Abstract: A control unit (4) generates a control signal. A switching device (2) performs switching according to the control signal and generates a primary side input voltage from a supply voltage. A transformer (1) converts the primary side input voltage to a secondary side output voltage. A drive circuit (7) drives a power device (8) according to the secondary side output voltage. The control unit (4) includes a table listing a correspondence relationship between supply voltages and set values of control signals for obtaining a desired secondary side output voltage, refers to the table and generates the control signal having a set value corresponding to the supply voltage.

Abstract: A control unit (4) generates a control signal. A switching device (2) performs switching according to the control signal and generates a primary side input voltage from a supply voltage. A transformer (1) converts the primary side input voltage to a secondary side output voltage. A drive circuit (7) drives a power device (8) according to the secondary side output voltage. The control unit (4) includes a table listing a correspondence relationship between supply voltages and set values of control signals for obtaining a desired secondary side output voltage, refers to the table and generates the control signal having a set value corresponding to the supply voltage.

Abstract: A case (6) surrounds a semiconductor chip (5). A case electrode (7) is attached to an upper face of the case (6). A wire (8) is connected to the semiconductor chip (5) and the case electrode (7). A first holding portion (10) presses down the case electrode (7) on the upper face of the case (6) outside a joint portion where the wire (8) is bonded to the case electrode (7). A second holding portion (11) presses down the case electrode (7) on the upper face of the case (6) inside the joint portion. A recess (12) is formed on the upper face of the case (6). The case electrode (7) is bent such as to fit into the recess (12). The second holding portion (11) is disposed inside the recess (12).

Abstract: First and second circuits, a photocoupler and a substrate temperature monitor circuit are formed on a substrate. A photocoupler includes a primary-side light emitting diode that converts an electric signal received from the first circuit into an optical signal, and a light receiving device that converts the optical signal into an electric signal and outputs the electric signal to the second circuit. The substrate temperature monitor circuit reads a Vf voltage value of the primary-side light emitting diode of the photocoupler to monitor temperature of the substrate.

Abstract: A case (6) surrounds a semiconductor chip (5). A case electrode (7) is attached to an upper face of the case (6). A wire (8) is connected to the semiconductor chip (5) and the case electrode (7). A first holding portion (10) presses down the case electrode (7) on the upper face of the case (6) outside a joint portion where the wire (8) is bonded to the case electrode (7). A second holding portion (11) presses down the case electrode (7) on the upper face of the case (6) inside the joint portion. A recess (12) is formed on the upper face of the case (6). The case electrode (7) is bent such as to fit into the recess (12). The second holding portion (11) is disposed inside the recess (12).

Abstract: It is an object of the present invention to provide a semiconductor device that has sufficient insulation properties between a screw and a heat dissipation plate, and is smaller and less costly. A semiconductor device of the present invention includes the following: a housing containing a semiconductor element; a heat dissipation plate disposed on a bottom surface of the housing, and provided to partly extend beyond the housing to reach the outside; an electrode electrically connected to the semiconductor element, and provided to partly protrude from the housing to the outside in parallel with the heat dissipation plate; and a screw with which an exposed portion of the electrode, protruding from the housing is joined to a busbar. The heat dissipation plate has a thickness lack portion in a location of the heat dissipation plate, the location at least facing the screw, the location being on a screw side.

Abstract: It is an object of the present invention to provide a semiconductor device that has sufficient insulation properties between a screw and a heat dissipation plate, and is smaller and less costly. A semiconductor device of the present invention includes the following: a housing containing a semiconductor element; a heat dissipation plate disposed on a bottom surface of the housing, and provided to partly extend beyond the housing to reach the outside; an electrode electrically connected to the semiconductor element, and provided to partly protrude from the housing to the outside in parallel with the heat dissipation plate; and a screw with which an exposed portion of the electrode, protruding from the housing is joined to a busbar. The heat dissipation plate has a thickness lack portion in a location of the heat dissipation plate, the location at least facing the screw, the location being on a screw side.

Abstract: First and second circuits, a photocoupler and a substrate temperature monitor circuit are formed on a substrate. A photocoupler includes a primary-side light emitting diode that converts an electric signal received from the first circuit into an optical signal, and a light receiving device that converts the optical signal into an electric signal and outputs the electric signal to the second circuit. The substrate temperature monitor circuit reads a Vf voltage value of the primary-side light emitting diode of the photocoupler to monitor temperature of the substrate.

Abstract: Disclosed is a protective film for laser processing, which has high adhesiveness and is capable of protecting an object to be processed with a uniform thickness, while being prevented from carbonization/adhesion due to thickness variations. In addition, this protective film for laser processing is free from the problem of waste water contamination when it is removed. Also disclosed is a laser processing method using such a protective film. Specifically disclosed is a protective film for laser processing, which contains a (meth)acrylate copolymer and a radiation-polymerizable (meth)acrylate having an unsaturated bond.

Abstract: To provide a resin composition excellent in conformability to special shapes and in holding power without the need of containing a low molecular softener such as a plasticizer, other than a polysiloxane, and a cured product and a sheet using it. A resin composition characterized by comprising (a) an acrylic rubber, (b) a compound containing at least two mercapto groups per molecule, (c) a compound containing at least two acryloyl and/or methacryloyl groups per molecule, (d) an acrylate and/or methacrylate having a C2-12 alkyl group, and (e) acrylic acid or methacrylic acid. The above resin composition which contains a thermally conductive filler. A cured product and sheet using it.

