Abstract: A glass body manufacturing apparatus includes: a first heating furnace including a furnace core tube accommodating the soot and a first heater, to supply a dehydration gas into the furnace core tube and heat the soot at a first treatment temperature lower than a softening point of the porous portion by the first heater; a second heating furnace including a structural body accommodating the soot and a second heater, to heat the soot at a second treatment temperature equal to or higher than the softening point by the second heater; and a conveyance container, connectable to each of the first and second heating furnaces while keeping airtightness with respect to the atmosphere, to accommodate and hold the soot, and convey the soot between the first and second heating furnaces.

Abstract: A glass body manufacturing apparatus includes: a first heating furnace including a furnace core tube accommodating the soot and a first heater, to supply a dehydration gas into the furnace core tube and heat the soot at a first treatment temperature lower than a softening point of the porous portion by the first heater; a second heating furnace including a structural body accommodating the soot and a second heater, to heat the soot at a second treatment temperature equal to or higher than the softening point by the second heater; and a conveyance container, connectable to each of the first and second heating furnaces while keeping airtightness with respect to the atmosphere, to accommodate and hold the soot, and convey the soot between the first and second heating furnaces.

Abstract: A method for forming an activated trace on both of a first and second contact point surface or either a first or second contact point surface by applying vibration while applying an electric current, wherein a first contact point electrically is connected to a first external terminal and a second contact point electrically connected to a second external terminal being aligned opposed to said a first contact point in pair. And an electrical components such as a thermal protector, a cellular phone and a notebook personal computer in the like which adopted the process.

Abstract: An electrode for a semiconductor device superior in die-bonding and wire-bonding characteristics with a submount and its manufacturing method are provided. The electrode is formed by ohmic-contacting the surface of a semiconductor, which comprises a substrate electrode E1 having a layer structure formed on the surface of the semiconductor and a surface electrode E2 formed by covering the surface and/or side face of the substrate electrode E1. The surface electrode is manufactured by a vacuum evaporation system or sputtering system provided with a holder which is tilted with respect to a material of the surface electrode and able to rotate on its axis and orbit the material.

Abstract: Provided is a etch mask that prevents the separation of the etch mask which occurs in the vicinity of an end portion of a material to be etched during etching step. The etch mask is one formed on a surface of a material to be etched and comprising collected linear masks. A portion of a linear mask positioned in the vicinity of an end portion of the material to be etched becomes a wider portion as compared with the remaining portion or a zigzag portion. As required, the middle portion of the linear mask also becomes a wider portion or a zigzag portion.

Abstract: A vapor phase growth system comprises a gas-drive motor including a ring-shaped stator and a rotor housed in a rotor chamber formed in the stator, and designed to rotate the rotor by injecting a gas toward gas receiving grooves in the peripheral surface of the rotor through injection ports which open in the peripheral surface of the rotor chamber. A rotating shaft of a susceptor rotating mechanism extends along the axis of a susceptor in a reactor, and has one end fixed to the top wall of the susceptor. A tray rotating shaft, having one end fixed to each of trays arranged individually in recesses in the outer surface of the susceptor, extends penetrating the peripheral wall of the susceptor. As a rotating shaft of a drive mechanism rotates, a wafer supported by each tray revolves around the rotating shaft.