Abstract: A displacement sensor includes a plurality of conductive members, a semiconductor device, and a nonmagnetic conductor electrically connecting one of the conductive members and one of a low electric potential side and a high electric potential side of a power supply of the semiconductor device. The conductive member is electrically connected with the semiconductor device through a nonmagnetic conductor.

Abstract: A rotation angle sensor includes a rotatable magnet, at least one yoke located at a position to confront a magnetic pole, and a magnetic sensing device to sense magnetic flux density varying in accordance with a confronting area between the yoke and the magnet. The yoke is electrically connected with the magnetic sensing device through a nonmagnetic conductor.

Abstract: A displacement sensor includes a plurality of conductive members, a semiconductor device, and a nonmagnetic conductor electrically connecting one of the conductive members and one of a low electric potential side and a high electric potential side of a power supply of the semiconductor device. The conductive member is electrically connected with the semiconductor device through a nonmagnetic conductor.

Abstract: A bonding pad for outputting an output of a piezoresistive element to an integrated circuit is disposed on one side of a sensor substrate, and the sensor substrate is adhered to a package at only a rear side of the bonding pad.

Abstract: A rotation angle sensor includes a rotatable magnet, at least one yoke located at a position to confront a magnetic pole, and a magnetic sensing device to sense magnetic flux density varying in accordance with a confronting area between the yoke and the magnet. The yoke is electrically connected with the magnetic sensing device through a nonmagnetic conductor.

Abstract: A sensing device of the present invention includes a first resistive branch having first and second resistors connected in series, a second resistive branch comprising third and fourth resistors connected in series and arranged in parallel with the first resistive branch to form a bridge circuit, first and second feed wiring arrangements connecting the first and second resistive branches to a power source side, respectively, in parallel to each other, and a ground wiring arrangement connecting the first and second resistive branches to a ground side.

Abstract: In a pressure sensor in which a frame shaped protruding potion is formed on a surface side of a substrate by means of an etching process, and a blocking plate is connected to an upper part of the protruding portion, to form a standard pressure chamber, a recess is formed on at least one of the substrate and the blocking plate that constitute the standard pressure chamber, to increase the height of the standard pressure chamber, thereby preventing the lowering of pressure detection accuracy due to foreign substances within the standard pressure chamber.

Abstract: A bonding pad for outputting an output of a piezoresistive element to an integrated circuit is disposed on one side of a sensor substrate, and the sensor substrate is adhered to a package at only a rear side of the bonding pad.

Abstract: In a pressure sensor in which a frame shaped protruding potion is formed on a surface side of a substrate by means of an etching process, and a blocking plate is connected to an upper part of the protruding portion, to form a standard pressure chamber, a recess is formed on at least one of the substrate and the blocking plate that constitute the standard pressure chamber, to increase the height of the standard pressure chamber, thereby preventing the lowering of pressure detection accuracy due to foreign substances within the standard pressure chamber.

Abstract: A sensing device of the present invention comprises a first resistive branch comprising first and second resistors connected in series, a second resistive branch comprising third and fourth resistors connected in series and arranged in parallel with the first resistive branch to form a bridge circuit, first and second feed wiring arrangements connecting the first and second resistive branches to a power source side, respectively, in parallel to each other, and a ground wiring arrangement connecting the first and second resistive branches to a ground side.

Abstract: A pressure sensor including a substrate having a diaphragm portion. A diaphragm-defining recess is recessed inwardly from one surface of the substrate to define the diaphragm portion between a bottom surface of the recess and an opposite surface of the substrate. A recess is disposed within the diaphragm portion. A pressure sensitive arrangement is disposed in the substrate, a detector portion of which is disposed within the recess formed within the diaphragm portion.

Abstract: A semiconductor device and a method of manufacturing the same are provided which comprises a metal interconnection consisting of a titanium-aluminum film with (111) orientation formed on a semiconductor substrate via an insulating film, and an aluminum film or an aluminum alloy film with (111) orientation formed on the titanium-aluminum film by virtue of epitaxial growth. With such structure, electromigration endurance of an aluminum interconnection is improved and a wiring structure of a semiconductor is achieved with high reliability.