Abstract: A wireless communication method implemented by a first apparatus constituting a vehicle-to-vehicle communication system, including: receiving vehicle data transmitted on a control channel from a second apparatus; acquiring, from a map information storage unit configured to store map information divided into a plurality of first areas, information relating to a first area including a current position of the first apparatus; determining whether or not to access a DB storing WS information on the basis of position information relating to the first in-vehicle wireless communication apparatus, position information relating to another apparatus, and information relating to the first area; acquiring WS information relating to a vicinity of the current position from the DB after determining to access the DB; and transmitting the WS information acquired from the DB in the querying step to a peripheral apparatus.

Abstract: An OLT, which is a station-side apparatus in a PON system, is connected to an ONU via an optical fiber. The OLT includes: an optical receiver which receives a burst signal from an ONU; a burst header detection unit which detects a certain delimiter pattern included in a received burst signal so as to establish synchronization of the burst signal; and a control unit which allows the burst header detection unit to perform detection of a delimiter pattern during a predicted reception period of a burst signal.

Abstract: A wireless communication method implemented by a first apparatus constituting a vehicle-to-vehicle communication system, including: receiving vehicle data transmitted on a control channel from a second apparatus; acquiring, from a map information storage unit configured to store map information divided into a plurality of first areas, information relating to a first area including a current position of the first apparatus; determining whether or not to access a DB storing WS information on the basis of position information relating to the first in-vehicle wireless communication apparatus, position information relating to another apparatus, and information relating to the first area; acquiring WS information relating to a vicinity of the current position from the DB after determining to access the DB; and transmitting the WS information acquired from the DB in the querying step to a peripheral apparatus.

Abstract: A nonvolatile memory apparatus which includes plural memories one of which is a nonvolatile memory such as a Flash EEPROM capable of being specified a plurality of operations from a processing unit of the apparatus including an erase operation, the erase operation in the nonvolatile memory performs a threshold voltage moving operation and a verify operation, and the nonvolatile memory is capable of releasing the I/O bus during the erase operation to thereby allow accessing of other memories and/or system components. For example, during this erase operation, the Flash EEPROM is able to free the I/O data terminal such that the EEPROM becomes electrically isolated from the CPU. The CPU is then able to perform data processing by the system bus where information can then be transferred/received such as between other memories, e.g., ROM and RAM, and otherwise with the I/O port.

Abstract: A semiconductor memory device includes a plurality of memory cells, each including, a source region formed of a semiconductor material, a drain region formed of the semiconductor material, and a first region formed of the semiconductor material and located between the source region and the drain region. First and second insulator films sandwich the first region and a first gate electrode is connected to the first region through the first insulator film. In this arrangement, the first region is adapted to accumulate charges corresponding to stored information.

Abstract: A field-effect semiconductor element implemented with a fewer number of elements and a reduced area and capable of storing data by itself without need for cooling at a cryogenic temperature, and a memory device employing the same. Gate-channel capacitance is set so small that whether or not a trap captures one electron or hole can definitely and distinctively be detected in terms of changes of a current of the semiconductor FET element. By detecting a change in a threshold voltage of the semiconductor element brought about by trapping of electron or hole in the trap, data storage can be realized at a room temperature.

Abstract: A nonvolatile memory apparatus which includes plural memories one of which is a nonvolatile memory such as a Flash EEPROM capable of being specified a plurality of operations from a processing unit of the apparatus including an erase operation, the erase operation in the nonvolatile memory performs a threshold voltage moving operation and a verify operation, and the nonvolatile memory is capable of releasing the I/O bus during the erase operation to thereby allow accessing of other memories and/or system components. For example, during this erase operation, the Flash EEPROM is able to free the I/O data terminal such that the EEPROM becomes electrically isolated from the CPU. The CPU is then able to perform data processing by the system bus where information can then be transferred/received such as between other memories, e.g., ROM and RAM, and otherwise with the I/O port.

Abstract: A field-effect semiconductor element implemented with a fewer number of elements and a reduced area and capable of storing data by itself without need for cooling at a cryogenic temperature, and a memory device employing the same. Gate-channel capacitance is set so small that whether or not a trap captures one electron or hole can definitely and distinctively be detected in terms of changes of a current of the semiconductor FET element. By detecting a change in a threshold voltage of the semiconductor element brought about by trapping of electron or hole in the trap, data storage can be realized at a room temperature.

Abstract: A nonvolatile memory apparatus which includes plural memories one of which is a nonvolatile memory such as a Flash EEPROM capable of being specified a plurality of operations from a processing unit of the apparatus including an erase operation, the erase operation in the nonvolatile memory performs a threshold voltage moving operation and a verify operation, and the nonvolatile memory is capable of releasing the I/O bus during the erase operation to thereby allow accessing of other memories and/or system components. For example, during this erase operation, the Flash EEPROM is able to free the I/O data terminal such that the EEPROM becomes electrically isolated from the CPU. The CPU is then able to perform data processing by the system bus where information can then be transferred/received such as between other memories, e.g., ROM and RAM, and otherwise with the I/O port.

Abstract: A field-effect semiconductor element implemented with a fewer number of elements and a reduced area and capable of storing data by itself without need for cooling at a cryogenic temperature, and a memory device employing the same. Gate-channel capacitance is set so small that whether or not a trap captures one electron or hole can definitely and distinctively be detected in terms of changes of a current of the semiconductor FET element. By detecting a change in a threshold voltage of the semiconductor element brought about by trapping of electron or hole in the trap, data storage can be realized at a room temperature.

