Patents by Inventor Koichi Tsunoda
Koichi Tsunoda has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240203972Abstract: Disclosed herein is an electronic component that includes: a substrate; a capacitor on the substrate; a first insulating resin layer embedding therein the capacitor; an inductor provided on the first insulating resin layer and connected to the capacitor, the inductor including a conductor pattern; a second insulating resin layer embedding therein the inductor; a third insulating resin layer on the second insulating resin layer; a post conductor having a lower end and an upper end and penetrating the third insulating resin layer such that the lower end of the post conductor is connected to the inductor; and a terminal electrode on the third insulating resin layer and connected to the upper end of the post conductor. In a thickness direction of the substrate, the height of the post conductor is larger than a thickness of a conductor pattern constituting the inductor.Type: ApplicationFiled: February 28, 2024Publication date: June 20, 2024Applicant: TDK CorporationInventors: Kazuhiro YOSHIKAWA, Takeshi OOHASHI, Koichi TSUNODA, Mitsuhiro TOMIKAWA
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Patent number: 11884309Abstract: A railcar air conditioning duct according to one aspect which guides air fed from an air conditioner mounted on a railcar. The railcar includes: a duct wall forming an air flow passage which guides air in a car longitudinal direction; and a plurality of through holes lined up in the car longitudinal direction, the through holes being open at the duct wall as air outlet ports through which the air in the air flow passage is blown from the air flow passage toward a passenger room. A ratio of an opening area of one of the through holes to an area of one of a plurality of partial regions formed by dividing, in the car longitudinal direction, an inner surface of a lower wall portion such that in plan view, the regions contain the respective through holes falls within a range of 2.0% or more and 7.5% or less.Type: GrantFiled: August 30, 2019Date of Patent: January 30, 2024Assignee: KAWASAKI RAILCAR MANUFACTURING CO., LTD.Inventors: Koichi Tsunoda, Tomoki Nagai, Takashi Sasaki
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Patent number: 11841889Abstract: A user interface displays: a first column comprising non-editable input strings retrieved from a data field; a second column comprising editable output strings initialized from the data field; and an expression window displaying a transformation function ƒ. The computer iteratively processes user inputs, each user input i providing a sample row transformation to edit an ith output string ti. Some user inputs i designate a contiguous substring ssi of the corresponding input string si. The contiguous substring expresses a causal basis for transforming the input string si. into the output string ti. The computer updates the transformation function ƒ according to the provided sample row transformations so that: ƒ(s1)=t1, . . . , ƒ(si)=ti; the transformation function ƒ specifies text or string position of at least one contiguous substring; and ƒ has minimal branching among possible transformation functions that satisfy the samples.Type: GrantFiled: January 13, 2022Date of Patent: December 12, 2023Assignee: Tableau Software, LLCInventors: Anushka Anand, Michael John Arvold, Hailei Chen, Daniel Philip Cory, Daniel William Deklotz, Abhishek Joshi, John Diaa Fahmy Morcos, Randall Moss, Miranda Rose Rensch, Koichi Tsunoda
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Publication number: 20230060995Abstract: Disclosed herein is an electronic component that includes an element body having a structure in which a plurality of conductor layers are stacked in a first direction on a surface of a substrate with insulating layers interposed therebetween, and a plurality of terminal electrodes provided on a mounting surface of the element body. The mounting surface extends in the first direction and in a second direction perpendicular to the first direction. The element body includes an inductor constituted by the plurality of conductor layers and has a coil axis extending in a third direction perpendicular to both the first and second directions.Type: ApplicationFiled: August 26, 2022Publication date: March 2, 2023Inventors: Kazuhiro YOSHIKAWA, Takeshi OOHASHI, Mitsuhiro TOMIKAWA, Koichi TSUNODA
