower face of the housing is approximately equal to a diameter of the plug.
    Type: Application
    Filed: November 14, 2014
    Publication date: May 19, 2016
    Applicant: Sony Corporation
    Inventors: Koichi IZAWA, Kiyohito MASUDA
  • Patent number: 9312709
    Abstract: An apparatus includes a main body having an opening and a movable member configured to hold a plug capable of transmitting an electrical current to an external device. At least one of the movable member and the plug include a magnet. The movable member and the plug are arranged such that at least one connector of the plug extends beyond a plane parallel to the opening when the movable member is in a first state, the first state corresponding to a magnetic force between a ferromagnetic material and the magnet above a predetermined magnitude. The movable member transitions from the first state to a second state when the magnetic force is below the predetermined magnitude. When the movable member is in the second state, the at least one connector of the plug remains below the plane parallel to the opening.
    Type: Grant
    Filed: June 24, 2013
    Date of Patent: April 12, 2016
    Assignee: Sony Corporation
    Inventors: Tsutomu Takahashi, Taro Takamoto, Koichi Izawa, Shintaro Nonaka, Tamio Nishino
  • Patent number: 9083112
    Abstract: The magnetic coupling connector includes: first and second connector main bodies to be coupled with each other; a magnet member disposed in a coupling portion of the first connector main body and a mate-side magnetic material disposed in a coupling portion of the second connector main body, the magnet member in the first connector main body adsorbing onto the mate-side magnetic material in the second connector main body, thereby coupling the connector main bodies together; and a contact terminal disposed in the coupling portion of the first connector main body and a contact terminal disposed in the coupling portion of the second connector main body, the contact terminals being pressed against each other when coupled. In the magnetic coupling connector, the magnet member is held by the first connector main body so as to be allowed to swing.
    Type: Grant
    Filed: February 17, 2014
    Date of Patent: July 14, 2015
    Assignee: SMK Corporation
    Inventors: Kiyoshi Asai, Toshihiko Kato, Koichi Izawa, Shintaro Nonaka, Yutaka Nakaone
  • Publication number: 20140375248
    Abstract: An apparatus includes a main body having an opening and a movable member configured to hold a plug capable of transmitting an electrical current to an external device. At least one of the movable member and the plug include a magnet. The movable member and the plug are arranged such that at least one connector of the plug extends beyond a plane parallel to the opening when the movable member is in a first state, the first state corresponding to a magnetic force between a ferromagnetic material and the magnet above a predetermined magnitude. The movable member transitions from the first state to a second state when the magnetic force is below the predetermined magnitude. When the movable member is in the second state, the at least one connector of the plug remains below the plane parallel to the opening.
    Type: Application
    Filed: June 24, 2013
    Publication date: December 25, 2014
    Inventors: Tsutomu TAKAHASHI, Taro Takamoto, Koichi Izawa, Shintaro Nonaka, Tamio Nishino
  • Publication number: 20140322929
    Abstract: The magnetic coupling connector includes: first and second connector main bodies to be coupled with each other; a magnet member disposed in a coupling portion of the first connector main body and a mate-side magnetic material disposed in a coupling portion of the second connector main body, the magnet member in the first connector main body adsorbing onto the mate-side magnetic material in the second connector main body, thereby coupling the connector main bodies together; and a contact terminal disposed in the coupling portion of the first connector main body and a contact terminal disposed in the coupling portion of the second connector main body, the contact terminals being pressed against each other when coupled. In the magnetic coupling connector, the magnet member is held by the first connector main body so as to be allowed to swing.
    Type: Application
    Filed: February 17, 2014
    Publication date: October 30, 2014
    Applicant: SMK CORPORATION
    Inventors: Kiyoshi ASAI, Toshihiko KATO, Koichi IZAWA, Shintaro NONAKA, Yutaka NAKAONE
  • Patent number: 8853562
    Abstract: An electromagnetic shielding method includes the steps of disposing a flexible electromagnetic shielding film including a laminate of at least an insulating layer and a conductive metal layer to cover a portion to be electromagnetically shielded on a printed wiring board so that the insulating layer faces the printed wiring board, the conductive metal layer having a higher melting temperature than that of the insulating resin layer; and heating the electromagnetic shielding film to a temperature to melt and contract the insulating layer, thereby bonding the conductive metal layer to a grounding conductor of the printed wiring board and electrically connecting the conductive metal layer to the grounding conductor. The heating temperature is higher than the melting temperature of the insulating layer and lower than the melting temperature of the conductive metal layer.
