Patents by Inventor Koichi Miyashita
Koichi Miyashita has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11823877Abstract: According to one embodiment of the present disclosure, there is provided a substrate processing system for processing a plurality of substrates including: a processor configured to perform a process on the substrate; a transport device configured to repeatedly transport the plurality of substrates with respect to the processor; and a controller configured to control the process of the substrate in the processor, wherein the controller is configured to: execute the process based on a process recipe, which is a control program for executing the process; and set an offset time, which is a function corresponding to a number of the substrates processed by the processor or a function corresponding to a parameter equivalent to the number of the processed substrates, with respect to a step time for a step of the process recipe.Type: GrantFiled: March 22, 2021Date of Patent: November 21, 2023Assignee: Tokyo Electron LimitedInventors: Koichi Miyashita, Makoto Horikawa, Satoshi Gomi
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Publication number: 20230230862Abstract: A substrate transport method is employed in a substrate processing system including a plurality of processing chambers, a load lock chamber, a vacuum transport device provided in a vacuum transport chamber connecting the load lock chamber and the plurality of processing chambers and configured to simultaneously transport a plurality of substrates, and an atmospheric transport device provided in an atmospheric transport chamber and configured to transport a substrate from a carrier to the load lock chamber. The substrate transport method includes acquiring in advance a relative positional error for a case where the plurality of substrates are transported from the load lock chamber to the plurality of processing chambers and placed on a stage in the plurality of processing chambers, and placing the plurality of substrates on a stage in the load lock chamber, based on a transport path of the plurality of substrates and the relative positional error.Type: ApplicationFiled: January 12, 2023Publication date: July 20, 2023Inventors: Kiyoshi SUZUKI, Hiroshi HIROSE, Ryota GOTO, Koichi MIYASHITA
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Publication number: 20230135618Abstract: A substrate processing method includes: a step of preparing a substrate in a chamber of a substrate processing apparatus; a step of correcting a set power value based on a correction value Y from Equation (1), coefficients A, B, C, and D, and a variable X indicating a processed amount of the substrates having been subjected to continuous film formation processes, referring to a storage in which the coefficients A, B, C, and D of the Equation (1) used to calculate the correction value Y for the set power value are stored; and a step of processing the prepared substrate by applying power with the corrected power value into the chamber, the Equation (1) is expressed as Y=Aexp(BX)+CX+D, where at least one of the coefficients A, C, and D is not zero, and when the coefficient A is not zero, the coefficient B is also not zero.Type: ApplicationFiled: March 12, 2021Publication date: May 4, 2023Inventors: Hiroshi HIROSE, Masaomi KOBE, Koichi MIYASHITA, Takafumi NOGAMI, Kenichi KOTE, Kouji IIHOSHI
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Patent number: 11276592Abstract: A processing apparatus for processing a substrate includes: a plurality of end devices; a low-level controller configured to control specific end devices among the plurality of end devices; and a module controller configured to execute a recipe for processing the substrate, to specify control steps satisfying a specific condition among a plurality of control steps of the recipe, and to transmit the specified control steps to the low-level controller, wherein the low-level controller controls the specific end devices based on the control steps received from the module controller.Type: GrantFiled: April 2, 2020Date of Patent: March 15, 2022Assignee: TOKYO ELECTRON LIMITEDInventors: Katsuhito Hirose, Koichi Miyashita, Hiroshi Hirose, Satoshi Gomi, Yasunori Kumagai, Takashi Yoshiyama
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Publication number: 20210305029Abstract: According to one embodiment of the present disclosure, there is provided a substrate processing system for processing a plurality of substrates including: a processor configured to perform a process on the substrate; a transport device configured to repeatedly transport the plurality of substrates with respect to the processor; and a controller configured to control the process of the substrate in the processor, wherein the controller is configured to: execute the process based on a process recipe, which is a control program for executing the process; and set an offset time, which is a function corresponding to a number of the substrates processed by the processor or a function corresponding to a parameter equivalent to the number of the processed substrates, with respect to a step time for a step of the process recipe.Type: ApplicationFiled: March 22, 2021Publication date: September 30, 2021Inventors: Koichi MIYASHITA, Makoto HORIKAWA, Satoshi GOMI
