Abstract: An information processing system includes an identification unit configured to identify unique information on shoes using at least part of a captured image of the shoes, and a setting unit configured to set an association between an acquisition device configured to acquire the unique information and a module device attached to the shoes based on the unique information.

Abstract: A surface light source device includes a light source; a light guide plate that has a light entrance surface through which light enters, and that emits the light entering through the light entrance surface from a light exit surface; a wiring board; and a metal frame. The metal frame includes a bottom portion having a bottom surface that faces a surface on an opposite side to the light exit surface, a side wall erected on an outer periphery of the bottom surface, and a projecting portion provided on the side wall so as to project toward the bottom surface side. The metal frame houses the light source, the light guide plate, and the wiring board. At least a part of the light source is disposed between the bottom portion and the projecting portion, and the wiring board is disposed between the light source and the bottom portion.

Abstract: A frame includes a resin frame which surrounds at least a part of the side faces of a light guide plate; a reflection diffusion material which is added in the resin frame and reflects and diffuses light; and an absorption material which is added in the resin frame and absorbs light. The reflectance of the resin frame is equal to or greater than 30% and equal to or smaller than 80%.

Abstract: A surface light source device includes a light source; a light guide plate that has a light entrance surface through which light enters, and that emits the light entering through the light entrance surface from a light exit surface; a wiring board; and a metal frame. The metal frame includes a bottom portion having a bottom surface that faces a surface on an opposite side to the light exit surface, a side wall erected on an outer periphery of the bottom surface, and a projecting portion provided on the side wall so as to project toward the bottom surface side. The metal frame houses the light source, the light guide plate, and the wiring board. At least a part of the light source is disposed between the bottom portion and the projecting portion, and the wiring board is disposed between the light source and the bottom portion.

Abstract: A frame includes a resin frame which surrounds at least a part of the side faces of a light guide plate; a reflection diffusion material which is added in the resin frame and reflects and diffuses light; and an absorption material which is added in the resin frame and absorbs light. The reflectance of the resin frame is equal to or greater than 30% and equal to or smaller than 80%.

Abstract: A half mirror includes a silver layer and an anti-aggregation layer in contact with the silver layer. The anti-aggregation layer may be composed of ITO or IGO. Alternatively, the anti-aggregation layer may be composed of an organic molecular film having a thiol group. Alternatively, the anti-aggregation layer may be composed of an alloy including silver in an amount of 97% or more and an element X, in which the element X is any one of Au, Mg, Zn, Cu, Al, Si, Pd, Sn, Pt, Ti, and Cr.

Abstract: A mold structure has a first mold, a second mold relatively connectable to and disconnectable from the first mold, a heater on at least one of the first and second molds, a transfer member on at least one of the first and second molds, that is relatively movable and separable from the at least one of the first and second molds on which the transfer member is disposed, a transfer surface formed on the transfer member that is placed in contact with a resin sheet fed between the first and second molds to perform transfer molding onto the resin sheet, and a moving mechanism that moves the at least one of the first and second molds on which the transfer member is disposed and the transfer member relative to each other.

Abstract: A die structure has a first die, a second die that comes in contact with and separate from the first die, a heating unit provided in at least one of the first and second dies, and a transfer member provided in at least one of the first and second dies that brings a resin sheet supplied between the first and second dies into contact with a transfer surface and carrying out transfer molding, and a recess site formed on the transfer member near the transfer surface.

Abstract: A liquid crystal apparatus includes a substrate that includes a convex portion on one surface, a liquid crystal layer that is arranged on the one surface side of the substrate, an inorganic alignment film that is arranged between the substrate and the liquid crystal layer, and has a column structure inclined to the one surface of the substrate, and an organic alignment film, in which the inorganic alignment film has a concave portion of which a thickness becomes thin in at least a portion of the column structure, at a position to be in contact with a portion that does not face an inclined direction side of the column structure in a side surface of the convex portion, and the organic alignment film is arranged in the concave portion.

Abstract: A transfer molding method includes supplying melted resin to a first metallic mold, conveying the first metallic mold onto which the resin was supplied to a position opposing a second metallic mold, performing transfer molding by sandwiching the resin between the two metallic molds, and cooling the resin after performing transfer molding. The performing transfer molding includes discharging residual air that remains in a recess via a groove portion.

Abstract: An area light source device has a transfer-molded optical member, and a light source disposed in a position facing at least one of end faces of the optical member. Light incident to the optical member from the light source is output through a light exit surface of the optical member. A cutting back clearance portion is provided in at least one of corner portions of the end face of the optical member.

