Abstract: A semiconductor device manufacturing apparatus management system includes a semiconductor device manufacturing apparatus which operates in accordance with a parameter, an obtaining device for obtaining evaluation values of an operation result of the semiconductor device manufacturing apparatus corresponding to a plurality of parameter values of the parameter, a holding device for holding the evaluation values obtained by the obtaining device for each object to be processed by the semiconductor device manufacturing apparatus, and an optimization device for analyzing the evaluation values held by the holding device. The optimization device optimizes the parameter on the basis of at least one of a sensitivity representing a change degree of the evaluation values upon the change in the parameter, and a variation amount of the evaluation values for each object to be processed.

Abstract: A management apparatus which manages a parameter for an industrial device acquires AGA measurement results obtained by operating the industrial device with an operation job parameter value and non-operation job parameter value. An inspection apparatus acquires an “inspection result” obtained by inspecting the result of operating the industrial device in the operation job. A change in inspection result upon a change in parameter value is estimated on the basis of the AGA measurement result and inspection result. A variable which minimizes (extreme) both or at least one of the sensitivity (slope) of the inspection result upon a change in parameter value and variations (3 &sgr;) in inspection result between objects to be processed (e.g., wafers) is set as an optimal parameter.

Abstract: This invention provides a computer apparatus which is connected to an exposure apparatus capable of executing AGA measurement by using a set parameter value and another parameter value and executing acquisition processing of acquiring measurement results, and an overlay inspection apparatus for inspecting the processing result obtained with the set parameter value in the exposure apparatus, and which executes optimization processing of optimizing the set parameter value on the basis of the processing results acquired in acquisition processing and the inspection result value by the inspection apparatus. The computer apparatus causes the inspection apparatus to acquire and accumulate inspection result values, and evaluates variations in processing results on the basis of the accumulated inspection results. Based on the evaluation result, the computer apparatus decides a frequency at which acquisition processing in the semiconductor exposure apparatus is executed.

Abstract: An exposure apparatus performs AGA measurement by using a predetermined sample shot group formed on a wafer, and decides an alignment parameter. The exposure apparatus executes wafer alignment processing and exposure processing by using the alignment parameter. The exposure apparatus notifies a central processing unit (4) of AGA measurement results and the alignment parameter. An overlay inspection apparatus measures an actual exposure position on the exposed wafer, and notifies the central processing unit of the measurement result. The central processing unit (4) optimizes alignment processing on the basis of the AGA measurement results, alignment parameter, and actually measured exposure position.

Abstract: A system which manages a plurality of semiconductor exposure apparatuses holds TIS information representing the characteristics of the respective semiconductor exposure apparatuses. In a semiconductor exposure apparatus, a parameter value is optimized on the basis of AGA measurement results obtained using a set parameter value and another parameter value and AGA measurement estimation results obtained by virtually changing the parameter value. Whether to reflect the optimized parameter value in another industrial device is decided on the basis of the TIS information. If it is decided to reflect the optimized parameter value, the parameter value of another semiconductor exposure apparatus is optimized by the optimized parameter value. In this manner, the optimization result of a parameter value by a given industrial device can be properly reflected in another industrial device, realizing efficient parameter value setting.

Abstract: A foreign substance inspecting method includes the steps of detecting a height of a foreign substance attaching to a periphery of a wafer by irradiating a light beam from a light source to the wafer, thereby detecting the presence/absence of a foreign substance with not less than a predetermined height. The predetermined height is set to be substantially equal to a gap between the wafer and a mask at a wafer exposure.

Abstract: An alignment method includes the steps of (i) in order to expose a pattern of a first object onto a second object, measuring positions of a plurality of marks on the second object with a mark detection device and aligning the first and second objects with each other, and (ii) measuring shapes of the plurality of marks on the second object, thereby obtaining offsets that should be reflected in the measured values of the mark detection device. The shapes of the plurality of the marks are measured with a shape measurement device with no possibility of coming into contact with the mark, through calibration with reference to a shape measurement device with a possibility of coming into contact with the mark.

Abstract: An alignment apparatus for aligning a reflective reticle includes a light source for emitting alignment light; an optical unit for guiding the alignment light, which has been emitted by the light source, to an alignment mark provided on the reticle and a reference mark provided on a reticle stage that holds the reticle; and detecting unit for detecting the alignment light reflected from the alignment mark and the reference mark, wherein the reticle is aligned on the basis of the result of detection by the detection unit.

Abstract: An apparatus control system controls the operation of an industrial apparatus while the apparatus is operating in order to achieve operating efficiency without stopping the apparatus. The apparatus control system sets parameters for operating the industrial apparatus, inspects the results of operating the apparatus according to the parameters thus set, evaluates the operating results according to a first parameter value and a second parameter value different from the first parameter value, determines new parameter values, revises the first and second parameters to the newly determined values, and continues to operate the industrial apparatuses according to the revised parameter values.

Abstract: A position detecting method and a position detecting device which make it possible to detect with high accuracy by an image processing method the relative positions of two objects spaced apart in the optical axis direction of a detection optical system, and a semiconductor device manufacturing method using the position detecting method and the position detecting device. In detecting the relative positions of a first object (e.g., a mask) and a second object (e.g., a wafer), there is provided a third object equipped with separate reference alignment marks, and optical images of the reference alignment marks on the third object and optical images of the position detecting marks on the first and second objects are detected by an image pickup device, thereby detecting positional deviation between the first and second objects.

