Patents by Inventor Koichi SAKABE
Koichi SAKABE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11643573Abstract: The present invention provides a polishing composition with which it is possible to decrease a level difference to be unintentionally generated between dissimilar materials and a level difference to be unintentionally generated between coarse and dense portions of a pattern. The present invention relates to a polishing composition which contains abrasive grains having an average primary particle size of 5 to 50 nm, a level difference modifier containing a compound with a specific structure, having an aromatic ring and a sulfo group or a salt group thereof which is directly bonded to this aromatic ring, and a dispersing medium and of which the pH is less than 7.Type: GrantFiled: January 23, 2018Date of Patent: May 9, 2023Assignee: FUJIMI INCORPORATEDInventors: Yukinobu Yoshizaki, Koichi Sakabe, Satoru Yarita, Kenichi Komoto
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Patent number: 11377627Abstract: The present invention provides a means by which it is possible to sufficiently suppress an organic residue while favorably decreasing a ceria residue on a polished object to be polished obtained after being polished using a polishing composition containing ceria. The present invention relates to a composition for surface treatment, which is for a surface treatment of a polished object to be polished obtained after being polished using a polishing composition containing ceria, contains a carboxy group-containing (co)polymer having a structural unit derived from a monomer having a carboxy group or a salt group of the carboxy group, a SOx or NOy partial structure-containing compound having a partial structure represented by SOx or NOy (where x and y each independently denote a real number 1 to 5), and a dispersing medium, and has a pH of 1 or more and 8 or less.Type: GrantFiled: January 23, 2018Date of Patent: July 5, 2022Assignee: FUJIMI INCORPORATEDInventors: Yukinobu Yoshizaki, Koichi Sakabe, Satoru Yarita, Kenichi Komoto
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Publication number: 20220127478Abstract: Hollow resin particles for thermosensitive recording media containing a thermoplastic resin shell and a hollow part surrounded by the shell. The hollow resin particles contain a thermally-vaporizable hydrocarbon in an encapsulation ratio of at least 0.2 wt %. The hollow resin particles preferably have a mean volume particle size ranging from 0.1 to 10 ?m.Type: ApplicationFiled: March 17, 2020Publication date: April 28, 2022Applicant: MATSUMOTO YUSHI-SEIYAKU CO., LTD.Inventors: Koichi SAKABE, Katsushi MIKI
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Publication number: 20210139739Abstract: The present invention provides a polishing composition with which it is possible to decrease a level difference to be unintentionally generated between dissimilar materials and a level difference to be unintentionally generated between coarse and dense portions of a pattern. The present invention relates to a polishing composition which contains abrasive grains having an average primary particle size of 5 to 50 nm, a level difference modifier containing a compound with a specific structure, having an aromatic ring and a sulfo group or a salt group thereof which is directly bonded to this aromatic ring, and a dispersing medium and of which the pH is less than 7.Type: ApplicationFiled: January 23, 2018Publication date: May 13, 2021Applicant: FUJIMI INCORPORATEDInventors: Yukinobu YOSHIZAKI, Koichi SAKABE, Satoru YARITA, Kenichi KOMOTO
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Publication number: 20210130751Abstract: The present invention provides a means by which it is possible to sufficiently suppress an organic residue while favorably decreasing a ceria residue on a polished object to be polished obtained after being polished using a polishing composition containing ceria. The present invention relates to a composition for surface treatment, which is for a surface treatment of a polished object to be polished obtained after being polished using a polishing composition containing ceria, contains a carboxy group-containing (co)polymer having a structural unit derived from a monomer having a carboxy group or a salt group of the carboxy group, a SOx or NOy partial structure-containing compound having a partial structure represented by SOx or NOy (where x and y each independently denote a real number 1 to 5), and a dispersing medium, and has a pH of 1 or more and 8 or less.Type: ApplicationFiled: January 23, 2018Publication date: May 6, 2021Applicant: FUJIMI INCORPORATEDInventors: Yukinobu YOSHIZAKI, Koichi SAKABE, Satoru YARITA, Kenichi KOMOTO