Abstract: A photoelectric hybrid device includes an optical connector on a flat optical surface at one end of vertical optical waveguides for inputting and outputting an optical signal. Integration of the photoelectric hybrid device into an interposer or the like is standardized. The photoelectric hybrid device includes: conductive pins connected to an electric signal pathway for a photoelectric hybrid substrate; a translucent member having a flat optical surface and a translucent part; and self-organizing optical waveguides that form an optical path between the translucent part and an optical waveguide. The flat optical surface is not lower than the tops of the electrical connection parts on the conductive pins. Collision of the optical connector and the tops of the electrical connection parts can be avoided when an optical connector on which an optical waveguide that transmits an optical signal among the optical waveguides.

Abstract: A planar light source apparatus has a light guide plate, a light source arranged on a side face of the light guide plate, a mounting substrate on which the light source is mounted, and a frame body that holds the light guide plate. The frame body has a plurality of projection portions on an inner side of the frame body. The light source is arranged between the projection portions. The frame body, the mounting substrate, and the light guide plate are fixed via a fixing member. The light source has a pair of electrode terminals. The mounting substrate has a land portion on which the electrode terminals are mounted. Connection portions are provided by which the electrode terminals and the land portion are electrically connected. The projection portions have a thickness defined by a surface on the mounting substrate side and an opposite surface relative thereto.

Abstract: A liquid crystal apparatus includes a substrate that includes a convex portion on one surface, a liquid crystal layer that is arranged on the one surface side of the substrate, an inorganic alignment film that is arranged between the substrate and the liquid crystal layer, and has a column structure inclined to the one surface of the substrate, and an organic alignment film, in which the inorganic alignment film has a concave portion of which a thickness becomes thin in at least a portion of the column structure, at a position to be in contact with a portion that does not face an inclined direction side of the column structure in a side surface of the convex portion, and the organic alignment film is arranged in the concave portion.

Abstract: Provided is a method of manufacturing a liquid crystal device including a liquid crystal layer interposed between a pair of substrates in which an alignment layer that is formed of an organosilane compound, and a porous layer provided under the alignment layer are formed on a surface, which faces the liquid crystal layer, of at least one of the pair of substrates. The method includes applying a coating solution containing the organosilane compound, to a surface of the porous layer; forming a coated film, in a state in which the coating solution infiltrates into the porous layer; drying the coated film; and baking the coated film. The alignment layer is formed, on the surface of the porous layer, to have a thickness less than a diameter of a hole in the porous layer.

Abstract: A manufacturing method for a liquid crystal device having a liquid crystal layer held between a pair of substrates in which an internal carbon concentration of a porous layer is 20% or more based on a surface carbon concentration of the porous layer when an alignment layer containing an organosilane compound and the porous layer disposed on a lower side of the alignment layer are formed on at least one surface, which is opposed to the liquid crystal layer, of the pair of the substrates.

Abstract: A transfer molding method has a transfer molding step of performing transfer molding to a resin sheet between a first die and a second die, which are disposed while facing each other, by heating at least one of the first and second dies, and a cooling step of cooling the resin sheet. The cooling step includes a first cooling step of cooling the resin sheet while an applied pressure is maintained at a first setting value smaller than a value of an applied pressure in the transfer molding step, and a second cooling step of cooling the resin sheet while the applied pressure is reduced to a second setting value smaller than the first setting value.

Abstract: In a photoelectric hybrid device, an optical connector is mounted on a flat optical surface provided on one end of vertical optical waveguides for inputting and outputting an optical signal, and along with making integration of the photoelectric hybrid device into an interposer or the like easy, integration is standardized. The photoelectric hybrid device is provided with: conductive pins (108) that are connected to an electric signal pathway for a photoelectric hybrid substrate; a translucent member (116) that has a flat optical surface and also has a translucent part (118); and a plurality of self organizing optical waveguides (122) that form an optical path between the translucent part (118) and an optical waveguide of the photoelectric hybrid substrate.

Abstract: A mold structure has a first mold, a second mold relatively connectable to and disconnectable from the first mold, a heater on at least one of the first and second molds, a transfer member on at least one of the first and second molds, that is relatively movable and separable from the at least one of the first and second molds on which the transfer member is disposed, a transfer surface formed on the transfer member that is placed in contact with a resin sheet fed between the first and second molds to perform transfer molding onto the resin sheet, and a moving mechanism that moves the at least one of the first and second molds on which the transfer member is disposed and the transfer member relative to each other.

Abstract: A transfer molding method includes an insertion step of inserting a resin sheet between a first die and a second die, which are disposed opposite each other, a sandwiching step of sandwiching the resin sheet between the first and second dies while a transfer surface of a transfer member is brought into contact with at least one of surfaces of the resin sheet, and a transfer molding step of heating at least one of the first and second dies to melt at least a surface portion of the resin sheet with which the transfer surface of the transfer member is brought into contact, and exhausting residual air remaining in a recess through a groove portion connected to the recess when a thick portion is formed by the recess formed in the transfer surface.