Patents by Inventor Koichi Izumi
Koichi Izumi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11959157Abstract: Provided is a high-Mn steel having excellent low-temperature toughness and excellent surface characteristics. A high-Mn steel comprises: a chemical composition containing, in mass %, C: 0.100 to 0.700%, Si: 0.05 to 1.00%, Mn: 20.0 to 35.0%, P: ?0.030%, S: ?0.0070%, Al: 0.010 to 0.070%, Cr: 0.50 to 5.00%, N: 0.0050 to 0.0500%, O: ?0.0050%, Ti: ?0.005%, and Nb: ?0.005%, with a balance consisting of Fe and inevitable impurities; and a microstructure having austenite as a matrix, wherein in the microstructure, a Mn concentration of a Mn-concentrated portion is 38.0% or less, and an average KAM value is 0.3 or more, yield stress is 400 MPa or more, absorbed energy vE?196 in a Charpy impact test at ?196° C. is 100 J or more, and percent brittle fracture is less than 10%.Type: GrantFiled: July 31, 2019Date of Patent: April 16, 2024Assignee: JFE STEEL CORPORATIONInventors: Daichi Izumi, Shigeki Kitsuya, Keiji Ueda, Koichi Nakashima
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Patent number: 11956314Abstract: A network of a new configuration is flexibly constructed while maintaining a stable operation in the network. A management device includes: a detection unit that detects addition of a function unit to a network including one or a plurality of on-vehicle function units; an acquisition unit that acquires function unit information of a new function unit that is the function unit the addition of which has been detected by the detection unit and function unit information of each on-vehicle function unit, each piece of function unit information including information regarding network configuration of a layer lower than an application layer; and a generation unit that, based on the pieces of function unit information acquired by the acquisition unit, generates configuration information of a new network that is the network further including the new function unit.Type: GrantFiled: October 18, 2019Date of Patent: April 9, 2024Assignees: SUMITOMO ELECTRIC INDUSTRIES, LTD., SUMITOMO WIRING SYSTEMS, LTD., AUTONETWORKS TECHNOLOGIES, LTD.Inventors: Yusuke Yamamoto, Koichi Takayama, Hideyuki Tanaka, Tatsuya Izumi, Junji Yano, Yasuhiro Yabuuchi, Tadashi Matsumoto, Takeshi Hagihara
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Patent number: 11542585Abstract: A method for treating an inner wall surface of a treatment object uses a treatment object that is at least one of a container housing an ozone gas, a treatment container housing an object to be subjected to a surface treatment using an ozone gas and a pipe configured to supply an ozone gas. The method for treating an inner wall surface of a treatment object includes the steps of: determining whether an abnormal part is present in the inner wall surface of the treatment object or not; and distributing an ozone gas having a concentration of 10% by volume or more and 30% by volume or less and a temperature of 60° C. or less such that the ozone gas contacts the inner wall surface of the treatment object after the step of determining whether an abnormal part is present or not.Type: GrantFiled: July 27, 2018Date of Patent: January 3, 2023Assignee: IWATANI CORPORATIONInventors: Koichi Izumi, Masahiro Furutani, Tsuyoshi Yamamoto
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Patent number: 11482455Abstract: A cutting method includes: forming a reformed region in a workpiece; and after forming the reformed region in the workpiece, cutting the workpiece along an intended cut line. In the cutting the workpiece, a dry etching process is performed from a front surface toward a rear surface of the workpiece while the workpiece is fixed on a support member at least under its own weight or by suction, to form a groove from the front surface to reach the rear surface of the workpiece.Type: GrantFiled: July 18, 2018Date of Patent: October 25, 2022Assignees: IWATANI CORPORATION, HAMAMATSU PHOTONICS K.K.Inventors: Toshiki Manabe, Takehiko Senoo, Koichi Izumi, Tadashi Shojo, Takafumi Ogiwara, Takeshi Sakamoto
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Patent number: 11380586Abstract: A cutting method includes: forming a reformed region in a workpiece; and after forming the reformed region in the workpiece, forming a groove in the workpiece along an intended cut line. In the forming a groove, a first dry etching process is performed from a front surface toward a rear surface of the workpiece. After the first dry etching process, a first pressure-reducing process is performed in which the workpiece is placed under an atmosphere of reduced pressure as compared to pressure during the first dry etching process. After the first pressure-reducing process, a second dry etching process is performed from the front surface toward the rear surface of the workpiece.Type: GrantFiled: July 18, 2018Date of Patent: July 5, 2022Assignees: IWATANI CORPORATION, HAMAMATSU PHOTONICS K.K.Inventors: Toshiki Manabe, Takehiko Senoo, Koichi Izumi, Tadashi Shojo, Takafumi Ogiwara, Takeshi Sakamoto