Abstract: Stereoscopic shape measurement of a surface of a target is realized by measuring the target without coming into contact with the target by a first measuring unit which has no possibility of contacting the target, such as an optical profiler (Mirou interferometer method or the like), and then measuring the target again by a second measuring unit which has a possibility of contacting the target, such as an AFM, a stylus profiler or the like, by using the measurement result of the first measuring unit. An operation controller, controlling measurement operation of the second measuring unit, controls based on the measurement result of the first measuring unit the probe or stylus to scan the measurement target surface so as not to come strongly in contact with the surface.

Abstract: A position detector suitable for an exposure apparatus includes a reticle stage on which is provided a reticle-stage reference mark constituted by a substrate that exhibits a transmitting property with respect to alignment light. In alignment measurement, the relative position of the reticle-stage reference mark and a wafer alignment mark is detected. The relative position of a reticle reference mark and reticle alignment mark is measured beforehand using a separate detection mechanism, and the relative position of a reticle and wafer is decided from the relative position of the reticle-stage reference mark and wafer alignment mark.

Abstract: A reticle stage reference mark 3 of material having high reflectivity to alignment illumination light is provided on a reticle 5, and a chuck mark 8 of material having high reflectivity to the alignment illumination light is provided on a wafer chuck 11. A relative position of the reticle stage reference mark 3 to the chuck mark 8 is detected by using a first position detection optical system 1 and a first illumination optical system 2, and relative alignment is performed between the reticle 5 and a wafer 10.

Abstract: A position detecting system for producing relative positional information related to first and second objects, is wherein the system includes a light projecting device for projecting light toward the first and second objects disposed opposed to each other and having physical optic elements, the light projecting device being capable of projecting lights of different wavelengths, a light detecting device for detecting light emitted from the light projecting device and being influenced by both of the physical optic elements of the first and second objects, wherein relative positional information related to the first and second objects is produced on the basis of the detection by the light detecting device, and a spacing setting device for changing the spacing between the first and second objects in accordance with a wavelength of light to be projected by the light projecting device.

Abstract: In an alignment method, in order to expose a pattern of a first object onto a second object, a plurality of marks on the second object are detected with a mark detection unit, and the first and second objects are aligned with each other. Before this process, the shape of a mark on the second object is measured, thereby obtaining an offset that should be reflected in a detection result of the mark detection unit. The shape of the mark is measured with a shape measurement unit (63) with no possibility of coming into contact with the mark, through calibration with reference to a shape measurement unit (64) with a possibility of coming into contact with the mark. The shape of the mark can be measured without contaminating or damaging the mark.

Abstract: A position detecting method and a position detecting device which make it possible to detect with high accuracy by an image processing method the relative positions of two objects spaced apart in the optical axis direction of a detection optical system, and a semiconductor device manufacturing method using the position detecting method and the position detecting device. In detecting the relative positions of a first object (e.g., a mask) and a second object (e.g., a wafer), there is provided a third object equipped with separate reference alignment marks, and optical images of the reference alignment marks on the third object and optical images of the position detecting marks on the first and second objects are detected by an image pickup device, thereby detecting positional deviation between the first and second objects.

Abstract: A foreign substance inspecting apparatus (12) for inspecting a foreign substance attaching to a wafer (2) includes an irradiation unit (14) for irradiating a periphery of the wafer with light in a direction substantially tangent to an outer circumference of the wafer while rotating the wafer, and a detection unit (18) for detecting presence/absence of a foreign substance with a predetermined height or more on the basis of the irradiating light. The foreign substance inspecting apparatus (12) detects a foreign substance that enters between a mask and wafer to fracture the mask, thereby preventing fracture of the mask.

Abstract: A position detecting system for detecting relative position of a first object and a second object having first and second physical optic elements, respectively, includes a light projecting system for projecting light to one of the first and second physical optic elements, wherein light from the one physical optic element illuminated with the light from the light projecting system is projected to the other of the first and second physical optic elements, and a light receiving system for receiving light from the other physical optic element illuminated with the light from the one physical optic element, wherein relative position of the first and second objects can be detected by detecting positional information related to a position of the thus received light upon a predetermined plane, wherein the light projecting system serves to project lights of different wavelengths on to the one physical optic element in different states of convergence or divergence.

Abstract: An exposure device in which relative alignment between first and second objects is conducted by using an alignment and in which a pattern on the first object is exposed onto the second object to form the pattern on the first object onto the second object. The exposure device includes a mark detecting device for detecting an actual position of the alignment and for producing a detection signal, a moving device for moving the first and second objects relative to each other to perform alignment of the first and second objects and a control device for storing a positional error of the alignment mark generated when the alignment mark is formed on the second object and for controlling the alignment of the first and second objects by the moving device in accordance with the positional error and the detection signal obtained by the mark detecting device. Also disclosed is a mask producing method, an exposure method and semiconductor device producing methods that include related features.

Abstract: An X-ray mask includes a holding frame, a membrane held by the holding frame, a pattern formed on a surface of the membrane by an X-ray absorptive material, the surface being disposed opposed to a workpiece to which the pattern is to be transferred when the mask is mounted in an exposure apparatus, a member for reinforcing the holding frame and having a portion placed closer to the workpiece than to the membrane and a pellicle provided at a side where the pattern is formed, the pellicle being attached to the portion of the member so that the pellicle is placed at the workpiece side of the membrane.