Abstract: A wiring board for a light-emitting element includes a ceramic insulating substrate, and a conductor layer formed on the surface or in the inside of the insulating substrate, the conductor layer having a mounting region mounting a light-emitting element on one surface of the insulating substrate. The insulating substrate includes a heat-conducting pole-like conductor having a thermal conductivity higher than that of the insulating substrate. The heat-conducting pole-like conductor extends through the insulating substrate in the direction of thickness thereof from the light-emitting element mounting region of the insulating substrate, and is formed by the co-firing with the insulating substrate.

Abstract: A wiring board for light-emitting element, comprising a ceramic insulating substrate, and a conductor layer formed on the surface or in the inside of the insulating substrate, and having a mounting region mounting a light-emitting element on one surface of the insulating substrate; wherein the insulating substrate is provided with a heat-conducting pole-like conductor having a thermal conductivity higher than that of said insulating substrate; and the heat-conducting pole-like conductor is extending through the insulating substrate in the direction of thickness thereof from the light-emitting element mounting region of the insulating substrate, and is formed by the co-firing with the insulating substrate.

Abstract: A wiring board for light-emitting element, comprising a ceramic insulating substrate, and a conductor layer formed on the surface or in the inside of the insulating substrate, and having a mounting region mounting a light-emitting element on one surface of the insulating substrate; wherein the insulating substrate is provided with a heat-conducting pole-like conductor having a thermal conductivity higher than that of said insulating substrate; and the heat-conducting pole-like conductor is extending through the insulating substrate in the direction of thickness thereof from the light-emitting element mounting region of the insulating substrate, and is formed by the co-firing with the insulating substrate.

Abstract: In a plastic identifying apparatus (1), a reference light (L1) and a detecting light (L2), each having a predetermined wavelength, are irradiated to an object to be identified (4), and the transmitted lights of the reference light (L1) and detecting light (L2) are received. A detecting value expressing the quantity of light received of the detecting light (L2) is divided by a reference value expressing the quantity of light received of the reference light (L1), to obtain a computed value, based on which performed is identification of plastic forming the object to be identified 4. The wavelength of the reference light (L1) is in a wavelength band (hereat, 1550 nm) in which the light absorptances of all the types of plastics are of the lowest level, and the wavelength of the detecting light (L2) is in a wavelength region (hereat, in the range of 1700 to 1760 run) in which the absorption wavelength bands of many plastics except for PET, such as HDPE, are present.

Abstract: An exposure device for a copying machine has a light source unit, and a rail unit for supporting the former rigidly mounted to the machine. The light source unit includes an exposure lamp, a heater for heating the lamp, and a control sensor for energizing the heater until the lamp reaches a proper temperature. The rail unit includes a plate having an elongated exposure aperture therein, an elongated reflecting mirror along one side of the aperture, and a guide rail spaced from the plate along the other side of the aperture. A particular positional relationship must be maintained between the optical system and photoreceptor of a copying machine, the exposure lamp, and the exposure aperture. The present invention allows the light source to be mounted to and dismounted from the machine without disturbing this relationship.