Patents by Inventor Koich Ishida

Koich Ishida has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6218466
    Abstract: A method is provided that can very rapidly produce a liquid silicone rubber base in which even microfine electrically conductive filler with specific surface of at least 0.5 m2/g will be homogeneously dispersed in liquid organopolysiloxane without small lump or clump formation. The method for the continuous preparation of liquid silicone rubber base, including the steps of continuously supplying to a continuous mixing apparatus (A) 100 weight parts polyorganosiloxane that has a viscosity at 25° C. of 100 to 500,000 mPa·s comprising at least 2 silicon-bonded alkenyl groups in each molecule, (B) 0 to 200 weight parts electrically nonconductive inorganic filler, and (C) 0.1 to 700 weight parts electrically conductive filler with a specific surface of at least 0.
    Type: Grant
    Filed: August 27, 1999
    Date of Patent: April 17, 2001
    Assignee: Dow Corning Toray Silicone Co. Ltd.
    Inventors: Mitsuo Hamada, Koich Ishida, Atsushi Komatsu, Hidetoshi Kurusu, Hideyuki Mori, Toyohiko Yamadera