Abstract: An acoustic wave device includes a resonator formed on one surface of a device chip; a support layer formed so as to surround the resonator on the one surface; a cover layer formed on the support layer and cooperating with the device chip and the support layer to form a cavity for hermetically sealing the resonator; and the cover layer on the one cavity is curved so that a forming side of the resonator is a curved inner side.

Abstract: An image capturing apparatus performs generating metadata related to capturing by an image capture element for each video frame of the video, and outputting a video frame to which the generated metadata has been added, wherein the generated metadata includes information indicating a delay amount based on a difference between a video frame that the generated metadata corresponds to and a video frame that is outputted after the generated metadata is added thereto in the outputting.

Abstract: An image capturing apparatus to which a lens unit can be attached, is provided that includes an image sensor; a power supply that supplies power; and one or more processors and/or circuitry which functions as: a determination unit that determines whether or not to supply power to the lens unit based on at least one predetermined condition that includes at least one condition relating to power consumption of the lens unit; and a control unit that performs control so as not to supply actuation power to the lens unit according to a determination result by the determination unit, wherein the image sensor is capable of performing shooting even after the control unit performs control so as not to supply actuation power to the lens unit.

Abstract: A module includes a package substrate, an elastic wave device mounted on the package substrate, the elastic wave device includes a first main surface having a functional element, the first main surface faces the package substrate, a semiconductor device mounted on the package substrate, and a resin made from a single material, the resin covers the elastic wave device while leaving an air gap between the package substrate and the functional element, and the resin covers the semiconductor device while filling a space between the package substrate and the semiconductor device.

Abstract: The invention includes one or more LED elements, a silicon substrate on which the LED elements are mounted via micro bumps and internally formed wiring is connected to the micro bumps, a heat insulation organic substrate which is stuck to the opposite side of the LED elements-mounting side of the silicon substrate and has through-holes in which the wiring goes through, a chip-mounting substrate which is stuck to the opposite side of the silicon substrate side of the heat insulation organic substrate and internally formed wiring is connected to wiring in the through-holes of the heat insulation organic substrate, and an LED control circuit chip which is connected to the wiring of the chip-mounting substrate via micro bumps, and mounted via the micro bumps on the opposite side of the heat insulation organic substrate side of the chip-mounting substrate.

Abstract: A method of manufacturing a semiconductor mounting board includes providing a base member and linear conductive members formed of metallic wires. The conductive members are constructed so that they extend linearly between a semiconductor element-mounting face and a circuit board-mounting face of a base member, and are integrally molded within the base member. For this purpose, a resin material for forming the base member is injected into a mold wherein the conductive members are linearly arranged beforehand.

Abstract: A method of manufacturing a semiconductor mounting board includes providing a base member and linear conductive members formed of metallic wires. The conductive members are constructed so that they extend linearly between a semiconductor element-mounting face and a circuit board-mounting face of a base member, and are integrally molded within the base member. For this purpose, a resin material for forming the base member is injected into a mold wherein the conductive members are linearly arranged beforehand.

Abstract: The invention provides a design evaluating method for assisting circuit-board-assembly, as well as an evaluation apparatus, for realizing high-quality, low-cost assembly by numerically evaluating any difference between targeted circuit design and actually performed circuit design, and further provides a recording medium having recorded thereon programs for executing the design evaluating method for assisting circuit-board-assembly. Concretely, an evaluation executing unit is provided and, after reading design evaluation programs from recording media on which the design evaluating programs have been recorded and prior to engineering-trial manufacture of a component-mounted-circuit board mounted components on the circuit board, at least one of a first design evaluation and a second design evaluation is executed. Accordingly, it is enabled to evaluate the appropriateness of a present circuit design before the engineering-trial manufacture, and thus high-quality, low-cost assembly can be realized.

Abstract: An IC chip (2) can be provided to a pre-mount process while being held on a tape-shaped supporting member (5), without being taken out of the tape-shaped supporting member (5).

Abstract: A semiconductor mounting board include a base member and linear conductive members formed of metallic wires. The conductive members are constructed so that they extend linearly between a semiconductor element-mounting face and a circuit board-mounting face of a base member, and are integrally molded within the base member. For this purpose, a resin material for forming the base member is injected into a mold wherein the conductive members are linearly arranged beforehand.

Abstract: Conductive members formed of metallic wires constructed so that they extend linearly between a semiconductor element-mounting face and a circuit board-mounting face of a base member are integrally molded with the base member. For this purpose, a resin material for forming the base member is injected into a mold wherein the conductive members are linearly arranged beforehand.

Abstract: A parts-packaging substrate comprising a metal wiring plate having a mask coated on its surface with several openings. This structure eliminates the need for a thick base formed of an insulating body and a resist layer required in prior art substrates. By bending a terminal of the metal wiring plate to form a connecting terminal, a connector used to connect to another substrate can be eliminated, reducing the cost of manufacture.

Abstract: An electrode terminal (5) provided on a surface of a semiconductor chip (4) has a square shape in plane view. Further, the projecting apex portion (8a) of a bump (8) provided on the electrode terminal (5) orients to a corner portion (5a) of the electrode terminal (5). Hereupon, a gold ball (2a) formed by melting the lower end portion of a gold wire (2) supplied through a capillary (1) is joined to the electrode terminal (5), and then the capillary (1) is moved in the direction of a diagonal line of the square electrode (5). Thus, the main portion of the gold wire (2) is separated from the gold ball (2a) so that the bump (8) is formed.

Abstract: An atmospheric oven containing an atmospheric gas kept at a predetermined purity accommodates a transport for transporting an object to be heated along a predetermined transporting path. A rectangular sectioned tubular body for preventing the gas from flowing outside the oven extends a certain length from an entrance of the oven and an exit of the oven and has a sectional area necessary for passing the object through the tubular body.

Abstract: An atmospheric oven containing an atmospheric gas kept at a predetermined purity and accommodates a transporting means for transport an object to be heated along a predetermined transporting path. A includes a cylindrical portion for preventing the gas from flowing outside the oven, extends in a certain length from an entrance of the oven and an exit of the oven and has a sectional area necessary for passing the object through the portion.

Abstract: A resin circuit substrate includes: a plurality of electronic parts having electrodes to be electrically connected to each other, with surfaces of the electrodes being disposed flush with each other; a resin for integrally molding surfaces of the electronic parts other than the surfaces of the electrodes so that the electronic parts are retained with the resin; and a circuit pattern for electrically connecting the electrodes to each other, the circuit pattern being laminated on exposed surfaces of the electrodes.

Abstract: A film material for the manufacture of a film carrier has a lead pattern including an outer lead portion formed independent of the electrode arrangement of a semiconductor chip to be mounted on the film carrier, and an inner lead formation portion a part of which is selectively removable in accordance with the electrode arrangement of the semiconductor chip to be mounted thereon, the inner lead formation portion being contiguous and connected to respective leads of the outer lead portion.

Abstract: A multilayer ceramic substrate comprises plural conductive layers and insulation layer for insulating the plural conductive layers, and the insulation layer is made of an inorganic composition comprising at least one member selected from the group of Al.sub.2 O.sub.3 and ZrO.sub.2, SiO.sub.2, PbO, and at least one member selected from the group of BaO, CaO and ZnO in predetermined range. The multilayer ceramic substrate can be sintered at low temperature in the air and is splendid in a heat resistance, a solderability and resistance value of the insulation layer and furthermore, a microcrack is not caused in a laser trimming of a top resistance film.