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Patent number: 11367626Abstract: A first insulating layer, a conductor layer included on a first main surface, an electronic component included on the first main surface and a second insulating layer stacked on the first insulating layer are included, a stacking direction of the first insulating layer and the second insulating layer is the same as a stacking direction of a first electrode layer, a second electrode layer, and the dielectric layer in the electronic component, and a height position of a main surface of the electronic component on an opposite side from a side of the first main surface is different from a height position of a main surface of the conductor layer adjacent to the electronic component on an opposite side from a side of the first main surface in the stacking direction.Type: GrantFiled: March 16, 2018Date of Patent: June 21, 2022Assignee: TDK CORPORATIONInventors: Mitsuhiro Tomikawa, Kazuhiro Yoshikawa, Koichi Tsunoda, Kenichi Yoshida
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Patent number: 11276531Abstract: A thin-film capacitor includes an insulating base member, and a capacitance portion that is laminated on the insulating base member has a plurality of internal electrode layers which are laminated on the insulating base member and are provided in a lamination direction and dielectric layers which are sandwiched between the internal electrode layers. A relative dielectric constant of the dielectric layers is 100 or higher.Type: GrantFiled: May 16, 2018Date of Patent: March 15, 2022Assignee: TDK CorporationInventors: Koichi Tsunoda, Kazuhiro Yoshikawa, Mitsuhiro Tomikawa, Kenichi Yoshida
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Publication number: 20210323585Abstract: A railcar air conditioning duct according to one aspect which guides air fed from an air conditioner mounted on a railcar. The railcar includes: a duct wall forming an air flow passage which guides air in a car longitudinal direction; and a plurality of through holes lined up in the car longitudinal direction, the through holes being open at the duct wall as air outlet ports through which the air in the air flow passage is blown from the air flow passage toward a passenger room. A ratio of an opening area of one of the through holes to an area of one of a plurality of partial regions formed by dividing, in the car longitudinal direction, an inner surface of a lower wall portion such that in plan view, the regions contain the respective through holes falls within a range of 2.0% or more and 7.5% or less.Type: ApplicationFiled: August 30, 2019Publication date: October 21, 2021Inventors: Koichi TSUNODA, Tomoki NAGAI, Takashi SASAKI
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Patent number: 11114249Abstract: In a thin-film capacitor, an electrode terminal layer and an electrode layer of a capacitor portion are connected to electrode terminals by via conductors that is formed to penetrate an insulating layer in a thickness direction thereof, and a short circuit wiring in the thickness direction is realized by the via conductors. In the thin-film capacitor, an increase in the number of terminals in the plurality of electrode terminals is achieved, a decrease in length of a circuit wiring is achieved, and thus a thin-film capacitor with low-ESL has been achieved.Type: GrantFiled: February 13, 2018Date of Patent: September 7, 2021Assignee: TDK CorporationInventors: Koichi Tsunoda, Mitsuhiro Tomikawa, Kazuhiro Yoshikawa, Kenichi Yoshida
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Patent number: 10950389Abstract: A thin-film capacitor satisfies a relationship of CTE1>CTE2>CTE3 regarding a linear expansion coefficient CTE1 of a base, a linear expansion coefficient CTE2 of a capacitance unit, and a linear expansion coefficient CTE3 of a barrier layer. The inventors have newly found that in a case in which such a relationship is satisfied, when a temperature falls from a deposition temperature, cracking occurring in the capacitance unit of the thin-film capacitor is prevented, and cracking occurring in the barrier layer is also prevented.Type: GrantFiled: March 21, 2019Date of Patent: March 16, 2021Assignee: TDK CORPORATIONInventors: Daiki Ishii, Kazuhiro Yoshikawa, Koichi Tsunoda, Mitsuhiro Tomikawa, Junki Nakamoto, Kenichi Yoshida
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Patent number: 10813220Abstract: An electronic component embedded substrate includes: a substrate that includes an insulating layer and has a first principal surface and a second principal surface; an electronic component that is embedded in the substrate and has at least one first terminal, at least one second terminal, and a capacity part; at least one via conductor that are formed in the insulating layer and electrically connected to the second terminal; and an adhesion layer that is in contact with the second terminal on an end face of the second terminal which are close to the second principal surface. The electronic component is laminated with the insulating layer, and adhesion strength between the adhesion layer and the insulating layer is higher than that between the second terminal and the insulating layer.Type: GrantFiled: February 9, 2018Date of Patent: October 20, 2020Assignee: TDK CORPORATIONInventors: Mitsuhiro Tomikawa, Koichi Tsunoda, Kazuhiro Yoshikawa, Kenichi Yoshida