Abstract: An EEPROM having an erasing control circuit that performs at least the read out operation one time on the corresponding memory cells after an erasing operation is performed in connection therewith. The erasing operation is automatically performed by the internal erasing control circuit while the EEPROM is electrically isolated from the microprocessor in response to instructions from the microprocessor. The control by the microprocessor requires only a slightly short period of time during which the erasing commencement is instructed while the EEPROM remains in the system during the erasing operation. In one aspect of the disclosure, a Vcc power source is applied to a source region or a drain region of each nonvolatile semiconductor memory cell, and an erasure voltage having a polarity opposite to that of the Vcc power source is applied to a control gate electrode.

Abstract: A semiconductor quantum memory element is disclosed which can share the terminals easily among a plurality of memory elements and can pass a high current and which is strong against noises. In order to accomplish this a control electrode is formed so as to cover the entirety of thin film regions connecting low-resistance regions. As a result, the element can have a small size and can store information with high density. Thus, a highly integrated, low power consumption non-volatile memory device can be realized with reduced size. A method of forming a memory element is also disclosed including performing the following steps of forming a first insulating layer, a second insulating layer, a first conductive layer and a layer of amorphous silicon. The amorphous silicon layer is crystallized to a polycrystalline silicon film. Semiconductor drains are deposited to form charge trapping and storage regions.

Abstract: A field-effect semiconductor element implemented with a fewer number of elements and a reduced area and capable of storing data by itself without need for cooling at a cryogenic temperature, and a memory device employing the same. Gate-channel capacitance is set so small that whether or not a trap captures one electron or hole can definitely and distinctively be detected in terms of changes of a current of the semiconductor FET element. By detecting a change in a threshold voltage of the semiconductor element brought about by trapping of electron or hole in the trap, data storage can be realized at a room temperature.

Abstract: A program for automatically designing a logic circuit used for a method of designing a pass transistor circuit, by which the number of required transistors, delay time, power consumption and chip area of the pass transistor circuit is reduced.

Abstract: A semiconductor quantum memory element is disclosed which can share the terminals easily among a plurality of memory elements and can pass a high current and which is strong against noise. In order to accomplish this a control electrode is formed so as to cover the entirety of thin film regions connecting low-resistance regions. As a result, the element can have a small size and can store information with high density. Thus, a highly integrated, low power consumption non-volatile memory device can be realized with reduced size. A method of forming a memory element is also disclosed including performing the following steps of forming a first insulating layer, a second insulating layer, a first conductive layer and a layer of amorphous silicon. The amorphous silicon layer is crystallized to a polycrystalline silicon film. Semiconductor drains are deposited to form charge trapping and storage regions.

Abstract: An EEPROM having an erasing control circuit that performs at least the read out operation one time on the corresponding memory cells after an erasing operation is performed in connection therewith. The erasing operation is automatically performed by the internal erasing control circuit while the EEPROM is electrically isolated from the microprocessor in response to instructions from the microprocessor. The control by the microprocessor requires only a slightly short period of time during which the erasing commencement is instructed while the EEPROM remains in the system during the erasing operation. In one aspect of the disclosure, a Vcc power source is applied to a source region or a drain region of each nonvolatile semiconductor memory cell, and an erasure voltage having a polarity opposite to that of the Vcc power source is applied to a control gate electrode.

Abstract: An EEPROM having an erasing control circuit that performs at least the read out operation one time on the corresponding memory cells after an erasing operation is performed in connection therewith. The erasing operation is automatically performed by the internal erasing control circuit while the EEPROM is electrically isolated from the microprocessor in response to instructions from the microprocessor. The control by the microprocessor requires only a slightly short period of time during which the erasing commencement is instructed while the EEPROM remains in the system during the erasing operation. In one aspect of the disclosure, a Vcc power source is applied to a source region or a drain region of each nonvolatile semiconductor memory cell, and an erasure voltage having a polarity opposite to that of the Vcc power source is applied to a control gate electrode.

Abstract: An EEPROM having an erasing control circuit that performs at least the read out operation one time on the corresponding memory cells after an erasing operation is performed in connection therewith. The erasing operation is automatically performed by the internal erasing control circuit while the EEPROM is electrically isolated from the microprocessor in response to instructions from the microprocessor. The control by the microprocessor requires only a slightly short period of time during which the erasing commencement is instructed while the EEPROM remains in the system during the erasing operation. In one aspect of the disclosure, a Vcc power source is applied to a source region or a drain region of each nonvolatile semiconductor memory cell, and an erasure voltage having a polarity opposite to that of the Vcc power source is applied to a control gate electrode.

Abstract: A field-effect semiconductor element implemented with a fewer number of elements and a reduced area and capable of storing data by itself without need for cooling at a cryogenic temperature, and a memory device employing the same. Gate-channel capacitance is set so small that whether or not a trap captures one electron or hole can definitely and distinctively be detected in terms of changes of a current of the semiconductor FET element. By detecting a change in a threshold voltage of the semiconductor element brought about by trapping of electron or hole in the trap, data storage can be realized at a room temperature.

Abstract: A nonvolatile memory apparatus contains plural memories, at least one of which is a nonvolatile memory, and a processing unit. Data input/output (I/O) terminals of the memories and processing unit are mutually coupled by a bus. When the nonvolatile memory is brought into an erasing mode by the processing unit, it becomes electrically isolated as a result of freeing the connection of the I/O terminal thereof during the erase operation. Accordingly, the processing unit is capable of accessing other memories via the bus where information can then be transferred/received between other memory devices and, otherwise, with the input/output port of the system. Control by the processing unit requires a relatively short time during which the erasing commencement is instructed so as to minimize interruption of the throughput capability of the system. Following the designation of an erasing mode, a data polling mode is designated.