Abstract: To provide a resin composition excellent in conformability to special shapes and in holding power without the need of containing a low molecular softener such as a plasticizer, other than a polysiloxane, and a cured product and a sheet using it. A resin composition characterized by comprising (a) an acrylic rubber, (b) a compound containing at least two mercapto groups per molecule, (c) a compound containing at least two acryloyl and/or methacryloyl groups per molecule, (d) an acrylate and/or methacrylate having a C2-12 alkyl group, and (e) acrylic acid or methacrylic acid. The above resin composition which contains a thermally conductive filler. A cured product and sheet using it.

Abstract: To provide a resin composition excellent in conformability to special shapes and in holding power without the need of containing a low molecular softener such as a plasticizer, other than a polysiloxane, and a cured product and a sheet using it. A resin composition characterized by comprising (a) an acrylic rubber, (b) a compound containing at least two mercapto groups per molecule, (c) a compound containing at least two acryloyl and/or methacryloyl groups per molecule, (d) an acrylate and/or methacrylate having a C2-12 alkyl group, and (e) acrylic acid or methacrylic acid. The above resin composition which contains a thermally conductive filler. A cured product and sheet using it.

Abstract: A curable resin composition comprising: (1) a compound having a structure of the formula (A) and/or (B): R2—OOC—R1—COO—R2′  (A)  wherein R1 is —(CH2)n— (wherein n is from 4 to 6), or an o-, m- or p-phenylene group, and each of R2 and R2′ is a C1-10 alkyl group,  wherein R3 is a C1-4 alkyl group, (2) a polymerizable vinyl monomer, (3) an organic peroxide, (4) a reducing agent, and (5) an elastomer component.

Abstract: A curable resin composition comprising (1) a polymerizable vinyl monomer, (2) a polymerization initiator, (3) an aromatic amine and/or a pyridine derivative, (4) a &bgr;-diketone elate and/or a &bgr;-keto-ester, and (5) a phosphate.

Abstract: A curable resin composition comprising (1) a polymerizable vinyl monomer, (2) a polymerization initiator, (3) an aromatic amine and/or a pyridine derivative, (4) a .beta.-diketone chelate and/or a .beta.-keto-ester, and (5) a phosphate.

Abstract: A curable resin composition comprising:(1) a polymerizable vinyl monomer having a structure of the formula (A):Z--R--(R.sub.2 O).sub.p --R.sub.1 (A)wherein Z is a (meth)acryloyl group, R.sub.1 is a phenyl group or a phenyl group having a C.sub.1-3 alkyl group, R.sub.2 is --C.sub.2 H.sub.4 --, --C.sub.3 H.sub.6 --, --CH.sub.2 CH(CH.sub.3)--, --C.sub.4 H.sub.8 -- or --C.sub.6 H.sub.12 --, and p is an integer of from 1 to 10 and wherein R is a direct bond,(2) a polymerizable vinyl monomer having a structure of the formula (B): ##STR1## wherein Z and R.sub.2 are as defined above, R.sub.3 is hydrogen or a C.sub.1-4 alkyl group, and q is an integer of from 0 to 8,(3) a polymerizable vinyl monomer having a structure of the formula (C):Z--O--(R.sub.2 O).sub.p --H (C)wherein Z, R.sub.2 and p are as defined above,(4) an organic peroxide, and(5) a reducing agent.

Abstract: A slip processing method for simplifying a processing of a job which uses a form of a predetermined format at a frequency of once a long term such as month, quarter or year and in which an input form is changed at a frequency of once per several times of use. The method comprises storing format information of an input form and data information in one file, providing a format of the input form including a plurality of tables each comprising a plurality of items (cells), storing data in corresponding ones of the items, executing a retrieval of the items and a totalization of data in the items with referencing a file which stores the format information and the data of the input form and storing the format information and the data of the input form and the processed information in a form which is transmittable through a network.

Abstract: An adhesive composition comprising an acrylate monomer and/or a methacrylate monomer, an organic peroxide and a reducing agent, which contains zeolite or calcium oxide.

Abstract: A two-part adhesive consisting of a first liquid comprising 100 parts by weight of a polymerizable vinyl monomer and from 0.1 to 20 parts by weight of an organic peroxide and a second liquid comprising 100 parts by weight of a polymerizable vinyl monomer and from 0.05 to 15 parts by weight of a reducing agent, wherein either one or both of the first and second liquids contain from 0.4 to 5% by weight of water, and the content of water is more than 0.2% by weight based on the total amount of the first and second liquids.

Abstract: A two-part adhesive consisting of a first liquid comprising 100 parts by weight of a polymerizable vinyl monomer and from 0.1 to 20 parts by weight of an organic peroxide and a second liquid comprising 100 parts by weight of a polymerizable vinyl monomer and from 0.05 to 15 parts by weight of a reducing agent, wherein either one or both of the first and second liquids contain from 0.4 to 5% by weight of water, and the content of water is more than 0.2% by weight based on the total amount of the first and second liquids.