    Type: Grant
    Filed: June 25, 2012
    Date of Patent: October 7, 2014
    Assignees: Sony Corporation, Sony Mobile Communications Inc.
    Inventors: Koichi Izawa, Yumi Ogura
  • Patent number: 8495815
    Abstract: An electromagnetic shielding method includes the steps of disposing a flexible electromagnetic shielding film including a laminate of at least an insulating layer and a conductive metal layer to cover a portion to be electromagnetically shielded on a printed wiring board so that the insulating layer faces the printed wiring board, the conductive metal layer having a higher melting temperature than that of the insulating resin layer; and heating the electromagnetic shielding film to a temperature to melt and contract the insulating layer, thereby bonding the conductive metal layer to a grounding conductor of the printed wiring board and electrically connecting the conductive metal layer to the grounding conductor. The heating temperature is higher than the melting temperature of the insulating layer and lower than the melting temperature of the conductive metal layer.
    Type: Grant
    Filed: May 14, 2010
    Date of Patent: July 30, 2013
    Assignee: Sony Mobile Communications, Inc.
    Inventors: Koichi Izawa, Yumi Ogura
  • Publication number: 20120261181
    Abstract: An electromagnetic shielding method includes the steps of disposing a flexible electromagnetic shielding film including a laminate of at least an insulating layer and a conductive metal layer to cover a portion to be electromagnetically shielded on a printed wiring board so that the insulating layer faces the printed wiring board, the conductive metal layer having a higher melting temperature than that of the insulating resin layer; and heating the electromagnetic shielding film to a temperature to melt and contract the insulating layer, thereby bonding the conductive metal layer to a grounding conductor of the printed wiring board and electrically connecting the conductive metal layer to the grounding conductor. The heating temperature is higher than the melting temperature of the insulating layer and lower than the melting temperature of the conductive metal layer.
    Type: Application
    Filed: June 25, 2012
    Publication date: October 18, 2012
    Inventors: Koichi IZAWA, Yumi Ogura
  • Publication number: 20100294559
    Abstract: An electromagnetic shielding method includes the steps of disposing a flexible electromagnetic shielding film including a laminate of at least an insulating layer and a conductive metal layer to cover a portion to be electromagnetically shielded on a printed wiring board so that the insulating layer faces the printed wiring board, the conductive metal layer having a higher melting temperature than that of the insulating resin layer; and heating the electromagnetic shielding film to a temperature to melt and contract the insulating layer, thereby bonding the conductive metal layer to a grounding conductor of the printed wiring board and electrically connecting the conductive metal layer to the grounding conductor. The heating temperature is higher than the melting temperature of the insulating layer and lower than the melting temperature of the conductive metal layer.
    Type: Application
    Filed: May 14, 2010
    Publication date: November 25, 2010
    Inventors: Koichi IZAWA, Yumi OGURA
  • Publication number: 20090073145
    Abstract: Provided are an input device capable of a variety of operations with a simple configuration, and an electronic apparatus using the same. A rotary operation portion 2 includes ring magnets 4 securely attached at opposite ends of a roller 3, each ring magnet 4 being magnetized with the S- and N-poles alternating at a predetermined angular pitch, and magnetic sensing elements 13 and stationary magnets 7 disposed so as to face their respective ring magnets 4. The rotary operation portion 2 is covered by an operation plate 16 having formed at its center a roller insertion hole 16a for projecting a part of the outer circumferential surface of the roller 3. The rotation of the roller 3 is magnetically sensed, and switches 9 and 11 are provided so as to be turned “ON”/“OFF” in accordance with operations of pressing the roller 3 and rocking the operation plate 16 in the “front”, “back”, “left”, and “right” directions.
    Type: Application
    Filed: August 29, 2008
    Publication date: March 19, 2009
    Inventors: Hiroto Inoue, Tamotsu Yamamoto, Koichi Izawa, Kunihisa Chida