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Publication number: 20220143655Abstract: There is provided a gas cluster processing device for performing a predetermined process on a workpiece by irradiating the workpiece with a gas cluster, including: a processing container in which the workpiece is disposed; a gas supply part configured to supply a gas for generating the gas cluster; a flow rate controller configured to control a flow rate of the gas supplied from the gas supply part; a cluster nozzle configured to receive the gas for generating the gas cluster at a predetermined supply pressure, spray the gas into the processing container maintained in a vacuum state, and convert the gas into the gas cluster through an adiabatic expansion; and a pressure control part provided in a pipe between the flow rate controller and the cluster nozzle and including a back pressure controller configured to control a supply pressure of the gas for generating the gas cluster.Type: ApplicationFiled: January 26, 2022Publication date: May 12, 2022Inventors: Kazuya DOBASHI, Takehiko ORII, Yukimasa SAITO, Kunihiko KOIKE, Takehiko SENOO, Koichi IZUMI, Yu YOSHINO, Tadashi SHOJO, Keita KANEHIRA
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Patent number: 11267021Abstract: There is provided a gas cluster processing device for performing a predetermined process on a workpiece by irradiating the workpiece with a gas cluster, including: a processing container in which the workpiece is disposed; a gas supply part configured to supply a gas for generating the gas cluster; a flow rate controller configured to control a flow rate of the gas supplied from the gas supply part; a cluster nozzle configured to receive the gas for generating the gas cluster at a predetermined supply pressure, spray the gas into the processing container maintained in a vacuum state, and convert the gas into the gas cluster through an adiabatic expansion; and a pressure control part provided in a pipe between the flow rate controller and the cluster nozzle and including a back pressure controller configured to control a supply pressure of the gas for generating the gas cluster.Type: GrantFiled: February 9, 2018Date of Patent: March 8, 2022Assignees: TOKYO ELECTRON LIMITED, IWATANI CORPORATIONInventors: Kazuya Dobashi, Takehiko Orii, Yukimasa Saito, Kunihiko Koike, Takehiko Senoo, Koichi Izumi, Yu Yoshino, Tadashi Shojo, Keita Kanehira
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Patent number: 11130092Abstract: Provided is method for concentrating ozone gas the method including the steps of: allowing ozone gas to be adsorbed onto the adsorbent by introducing ozone gas-containing raw material mixed gas into an adsorption vessel (20) that houses an adsorbent for adsorbing ozone gas; reducing a pressure in a concentration vessel (30) in a state where the concentration vessel (30) does not communicate with the adsorption vessel (20), the concentration vessel (30) being configured to be connected to the adsorption vessel (20) so as to be interswitchable between a state where the concentration vessel (30) communicates with the adsorption vessel (20) and a state where the concentration vessel does not communicate with the adsorption vessel (20); and introducing concentrated mixed gas including ozone gas with a higher ozone gas concentration than the ozone gas concentration in the raw material mixed gas into the concentration vessel (30) by desorbing the ozone gas adsorbed onto the adsorbent using a pressure difference betwType: GrantFiled: March 3, 2017Date of Patent: September 28, 2021Assignee: IWATANI CORPORATIONInventors: Sadaki Nakamura, Koichi Izumi, Naohisa Makihira
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Patent number: 11123679Abstract: Provided is a method for concentrating ozone gas, including the steps of: allowing ozone gas to be adsorbed onto an adsorbent in a first adsorption vessel; reducing pressure in a concentration vessel in a state where the concentration vessel does not communicate with the first adsorption vessel; discharging part of gas in the first adsorption vessel; introducing first concentrated mixed gas in the concentration vessel by desorbing ozone gas in the first concentrated mixed gas and delivering the desorbed ozone gas into the concentration vessel; allowing ozone gas to be adsorbed onto an adsorbent in a second adsorption vessel; and introducing second concentrated mixed gas into the concentration vessel in a state where the concentration vessel into which the first concentrated mixed gas is introduced and the second adsorption vessel that houses an adsorbent. Also provided is an apparatus for concentrating ozone gas for implementing the method.Type: GrantFiled: March 3, 2017Date of Patent: September 21, 2021Assignee: IWATANI CORPORATIONInventors: Sadaki Nakamura, Koichi Izumi, Naohisa Makihira
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Publication number: 20210107041Abstract: There is provided a gas cluster processing device for performing a predetermined process on a workpiece by irradiating the workpiece with a gas cluster, including: a processing container in which the workpiece is disposed; a gas supply part configured to supply a gas for generating the gas cluster; a flow rate controller configured to control a flow rate of the gas supplied from the gas supply part; a cluster nozzle configured to receive the gas for generating the gas cluster at a predetermined supply pressure, spray the gas into the processing container maintained in a vacuum state, and convert the gas into the gas cluster through an adiabatic expansion; and a pressure control part provided in a pipe between the flow rate controller and the cluster nozzle and including a back pressure controller configured to control a supply pressure of the gas for generating the gas cluster.Type: ApplicationFiled: February 9, 2018Publication date: April 15, 2021Inventors: Kazuya DOBASHI, Takehiko ORII, Yukimasa SAITO, Kunihiko KOIKE, Takehiko SENOO, Koichi IZUMI, Yu YOSHINO, Tadashi SHOJO, Keita KANEHIRA
