Patents by Inventor Koichi Izumida

Koichi Izumida has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20090173770
    Abstract: Wire burst faults at the time of solder attachment of conductors of an electronic component using insulation coated conductors having a core of copper or alloy containing alloy, is prevented. Solder attachment of connecting portions of insulation coated conductors having copper as a base material is carried out by melting lead-free solder alloy containing from 5.3 to 7.0 wt % copper (Cu), from 0.1 to less than 0.5 wt % nickel (Ni), with a remainder being tin (Sn), at a temperature ranging from 400° C. to 480° C.
    Type: Application
    Filed: February 17, 2009
    Publication date: July 9, 2009
    Inventors: Koichi Izumida, Yuki Takano, Hitoshi Abe, Toshiyuki Moribayashi, Koichi Hagio, Junichi Takenaka
  • Patent number: 7005106
    Abstract: Prevented is disconnection, and generation of the bridging effect which causes short circuits between terminals, when electric wire having an insulating coating and terminals are soldered together, in electronic components which are constituted using electric wire having an insulating coating, the core wire thereof being copper or a copper alloy, and in which electronic components distances between neighboring terminals are narrow. Electric wire having an insulating coating, the base metal of which is copper, and terminal portions (connection portions) are soldered together by means of a lead-free solder alloy, which contains 3.0 to 5.5 wt % copper (Cu); 0.1 to 0.5 wt % nickel (Ni); and 0.001 to 0.1 wt % germanium (Ge), the remainder of the solder alloy consisting of tin (Sn).
    Type: Grant
    Filed: August 30, 2001
    Date of Patent: February 28, 2006
    Assignees: Sumida Corporation, Nihon Genma Mfg. Co., Ltd.
    Inventors: Koichi Izumida, Yuki Takano, Hitoshi Abe, Toshiyuki Moribayashi, Koichi Hagio, Junichi Takenaka
  • Publication number: 20060024194
    Abstract: Wire burst faults at the time of solder attachment of conductors of an electronic component using insulation coated conductors having a core of copper or alloy containing alloy, is prevented. Solder attachment of connecting portions of insulation coated conductors having copper as a base material is carried out by melting lead-free solder alloy containing from 5.3 to 7.0 wt % copper (Cu), from 0.1 to less than 0.5 wt % nickel (Ni), with a remainder being tin (Sn), at a temperature ranging from 400° C. to 480° C.
    Type: Application
    Filed: September 29, 2005
    Publication date: February 2, 2006
    Inventors: Koichi Izumida, Yuki Takano, Hitoshi Abe, Toshiyuki Moribayashi, Koichi Hagio, Junichi Takenaka
  • Publication number: 20040126270
    Abstract: Prevented is disconnection, and generation of the bridging effect which causes short circuits between terminals, when electric wire having an insulating coating and terminals are soldered together, in electronic components which are constituted using electric wire having an insulating coating, the core wire thereof being copper or a copper alloy, and in which electronic components distances between neighboring terminals are narrow.
    Type: Application
    Filed: June 3, 2003
    Publication date: July 1, 2004
    Inventors: Koichi Izumida, Yuki Takano, Hitoshi Abe, Toshiyuki Moribayashi, Koichi Hagio, Junichi Takenaka
  • Publication number: 20030091463
    Abstract: Wire burst faults at the time of solder attachment of conductors of an electronic component using insulation coated conductors having a core of copper or alloy containing alloy, is prevented.
    Type: Application
    Filed: October 25, 2002
    Publication date: May 15, 2003
    Inventors: Koichi Izumida, Yuki Takano, Hitoshi Abe, Toshiyuki Moribayashi, Koichi Hagio, Junichi Takenaka