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Patent number: 10858615Abstract: A surface treatment composition according to the present invention is used for treating a surface of a polished object to be polished which is obtained after polishing with a polishing composition including ceria, using the surface treatment composition including a (co)polymer having a monomer-derived structural unit having a carboxyl group or a salt group thereof, a residue removing accelerator composed of a specific compound having a hydroxyl group, and a dispersing medium, wherein pH is less than 7.Type: GrantFiled: September 17, 2018Date of Patent: December 8, 2020Assignee: FUJIMI INCORPORATEDInventors: Yukinobu Yoshizaki, Koichi Sakabe, Satoru Yarita, Kenichi Komoto
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Patent number: 10781342Abstract: An object of the present invention is to provide a polishing composition which can sufficiently improve a polishing speed of an object to be polished having a silicon-oxygen bond such as a silicon oxide film or a polishing speed of an object to be polished having a silicon-nitrogen bond such as a silicon nitride film. Providing a polishing composition including: (1) an organic compound which has an action site interacting with an object to be polished having a silicon-oxygen bond or a silicon-nitrogen bond and an acceleration site accelerating an access of a component polishing an object to be polished to the object to be polished; (2) abrasive grains; and (3) a dispersing medium.Type: GrantFiled: March 11, 2016Date of Patent: September 22, 2020Assignee: FUJIMI INCORPORATEDInventors: Shogo Onishi, Takeki Sato, Yukinobu Yoshizaki, Koichi Sakabe
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Patent number: 10731021Abstract: A process for producing heat-expandable microspheres which enables constant and high-yield production of heat-expandable microspheres having a mean particle size ranging from 0.01 to 10 ?m without deteriorating their expansion performance, and the application thereof. The process produces heat-expandable microspheres containing a thermoplastic resin shell and the blowing agent encapsulated therein. The process includes a step of dispersing a polymerizable component and the blowing agent in an aqueous dispersion medium containing a polyester amide having an acid value (mgKOH/g) ranging from 95 to 140 and a step of polymerizing the polymerizable component.Type: GrantFiled: June 21, 2016Date of Patent: August 4, 2020Assignee: MATSUMOTO YUSHI-SEIYAKU CO., LTD.Inventors: Norimichi Hyogo, Katsushi Miki, Koichi Sakabe
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Patent number: 10703936Abstract: To provide a technology by which, on the occasion of polishing an object to be polished including: (a) material having silicon-nitrogen bonds; and (b) other material, the ratio of the polishing speed for the material (a) with respect to the polishing speed for the material (b) can be increased. The polishing composition of the present invention is a polishing composition used for polishing an object to be polished including: (a) material having silicon-nitrogen bonds; and (b) other material, the polishing composition including: an organic acid-immobilized silica; and a particular selection ratio improver for increasing the ratio of the polishing speed for the material (a) with respect to the polishing speed for the material (b).Type: GrantFiled: March 15, 2017Date of Patent: July 7, 2020Assignee: FUJIMI INCORPORATEDInventors: Yukinobu Yoshizaki, Koichi Sakabe, Yusuke Kadohashi
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Publication number: 20190300821Abstract: The present invention relates to a surface treatment composition including: at least one water-soluble polymer selected from the following Group A; at least one anionic surfactant selected from the following Group B; and water. Group A: water-soluble polysaccharides, polyvinyl alcohols and derivatives thereof, and polyvinylpyrrolidones and derivatives thereof (with the proviso that compounds included in the following Group B are excluded) Group B: compounds having a sulfonic acid (salt) group, compounds having a sulfuric acid ester (salt) group, compounds having a phosphonic acid (salt) group, compounds having a phosphoric acid (salt) group, and compounds having a phosphinic acid (salt) group. According to the present invention, a surface treatment composition capable of efficiently removing foreign bodies, such as particles and organic residues, remaining on the surface of an object to be polished after polishing is provided.Type: ApplicationFiled: June 29, 2017Publication date: October 3, 2019Applicant: FUJIMI INCORPORATEDInventors: Yukinobu YOSHIZAKI, Koichi SAKABE, Satoru YARITA, Kenichi KOMOTO