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Publication number: 20200365460Abstract: A cutting method includes: forming a reformed region in a workpiece; and after forming the reformed region in the workpiece, forming a groove in the workpiece along an intended cut line. In the forming a groove, a first dry etching process is performed from a front surface toward a rear surface of the workpiece. After the first dry etching process, a first pressure-reducing process is performed in which the workpiece is placed under an atmosphere of reduced pressure as compared to pressure during the first dry etching process. After the first pressure-reducing process, a second dry etching process is performed from the front surface toward the rear surface of the workpiece.Type: ApplicationFiled: July 18, 2018Publication date: November 19, 2020Applicants: Iwatani Corporation, Hamamatsu Photonics K.K.Inventors: Toshiki MANABE, Takehiko SENOO, Koichi IZUMI, Tadashi SHOJO, Takafumi OGIWARA, Takeshi SAKAMOTO
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Publication number: 20200365461Abstract: A cutting method includes: forming a reformed region in a workpiece; and after forming the reformed region in the workpiece, cutting the workpiece along an intended cut line. In the cutting the workpiece, a dry etching process is performed from a front surface toward a rear surface of the workpiece while the workpiece is fixed on a support member at least under its own weight or by suction, to form a groove from the front surface to reach the rear surface of the workpiece.Type: ApplicationFiled: July 18, 2018Publication date: November 19, 2020Applicants: IWATANI CORPORATION, HAMAMATSU PHOTONICS K.K.Inventors: Toshiki MANABE, Takehiko SENOO, Koichi IZUMI, Tadashi SHOJO, Takafumi OGIWARA, Takeshi SAKAMOTO
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Publication number: 20200239995Abstract: A method for treating an inner wall surface of a treatment object uses a treatment object that is at least one of a container housing an ozone gas, a treatment container housing an object to be subjected to a surface treatment using an ozone gas and a pipe configured to supply an ozone gas. The method for treating an inner wall surface of a treatment object includes the steps of: determining whether an abnormal part is present in the inner wall surface of the treatment object or not; and distributing an ozone gas having a concentration of 10% by volume or more and 30% by volume or less and a temperature of 60° C. or less such that the ozone gas contacts the inner wall surface of the treatment object before the step of determining whether an abnormal part is present or not.Type: ApplicationFiled: July 27, 2018Publication date: July 30, 2020Applicant: IWATANI CORPORATIONInventors: Koichi IZUMI, Masahiro FURUTANI, Tsuyoshi YAMAMOTO
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Patent number: 10597296Abstract: A method for supplying an ozone gas includes the steps of: supplying an ozone gas from an ozone gas source through a second channel; and switching the ozone gas to a state where the ozone gas is supplied through a first channel and supplying the ozone gas having a reduced concentration of nitrogen oxide. The step of supplying the ozone gas through the second channel includes the step of introducing a part of the ozone gas to a first vessel so that ozone adsorbability of a first adsorbent is reduced. In the step of supplying the ozone gas to the object through the first channel, the ozone gas passes through the first vessel holding the first adsorbent having reduced ozone adsorbability.Type: GrantFiled: June 29, 2016Date of Patent: March 24, 2020Assignee: IWATANI CORPORATIONInventors: Naohisa Makihira, Koichi Izumi, Masahiro Furutani
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Publication number: 20190126191Abstract: Provided is a method for concentrating ozone gas, including the steps of: allowing ozone gas to be adsorbed onto an adsorbent in a first adsorption vessel; reducing pressure in a concentration vessel in a state where the concentration vessel does not communicate with the first adsorption vessel; discharging part of gas in the first adsorption vessel; introducing first concentrated mixed gas in the concentration vessel by desorbing ozone gas in the first concentrated mixed gas and delivering the desorbed ozone gas into the concentration vessel; allowing ozone gas to be adsorbed onto an adsorbent in a second adsorption vessel; and introducing second concentrated mixed gas into the concentration vessel in a state where the concentration vessel into which the first concentrated mixed gas is introduced and the second adsorption vessel that houses an adsorbent. Also provided is an apparatus for concentrating ozone gas for implementing the method.Type: ApplicationFiled: March 3, 2017Publication date: May 2, 2019Applicant: IWATANI CORPORATIONInventors: Sadaki NAKAMURA, Koichi IZUMI, Naohisa MAKIHIRA