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Publication number: 20200258690Abstract: A thin-film capacitor includes an insulating base member, and a capacitance portion that is laminated on the insulating base member has a plurality of internal electrode layers which are laminated on the insulating base member and are provided in a lamination direction and dielectric layers which are sandwiched between the internal electrode layers. A relative dielectric constant of the dielectric layers is 100 or higher.Type: ApplicationFiled: May 16, 2018Publication date: August 13, 2020Applicant: TDK CorporationInventors: Koichi TSUNODA, Kazuhiro YOSHIKAWA, Mitsuhiro TOMIKAWA, Kenichi YOSHIDA
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Publication number: 20200043751Abstract: A first insulating layer, a conductor layer included on a first main surface, an electronic component included on the first main surface and a second insulating layer stacked on the first insulating layer are included, a stacking direction of the first insulating layer and the second insulating layer is the same as a stacking direction of a first electrode layer, a second electrode layer, and the dielectric layer in the electronic component, and a height position of a main surface of the electronic component on an opposite side from a side of the first main surface is different from a height position of a main surface of the conductor layer adjacent to the electronic component on an opposite side from a side of the first main surface in the stacking direction.Type: ApplicationFiled: March 16, 2018Publication date: February 6, 2020Applicant: TDK CORPORATIONInventors: Mitsuhiro TOMIKAWA, Kazuhiro YOSHIKAWA, Koichi TSUNODA, Kenichi YOSHIDA
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Publication number: 20200013554Abstract: In a thin-film capacitor, an electrode terminal layer and an electrode layer of a capacitor portion are connected to electrode terminals by via conductors that is formed to penetrate an insulating layer in a thickness direction thereof, and a short circuit wiring in the thickness direction is realized by the via conductors. In the thin-film capacitor, an increase in the number of terminals in the plurality of electrode terminals is achieved, a decrease in length of a circuit wiring is achieved, and thus a thin-film capacitor with low-ESL has been achieved.Type: ApplicationFiled: February 13, 2018Publication date: January 9, 2020Applicant: TDK CorporationInventors: Koichi TSUNODA, Mitsuhiro TOMIKAWA, Kazuhiro YOSHIKAWA, Kenichi YOSHIDA
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Patent number: 10483345Abstract: An electronic component embedded substrate includes: a substrate that includes an insulating layer and has a first principal surface and a second principal surface on the opposite side of the first principal surface; and an electronic component that is embedded in the substrate and has a plurality of first terminals provided close to the first principal surface, a plurality of second terminals provided close to the second principal surface, and a capacity part provided between the plurality of first terminals and the plurality of second terminals. The electronic component is configured such that at least a part of the second terminals is embedded in the insulating layer. An insulating member is provided between the neighboring second terminals to be in contact with both of the neighboring second terminals. The insulating member and the insulating layer are formed of materials whose thermal expansion coefficients are different from each other.Type: GrantFiled: February 8, 2018Date of Patent: November 19, 2019Assignee: TDK CORPORATIONInventors: Mitsuhiro Tomikawa, Koichi Tsunoda, Kazuhiro Yoshikawa, Kenichi Yoshida
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Publication number: 20190304701Abstract: A thin-film capacitor satisfies a relationship of CTE1>CTE2>CTE3 regarding a linear expansion coefficient CTE1 of a base, a linear expansion coefficient CTE2 of a capacitance unit, and a linear expansion coefficient CTE3 of a barrier layer. The inventors have newly found that in a case in which such a relationship is satisfied, when a temperature falls from a deposition temperature, cracking occurring in the capacitance unit of the thin-film capacitor is prevented, and cracking occurring in the barrier layer is also prevented.Type: ApplicationFiled: March 21, 2019Publication date: October 3, 2019Applicant: TDK CORPORATIONInventors: Daiki ISHII, Kazuhiro YOSHIKAWA, Koichi TSUNODA, Mitsuhiro TOMIKAWA, Junki NAKAMOTO, Kenichi YOSHIDA
