Patents by Inventor Koichi KUNIMOTO

Koichi KUNIMOTO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • WAFER GRINDING METHOD
    Publication number: 20240335918
    Abstract: A wafer grinding method for grinding, by a grindstone, a reverse side of a wafer formed on a face side thereof with devices includes a protective member forming step of covering a whole area of the face side of the wafer with a protective member, a holding step of holding the wafer by a chuck table with the protective member therebetween, and a grinding step of grinding the reverse side of the wafer by the grindstone while supplying grinding water containing a surfactant to the grindstone and the wafer.
    Type: Application
    Filed: March 27, 2024
    Publication date: October 10, 2024
    Inventors: Kenji TAKENOUCHI, Mitsutane KOKUBU, Masayoshi TERAMOTO, Koichi KUNIMOTO