Abstract: A carrier, semiconductor device, and their mounting method which improve reliability such as heat cycle resistance of the semiconductor device mounted on a circuit board. A semiconductor device 1 comprises a carrier for semiconductor 3, and a cavity area is formed at an area of an external electrode 8 of the carrier for semiconductor 3. The external electrode 8 is disposed at the bottom of the concave portion. A solder paste 13 is supplied to the concave portion, the semiconductor device 1 is flipped, and the semiconductor device 1 is mounted on the circuit board 12. The semiconductor 1 mounted on the circuit board 12 is heated to the temperature above the melting point of the solder paste 13.

Abstract: An atmospheric oven containing an atmospheric gas kept at a predetermined purity accommodates a transport for transporting an object to be heated along a predetermined transporting path. A rectangular sectioned tubular body for preventing the gas from flowing outside the oven extends a certain length from an entrance of the oven and an exit of the oven and has a sectional area necessary for passing the object through the tubular body.

Abstract: An atmospheric oven containing an atmospheric gas kept at a predetermined purity and accommodates a transporting means for transport an object to be heated along a predetermined transporting path. A includes a cylindrical portion for preventing the gas from flowing outside the oven, extends in a certain length from an entrance of the oven and an exit of the oven and has a sectional area necessary for passing the object through the portion.