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Patent number: 10361057Abstract: Provided is an X-ray generating apparatus, which includes: an X-ray generating tube configured to emit X-rays through a first window; an outer case configured to contain the X-ray generating tube and provided with a second window transmitting the X-rays at a position facing the first window; an insulating fluid with which an unoccupied space of the outer case is filled; an insulating member located between the first window and the second window and provided with an opening in an irradiation area of the X-ray through the first window; and an insulating third window removably fit into the opening of the insulating member, wherein a linear expansion coefficient of the third window is greater than a linear expansion coefficient of the insulating member, and the third window and the first window face each other via a gap through which the insulating fluid is flowable.Type: GrantFiled: July 21, 2016Date of Patent: July 23, 2019Assignee: Canon Kabushiki KaishaInventors: Koichi Tsunoda, Koji Yamazaki, Shuji Aoki, Kazuyuki Ueda
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Patent number: 10340088Abstract: In a thin-film capacitor, an electrode terminal layer is divided into a plurality of parts by a penetration portion, and includes a frame portion as one divided part. The frame portion is disposed along an outer edge of the electrode terminal layer when viewed from the bottom surface side of the electrode terminal layer, and the frame portion can hinder deformation of the electrode terminal layer stretching or warping in a thickness direction or an in-plane direction, whereby such deformation can be prevented. Accordingly, in the thin-film capacitor, the electrode terminal layer is not likely to be deformed and an improvement in strength thereof is achieved.Type: GrantFiled: February 20, 2018Date of Patent: July 2, 2019Assignee: TDK CORPORATIONInventors: Koichi Tsunoda, Mitsuhiro Tomikawa, Kazuhiro Yoshikawa, Kenichi Yoshida
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Publication number: 20180240599Abstract: In a thin-film capacitor, an electrode terminal layer is divided into a plurality of parts by a penetration portion, and includes a frame portion as one divided part. The frame portion is disposed along an outer edge of the electrode terminal layer when viewed from the bottom surface side of the electrode terminal layer, and the frame portion can hinder deformation of the electrode terminal layer stretching or warping in a thickness direction or an in-plane direction, whereby such deformation can be prevented. Accordingly, in the thin-film capacitor, the electrode terminal layer is not likely to be deformed and an improvement in strength thereof is achieved.Type: ApplicationFiled: February 20, 2018Publication date: August 23, 2018Applicant: TDK CORPORATIONInventors: Koichi TSUNODA, Mitsuhiro TOMIKAWA, Kazuhiro YOSHIKAWA, Kenichi YOSHIDA
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Publication number: 20180233553Abstract: An electronic component embedded substrate includes: a substrate that includes an insulating layer and has a first principal surface and a second principal surface on the opposite side of the first principal surface; and an electronic component that is embedded in the substrate and has a plurality of first terminals provided close to the first principal surface, a plurality of second terminals provided close to the second principal surface, and a capacity part provided between the plurality of first terminals and the plurality of second terminals. The electronic component is configured such that at least a part of the second terminals is embedded in the insulating layer. An insulating member is provided between the neighboring second terminals to be in contact with both of the neighboring second terminals. The insulating member and the insulating layer are formed of materials whose thermal expansion coefficients are different from each other.Type: ApplicationFiled: February 8, 2018Publication date: August 16, 2018Applicant: TDK CORPORATIONInventors: Mitsuhiro TOMIKAWA, Koichi TSUNODA, Kazuhiro YOSHIKAWA, Kenichi YOSHIDA
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Publication number: 20180235086Abstract: An electronic component embedded substrate includes: a substrate that includes an insulating layer and has a first principal surface and a second principal surface; an electronic component that is embedded in the substrate and has at least one first terminal, at least one second terminal, and a capacity part; at least one via conductor that are formed in the insulating layer and electrically connected to the second terminal; and an adhesion layer that is in contact with the second terminal on an end face of the second terminal which are close to the second principal surface. The electronic component is laminated with the insulating layer, and adhesion strength between the adhesion layer and the insulating layer is higher than that between the second terminal and the insulating layer.Type: ApplicationFiled: February 9, 2018Publication date: August 16, 2018Applicant: TDK CORPORATIONInventors: Mitsuhiro TOMIKAWA, Koichi TSUNODA, Kazuhiro YOSHIKAWA, Kenichi YOSHIDA