Abstract: A semiconductor sensor includes an adhesive film for suppressing thermal stress transfer to a semiconductor sensor chip. More specifically, the adhesive film includes a first layer and a second layer. An elasticity modulus of the first layer is lower than that of the second layer, and the second layer has a water absorption smaller than that of the first layer. One surface of a semiconductor wafer is in contact with the first layer. Once the semiconductor wafer and the adhesive film are diced into a plurality of sensor chips, the sensor chip with the adhesive film is mounted on a sensor package via the second layer interposed therebetween.

Abstract: A semiconductor sensor includes an adhesive film for suppressing thermal stress transfer to a semiconductor sensor chip. More specifically, the adhesive film includes a first layer and a second layer. An elasticity modulus of the first layer is lower than that of the second layer, and the second layer has a water absorption smaller than that of the first layer. One surface of a semiconductor wafer is in contact with the first layer. Once the semiconductor wafer and the adhesive film are diced into a plurality of sensor chips, the sensor chip with the adhesive film is mounted on a sensor package via the second layer interposed therebetween.

Abstract: An acceleration sensor includes a sensor chip having a substrate, a movable electrode supported with respect to the substrate to have a displacement in a direction of acceleration, and a fixed electrode facing the movable electrode with a detection gap. The sensor chip is mounted on a package through an adhesive member. The adhesive member is disposed in such a manner that the disposed area is larger in a direction perpendicular to the acceleration direction than in the acceleration direction. Such a layout of the adhesive member prevents the substrate of the sensor chip from being warped in the acceleration direction by thermal stress. Therefore, the detection gap hardly varies with temperature.

Abstract: A physical quantity sensor for detecting physical quantity includes a substrate having an opening; a beam protruding in the opening of the substrate and supported on the substrate; and a fixed electrode supported on the substrate. The beam is movable in a vertical direction of the substrate so that the physical quantity in the vertical direction is detectable. The sensor can be minimized, and has excellent output characteristics. Further, a manufacturing cost of the sensor is small.

Abstract: A physical quantity sensor for detecting physical quantity includes a substrate having an opening; a beam protruding in the opening of the substrate and supported on the substrate; and a fixed electrode supported on the substrate. The beam is movable in a vertical direction of the substrate so that the physical quantity in the vertical direction is detectable. The sensor can be minimized, and has excellent output characteristics. Further, a manufacturing cost of the sensor is small.