Patents by Inventor Koichi Kamikuri

Koichi Kamikuri has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device and semiconductor device structure
    Patent number: 6563206
    Abstract: The present invention provides a semiconductor device bonded to a wiring board in a flip-chip bonding manner, wherein bumps for the flip-chip bonding are formed on a front surface of the semiconductor element, and a wiring pattern to which bumps and bonding wires for another semiconductor element are connected is formed on a back surface of the semiconductor element. The present invention also provides a semiconductor device structure including a first semiconductor element and a second semiconductor element sequentially stacked in multi-stages on a wiring board by flip-chip bonding, wherein a wiring pattern of the first semiconductor element is bonded to segments of wiring formed on the wiring board by means of bonding wires. With this configuration, it is possible to realize a thin semiconductor device of a stacked structure including a plurality of semiconductor elements mounted at a higher density and hence to miniaturize an electronic device using the semiconductor device.
    Type: Grant
    Filed: January 10, 2002
    Date of Patent: May 13, 2003
    Assignee: Sony Corporation
    Inventors: Koichi Kamikuri, Hitoshi Shibue
  • Semiconductor device and semiconductor device structure
    Publication number: 20020096784
    Abstract: The present invention provides a semiconductor device bonded to a wiring board in a flip-chip bonding manner, wherein bumps for the flip-chip bonding are formed on a front surface of the semiconductor element, and a wiring pattern to which bumps and bonding wires for another semiconductor element are connected is formed on a back surface of the semiconductor element. The present invention also provides a semiconductor device structure including a first semiconductor element and a second semiconductor element sequentially stacked in multi-stages on a wiring board by flip-chip bonding, wherein a wiring pattern of the first semiconductor element is bonded to segments of wiring formed on the wiring board by means of bonding wires. With this configuration, it is possible to realize a thin semiconductor device of a stacked structure including a plurality of semiconductor elements mounted at a higher density and hence to miniaturize an electronic device using the semiconductor device.
    Type: Application
    Filed: January 10, 2002
    Publication date: July 25, 2002
    Inventors: Koichi Kamikuri, Hitoshi Shibue