Abstract: A semiconductor device includes a lead frame having a die pad and leads, a first semiconductor chip having first internal electrodes and first external electrodes and mounted on the die pad, a second semiconductor chip having second internal electrodes and second external electrodes and bonded to the first semiconductor chip with the surfaces facing each other, the first internal electrodes being connected to the respective first internal electrodes with bumps, first and second metal fine wires connecting between the leads and the respective first and second external electrodes, and sealing resin. Both semiconductor chips are shifted from each other with the edges being substantially in parallel, a part of the end portion of each semiconductor chip protrudes from the edge of the counterpart semiconductor chip and the external electrodes are located in the protruded regions.