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Publication number: 20190112505Abstract: To provide a technology by which, on the occasion of polishing an object to be polished including: (a) material having silicon-nitrogen bonds; and (b) other material, the ratio of the polishing speed for the material (a) with respect to the polishing speed for the material (b) can be increased. The polishing composition of the present invention is a polishing composition used for polishing an object to be polished including: (a) material having silicon-nitrogen bonds; and (b) other material, the polishing composition including: an organic acid-immobilized silica; and a particular selection ratio improver for increasing the ratio of the polishing speed for the material (a) with respect to the polishing speed for the material (b).Type: ApplicationFiled: March 15, 2017Publication date: April 18, 2019Applicant: FUJIMI INCORPORATEDInventors: Yukinobu YOSHIZAKI, Koichi SAKABE, Yusuke KADOHASHI
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Publication number: 20190093051Abstract: A surface treatment composition according to the present invention is used for treating a surface of a polished object to be polished which is obtained after polishing with a polishing composition including ceria, using the surface treatment composition including a (co)polymer having a monomer-derived structural unit having a carboxyl group or a salt group thereof, a residue removing accelerator composed of a specific compound having a hydroxyl group, and a dispersing medium, wherein pH is less than 7.Type: ApplicationFiled: September 17, 2018Publication date: March 28, 2019Applicant: FUJIMI INCORPORATEDInventors: Yukinobu YOSHIZAKI, Koichi SAKABE, Satoru YARITA, Kenichi KOMOTO
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Patent number: 10144907Abstract: The purpose of the present invention is to provide a means to sufficiently remove impurities remaining on the surface of a polishing object after CMP. The polishing composition of the present invention is a polishing composition which is used after polishing has been performed by using a polishing composition (A) including abrasive grains or an organic compound (A), and is characterized by including an organic compound (B) which includes at least one atom selected from the group consisting of a fluorine atom, an oxygen atom, a nitrogen atom, and a chlorine atom and has a molecular weight of 100 or more, a pH adjusting agent, and 0 to 1% by mass of abrasive grains.Type: GrantFiled: January 30, 2015Date of Patent: December 4, 2018Assignee: FUJIMI INCORPORATEDInventors: Shuugo Yokota, Shota Suzuki, Tomohiko Akatsuka, Yasuyuki Yamato, Koichi Sakabe, Yoshihiro Izawa, Yukinobu Yoshizaki, Chiaki Saito
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Patent number: 10023712Abstract: Heat-expandable microspheres having an almost spherical shape and high expansion performance and exhibiting good workability when mixed with a resin, a process for producing the heat-expandable microspheres, and applications thereof. The heat-expandable microspheres include a thermoplastic resin shell and a blowing agent encapsulated therein and vaporizable by heating. The thermoplastic resin is produced by polymerizing a polymerizable component containing a methacrylate monomer and a carboxyl-containing monomer, and optionally containing a nitrile monomer in an amount ranging from 0 to 30 parts by weight to 100 parts by weight of the total amount of the methacrylate monomer and the carboxyl-containing monomer. The blowing agent contains a hydrocarbon having at least 8 carbon atoms per molecule.Type: GrantFiled: May 18, 2015Date of Patent: July 17, 2018Assignee: MATSUMOTO YUSHI-SEIYAKU CO., LTD.Inventors: Koichi Sakabe, Katsushi Miki, Yasuyuki Nomura
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Publication number: 20180186960Abstract: A process for producing heat-expandable microspheres which enables constant and high-yield production of heat-expandable microspheres having a mean particle size ranging from 0.01 to 10 ?m without deteriorating their expansion performance, and the application thereof. The process produces heat-expandable microspheres containing a thermoplastic resin shell and the blowing agent encapsulated therein. The process includes a step of dispersing a polymerizable component and the blowing agent in an aqueous dispersion medium containing a polyester amide having an acid value (mgKOH/g) ranging from 95 to 140 and a step of polymerizing the polymerizable component.Type: ApplicationFiled: June 21, 2016Publication date: July 5, 2018Applicant: MATSUMOTO YUSHI-SEIYAKU CO., LTD.Inventors: Norimichi HYOGO, Katsushi MIKI, Koichi SAKABE