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Publication number: 20200328100Abstract: A processing apparatus for processing a substrate includes: a plurality of end devices; a low-level controller configured to control specific end devices among the plurality of end devices; and a module controller configured to execute a recipe for processing the substrate, to specify control steps satisfying a specific condition among a plurality of control steps of the recipe, and to transmit the specified control steps to the low-level controller, wherein the low-level controller controls the specific end devices based on the control steps received from the module controller.Type: ApplicationFiled: April 2, 2020Publication date: October 15, 2020Inventors: Katsuhito HIROSE, Koichi MIYASHITA, Hiroshi HIROSE, Satoshi GOMI, Yasunori KUMAGAI, Takashi YOSHIYAMA
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Patent number: 9223305Abstract: A semiconductor manufacturing system includes circuitry configured to execute: displaying a screen for selecting an inspection set including inspection items having a manipulation item and/or a check item; retrieving the inspection items, arranging the inspection items in the order of workflow, and displaying each inspection item on a screen with an execution attribute indicating whether each inspection item is “automatic” or “manual” execution; receiving an inspection start command and reading the first inspection item from a storage unit. The circuitry also executes steps corresponding to the following cases (a) to (d) until there are no more inspection items: (a) the read-out inspection item being the manipulation item and “automatic”; (b) the read-out inspection item being the manipulation item and “manual”; (c) the read-out inspection item being the check item and “automatic”; and (d) the read-out inspection item being the check item and “manual”.Type: GrantFiled: September 14, 2012Date of Patent: December 29, 2015Assignee: TOKYO ELECTRON LIMITEDInventors: Gaku Ikeda, Koichi Miyashita, Takamasa Chikuma, Satoshi Gomi, Chunmui Li, Kunio Takano
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Patent number: 8896111Abstract: In one embodiment, a semiconductor device includes a first semiconductor chip disposed on a circuit board, an adhesive layer fixing the first semiconductor chip to the circuit board, and a second semiconductor chip having an outer shape smaller than that of the first semiconductor chip. At least a part of the second semiconductor chip is embedded in the adhesive layer. The adhesive layer has a thickness in a range of 95 to 150 ?m. The adhesive layer includes a cured product of a thermosetting resin whose thermal time viscosity at a time that the second semiconductor chip is embedded is in a range of 500 to 5000 Pa·s.Type: GrantFiled: March 12, 2013Date of Patent: November 25, 2014Assignee: Kabushiki Kaisha ToshibaInventors: Akira Tanimoto, Takashi Imoto, Yoriyasu Ando, Masashi Noda, Naoki Iwamasa, Koichi Miyashita, Masatoshi Kawato, Masaji Iwamoto, Jun Tanaka, Yusuke Dohmae
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Publication number: 20140070428Abstract: In one embodiment, a semiconductor device includes a first semiconductor chip disposed on a circuit board, an adhesive layer fixing the first semiconductor chip to the circuit board, and a second semiconductor chip having an outer shape smaller than that of the first semiconductor chip. At least a part of the second semiconductor chip is embedded in the adhesive layer. The adhesive layer has a thickness in a range of 95 to 150 ?m. The adhesive layer includes a cured product of a thermosetting resin whose thermal time viscosity at a time that the second semiconductor chip is embedded is in a range of 500 to 5000 Pa·s.Type: ApplicationFiled: March 12, 2013Publication date: March 13, 2014Applicant: Kabushiki Kaisha ToshibaInventors: Akira TANIMOTO, Takashi Imoto, Yoriyasu Ando, Masashi Noda, Naoki Iwamasa, Koichi Miyashita, Masatoshi Kawato, Masaji Iwamoto, Jun Tanaka, Yusuek Dohmae
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Patent number: 8581153Abstract: A method of detecting an abnormal placement of a substrate W, which is carried out when a substrate W placed on a substrate table 3, in which a heater 6a, 6b is disposed, is processed by heating. The method of detecting an abnormal placement of the substrate comprises the steps of: during processing of the substrate W, based on information about an electric output to the heater 6a, 6b or information about a measured temperature of the substrate table 3, detecting of a maximum value and a minimum value of the electric output or the measured temperature, or an integrated value of the electric output or the measured temperature; and judging of the abnormal placement of the substrate based on the maximum value and the minimum value detected, or the integrated value detected.Type: GrantFiled: September 25, 2009Date of Patent: November 12, 2013Assignee: Tokyo Electron LimitedInventors: Takashi Chino, Satoshi Gomi, Koichi Miyashita, Minoru Nagasawa, Yoshie Eda