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Publication number: 20190111379Abstract: Provided is method for concentrating ozone gas the method including the steps of: allowing ozone gas to be adsorbed onto the adsorbent by introducing ozone gas-containing raw material mixed gas into an adsorption vessel (20) that houses an adsorbent for adsorbing ozone gas; reducing a pressure in a concentration vessel (30) in a state where the concentration vessel (30) does not communicate with the adsorption vessel (20), the concentration vessel (30) being configured to be connected to the adsorption vessel (20) so as to be interswitchable between a state where the concentration vessel (30) communicates with the adsorption vessel (20) and a state where the concentration vessel does not communicate with the adsorption vessel (20); and introducing concentrated mixed gas including ozone gas with a higher ozone gas concentration than the ozone gas concentration in the raw material mixed gas into the concentration vessel (30) by desorbing the ozone gas adsorbed onto the adsorbent using a pressure difference betwType: ApplicationFiled: March 3, 2017Publication date: April 18, 2019Applicant: IWATANI CORPORATIONInventors: Sadaki NAKAMURA, Koichi IZUMI, Naohisa MAKIHIRA
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Publication number: 20180257934Abstract: A method for supplying an ozone gas includes the steps of: supplying an ozone gas from an ozone gas source through a second channel; and switching the ozone gas to a state where the ozone gas is supplied through a first channel and supplying the ozone gas having a reduced concentration of nitrogen oxide. The step of supplying the ozone gas through the second channel includes the step of introducing a part of the ozone gas to a first vessel so that ozone adsorbability of a first adsorbent is reduced. In the step of supplying the ozone gas to the object through the first channel, the ozone gas passes through the first vessel holding the first adsorbent having reduced ozone adsorbability.Type: ApplicationFiled: June 29, 2016Publication date: September 13, 2018Applicant: IWATANI CORPORATIONInventors: Naohisa MAKIHIRA, Koichi IZUMI, Masahiro FURUTANI
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Patent number: 9425071Abstract: A film forming method for obtaining a thin film by laminating molecular layers of oxide on a surface of a substrate in a vacuum atmosphere includes performing a cycle a plurality of times. The cycle includes: supplying a source gas containing a source to the substrate in a vacuum vessel to adsorb the source onto the substrate; forming an ozone atmosphere containing ozone having a concentration not less than that where a chain decomposition reaction is caused in the vacuum vessel; and forcibly decomposing the ozone by supplying energy to the ozone atmosphere to generate active species of oxygen, and oxidizing the source adsorbed onto the surface of the substrate by the active species to obtain the oxide.Type: GrantFiled: April 28, 2015Date of Patent: August 23, 2016Assignees: TOKYO ELECTRON LIMITED, IWATANI CORPORATIONInventors: Kazuo Yabe, Akira Shimizu, Koichi Izumi, Masahiro Furutani
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Publication number: 20150318170Abstract: A film forming method for obtaining a thin film by laminating molecular layers of oxide on a surface of a substrate in a vacuum atmosphere includes performing a cycle a plurality of times. The cycle includes: supplying a source gas containing a source to the substrate in a vacuum vessel to adsorb the source onto the substrate; forming an ozone atmosphere containing ozone having a concentration not less than that where a chain decomposition reaction is caused in the vacuum vessel; and forcibly decomposing the ozone by supplying energy to the ozone atmosphere to generate active species of oxygen, and oxidizing the source adsorbed onto the surface of the substrate by the active species to obtain the oxide.Type: ApplicationFiled: April 28, 2015Publication date: November 5, 2015Inventors: Kazuo YABE, Akira SHIMIZU, Koichi IZUMI, Masahiro FURUTANI
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Patent number: 9080131Abstract: The disclosed device and method produce high concentration ozonated water by connecting a high concentration ozone gas-supplying system that comprises an ozone gas-generating unit (1) for forming ozone gas, an ozone gas-concentrating unit (2) for concentrating the ozone gas formed, a concentrated ozone gas-pressurizing unit (3) for pressurizing the concentrated ozone gas output from the ozone gas-concentrating unit (2), and a cooling mechanism (13) for cooling the concentrated ozone gas-pressurizing unit (3), to an ozone gas-dissolving unit (4) to dissolve the high pressure, concentrated ozone gas in pure water and produce the high concentration ozonated water.Type: GrantFiled: November 25, 2010Date of Patent: July 14, 2015Assignees: SHARP KABUSHIKI KAISHA, IWATANI CORPORATIONInventors: Kunihiko Koike, Sadaki Nakamura, Naohisa Makihira, Koichi Izumi, Goichi Inoue, Norikazu Hohshi, Takashi Minamihonoki