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Publication number: 20180057711Abstract: An object of the present invention is to provide a polishing composition which can sufficiently improve a polishing speed of an object to be polished having a silicon-oxygen bond such as a silicon oxide film or a polishing speed of an object to be polished having a silicon-nitrogen bond such as a silicon nitride film. Providing a polishing composition including: (1) an organic compound which has an action site interacting with an object to be polished having a silicon-oxygen bond or a silicon-nitrogen bond and an acceleration site accelerating an access of a component polishing an object to be polished to the object to be polished; (2) abrasive grains; and (3) a dispersing medium.Type: ApplicationFiled: March 11, 2016Publication date: March 1, 2018Inventors: Shogo ONISHI, Takeki SATO, Yukinobu YOSHIZAKI, Koichi SAKABE
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Patent number: 9837283Abstract: Provided is a polishing composition which exhibits favorable storage stability and polishes a polishing object poor in chemical reactivity at a high speed. The invention is a polishing composition which contains silica having an organic acid immobilized on a surface thereof, a dihydric alcohol having a molecular weight of less than 20,000 and a pH adjusting agent, the polishing composition having a pH of 6 or less.Type: GrantFiled: October 25, 2013Date of Patent: December 5, 2017Assignee: FUJIMI INCORPORATEDInventors: Shuugo Yokota, Koichi Sakabe
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Publication number: 20170292039Abstract: There is provided a polishing composition capable of polishing a polishing object including elemental silicon, a silicon compound, metals and the like, especially including tungsten, at a high polishing rate. The polishing composition includes: colloidal silica with organic acid immobilized to a surface thereof; hydrogen peroxide; and salt, the salt being at least one of ammonium nitrate and ammonium sulfate.Type: ApplicationFiled: July 27, 2015Publication date: October 12, 2017Applicant: FUJIMI INCORPORATEDInventors: Takeki SATO, Koichi SAKABE
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Publication number: 20170175053Abstract: The purpose of the present invention is to provide a means to sufficiently remove impurities remaining on the surface of a polishing object after CMP. The polishing composition of the present invention is a polishing composition which is used after polishing has been performed by using a polishing composition (A) including abrasive grains or an organic compound (A), and is characterized by including an organic compound (B) which includes at least one atom selected from the group consisting of a fluorine atom, an oxygen atom, a nitrogen atom, and a chlorine atom and has a molecular weight of 100 or more, a pH adjusting agent, and 0 to 1% by mass of abrasive grains.Type: ApplicationFiled: January 30, 2015Publication date: June 22, 2017Applicant: FUJIMI INCORPORATEDInventors: SHUUGO YOKOTA, Shota SUZUKI, Tomohiko AKATSUKA, Yasuyuki YAMATO, Koichi SAKABE, Yoshihiro IZAWA, Yukinobu YOSHIZAKI, Chiaki SAITO
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Publication number: 20170081492Abstract: Heat-expandable microspheres having an almost spherical shape and high expansion performance and exhibiting good workability when mixed with a resin, a process for producing the heat-expandable microspheres, and applications thereof. The heat-expandable microspheres include a thermoplastic resin shell and a blowing agent encapsulated therein and vaporizable by heating. The thermoplastic resin is produced by polymerizing a polymerizable component containing a methacrylate monomer and a carboxyl-containing monomer, and optionally containing a nitrile monomer in an amount ranging from 0 to 30 parts by weight to 100 parts by weight of the total amount of the methacrylate monomer and the carboxyl-containing monomer. The blowing agent contains a hydrocarbon having at least 8 carbon atoms per molecule.Type: ApplicationFiled: May 18, 2015Publication date: March 23, 2017Applicant: MATSUMOTO YUSHI-SEIYAKU CO., LTD.Inventors: Koichi SAKABE, Katsushi MIKI, Yasuyuki NOMURA