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Publication number: 20130062758Abstract: In one embodiment, a semiconductor device has a substrate, a first semiconductor chip, an electrode, a first and second connection member, and a first and second sealing member. The electrode is disposed on the first semiconductor chip and contains Al. The first connection member electrically connects the electrode and the substrate and contains Au or Cu. The first sealing member seals the first semiconductor chip and the first connection member. One or more second semiconductor chips are stacked on the first sealing member. The second sealing member seals the first connection member, the one or more second semiconductor chips, and the one or more second connection members. A ratio of a total weight W1 of Cl ions and Br ions in the first sealing member to a weight W0 of resins of the substrate and the first sealing member is 7.5 ppm or lower.Type: ApplicationFiled: March 16, 2012Publication date: March 14, 2013Applicant: Kabushiki Kaisha ToshibaInventors: Takashi IMOTO, Yoriyasu Ando, Akira Tanimoto, Masaji Iwamoto, Yasuo Takemoto, Hideo Taguchi, Naoto Takebe, Koichi Miyashita, Jun Tanaka, Katsuhiro Ishida, Shogo Watanabe, Yuichi Sano
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Publication number: 20130013240Abstract: A semiconductor manufacturing system includes a program for inspecting a device of the system executing: displaying a screen for selecting an inspection set including inspection items having a manipulation item and/or a check item; retrieving the inspection items, arranging the inspection items in the order of workflow, and displaying each inspection item on a screen with an execution attribute indicating whether each inspection item is “automatic” or “manual” execution; receiving an inspection start command and reading the first inspection item from a storage unit. The program also executes steps corresponding to the following cases (a) to (d) until there are no more inspection items: (a) the read-out inspection item being the manipulation item and “automatic”; (b) the read-out inspection item being the manipulation item and “manual”; (c) the read-out inspection item being the check item and “automatic”; and (d) the read-out inspection item being the check item and “manual”.Type: ApplicationFiled: September 14, 2012Publication date: January 10, 2013Applicant: TOKYO ELECTON LIMITEDInventors: Gaku Ikeda, Koichi Miyashita, Takamasa Chikuma, Satoshi Gomi, Chunmui Li, Kunio Takano
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Patent number: 8328974Abstract: The film sticking apparatus includes: a gripping member; a pressing member pressing the adhesive face of the film being held in a planar state against one end face of a cylindrical honeycomb structure having a plurality of cells, and thus sticking the film to the one end face; and a folding member having an opening portion formed that allows an end of the honeycomb structure on the side to which the film is stuck to be inserted, wherein the folding member folds a protruding portion of the film protruding from the one end face of the honeycomb structure by inserting the honeycomb structure into the opening portion, toward a side face of the honeycomb structure, and simultaneously presses at least a part of the folded protruding portion against a part of the side face of the honeycomb structure to stick the film to the side face.Type: GrantFiled: October 5, 2009Date of Patent: December 11, 2012Assignee: NGK Insulators, Ltd.Inventors: Takeshi Tokunaga, Koichi Miyashita
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Publication number: 20120248628Abstract: According to one embodiment, a semiconductor device includes a control element provided above a main surface of a substrate through a first adhesion layer, a second adhesion layer provided to cover the control element a first semiconductor chip provided on the second adhesion layer, a bottom surface area of the first semiconductor chip being larger than a top surface area of the control element, and at least one side of an outer edge of the control element projecting to an outside of an outer edge of the first semiconductor chip.Type: ApplicationFiled: September 15, 2011Publication date: October 4, 2012Applicant: KABUSHIKI KAISHA TOSHIBAInventors: Jun TANAKA, Koichi Miyashita, Yoriyasu Ando, Akira Tanimoto, Yasuo Takemoto
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Publication number: 20110174800Abstract: A method of detecting an abnormal placement of a substrate W, which is carried out when a substrate W placed on a substrate table 3, in which a heater 6a, 6b is disposed, is processed by heating. The method of detecting an abnormal placement of the substrate comprises the steps of: during processing of the substrate W, based on information about an electric output to the heater 6a, 6b or information about a measured temperature of the substrate table 3, detecting of a maximum value and a minimum value of the electric output or the measured temperature, or an integrated value of the electric output or the measured temperature; and judging of the abnormal placement of the substrate based on the maximum value and the minimum value detected, or the integrated value detected.Type: ApplicationFiled: September 25, 2009Publication date: July 21, 2011Applicant: TOKYO ELECTRON LIMITEDInventors: Takashi Chino, Satoshi Gomi, Koichi Miyashita, Minoru Nagasawa, Yoshie Eda
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Publication number: 20100108242Abstract: The film sticking apparatus includes: a gripping member; a pressing member pressing the adhesive face of the film being held in a planar state against one end face of a cylindrical honeycomb structure having a plurality of cells, and thus sticking the film to the one end face; and a folding member having an opening portion formed that allows an end of the honeycomb structure on the side to which the film is stuck to be inserted, wherein the folding member folds a protruding portion of the film protruding from the one end face of the honeycomb structure by inserting the honeycomb structure into the opening portion, toward a side face of the honeycomb structure, and simultaneously presses at least a part of the folded protruding portion against a part of the side face of the honeycomb structure to stick the film to the side face.Type: ApplicationFiled: October 5, 2009Publication date: May 6, 2010Applicant: NGK INSULATORS, LTD.Inventors: Takeshi TOKUNAGA, Koichi MIYASHITA
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Publication number: 20070214964Abstract: There is disclosed a method for removing bubbles from a slurry and a device therefor capable of efficiently optimizing the removal of bubbles from a slurry and the viscosity of the slurry as well as dramatically reducing the bubble removing time.Type: ApplicationFiled: March 2, 2007Publication date: September 20, 2007Applicant: NGK INSULATORS, LTD.Inventors: Koichi Miyashita, Yukihito Ichikawa
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Publication number: 20070212483Abstract: Problem to be solved is to provide a means to make the thickness of a ceramic slurry in a container uniformly in a process to form plugged portions in a honeycomb structure. The solution is provided with a slurry applying device 1 comprising a plate shaped container 2 which a base 21 is flat, a fixed quantity non-pulsatile pump 3 to which a slurry 31 is discharged to the base 21 of the container 2, a discharge opening moving means which relatively moves a position of a discharge opening of the pump 3 between center 22 and periphery 23 of the base 21 of the container 2, and a container rotating means for application which rotates the container 2 as a rotating axis with the center 22 of the base 21.Type: ApplicationFiled: February 21, 2007Publication date: September 13, 2007Applicant: NGK INSULATORS, LTD.Inventors: Koichi Miyashita, Yukihito Ichikawa
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Publication number: 20060174695Abstract: A method and a device for inspecting a honeycomb structure having porous partition walls (2) disposed so as to form a plurality of flow passages (3a) and (3b) passed through the honeycomb structure from one end face (42) to the other end face (44), the device comprising a water particle generating part (11) generating water particles (10), a water particle lead-in part (12) leading the water particles (10) into the plurality of flow passages (3a), and a discharged particle measuring part (13) measuring the particle size distribution and the quantity of particles of the water particles (10) discharged from the plurality of flow passages (3b). By the device and method, the honeycomb structure can be easily inspected for presence or absence of defects, sizes of defects, quantity of defects, and the sizes and quantity of pits, and a post-treatment can also be easily performed.Type: ApplicationFiled: March 4, 2004Publication date: August 10, 2006Applicant: NGK Insulators, Ltd.Inventors: Koichi Miyashita, Shinya Mori
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Publication number: 20050169033Abstract: A high speed operating circuit such as a data processor chip and memory chips constituting an electronic circuit is mounted to a multilayer wiring substrate in the state of a bare chip, and is set to a multichip module. This multichip module is mounted to a wiring substrate constituting the electronic circuit. In the multichip module, buffer circuits are inserted into a module internal bus commonly connected to the data processor chip and the memory chips. The buffer circuits are set to an address output buffer, a control signal output buffer and a data input/output buffer set to a high impedance state in accordance with an operating selection of the memory chips. When high frequency noise resisting characteristics are strengthened by the multilayer wiring substrate and the data processor chip gets access to the memory chips, an external noise tends to flow into a memory through the module internal bus connected to the data processor chip and the memory chips.Type: ApplicationFiled: April 1, 2005Publication date: August 4, 2005Inventors: Norihiko Sugita, Takafumi Kikuchi, Koichi Miyashita, Hikaru Ikegami