Abstract: The gas sensor is provided with: a base material; a first electrode and a second electrode arranged on the base material; and a gas detection member connected to the first electrode and the second electrode, wherein the gas detection member contains flaky particles of alkaline earth ferrite.

Abstract: A load sensor element includes a substrate made of a ceramic material; an inorganic layer having a surface configured to receive a load, the inorganic layer covers a portion of the substrate; a thin-layer resistance body whose resistance value changes in accordance with the load received by the inorganic layer, the thin-layer resistance body having a main body portion and a pair of end portions, the main body portion mounted on the covered portion of the substrate and sandwiched between the substrate and the inorganic layer, the pair of end portions mounted on an exposed portion of the substrate, and the exposed portion free of the inorganic layer; and a pair of electrodes electrically connected to the pair of end portions of the thin-layer resistance body and separated away from the inorganic layer and on one side of the substrate.

Abstract: This thick-film resistive element paste is a resistive element paste containing: an electrically conductive metal powder including a copper powder and a manganese powder; a glass powder; and an organic vehicle, and is characterized in that the glass powder contains primarily an alkaline-earth metal.

Abstract: This thick-film resistive element paste is a resistive element paste containing: an electrically conductive metal powder including a copper powder and a manganese powder; a glass powder; and an organic vehicle, and is characterized in that the glass powder contains primarily an alkaline-earth metal.

Abstract: The chip resistor 10 includes a ceramic substrate 11 that is shaped like a rectangular parallelepiped. Mounted on the lower surface of the ceramic substrate 11 are a resistive element 12 that is made mainly of a low-resistance, low-TCR copper-nickel alloy, first and second electrode layers 13, 14 that form a two-layer structure and cover both longitudinal ends of the resistive element 12, and an insulating protective layer 15 for covering the remaining area of the resistive element 12. The resistive element 12 is positioned within a region inside the peripheral border of the lower surface of the ceramic substrate 11. The chip resistor 10 also includes end-face electrodes 17 that are positioned on both longitudinal end faces of the ceramic substrate 11. The second electrode layers 14 and end-face electrodes 17 are covered by plating layers 18-21. This chip resistor 10 is to be face-down mounted with both electrode layers 13, 14 positioned on a wiring pattern 31 of a circuit board 30.

Abstract: Disclosed is a chip resistor 1 that includes a ceramic substrate 2, a pair of bank-raising foundation sections 3 positioned on both longitudinal ends of the lower surface of the ceramic substrate 2, a pair of first electrode layers 4 that cover at least parts of the bank-raising foundation sections 3 and are positioned at a predetermined distance from each other, a resistive element 5 that is made mainly of a copper-nickel alloy to bridge the first electrode layers 4, a pair of second electrode layers 6 that cover the pair of first electrode layers 4, and an insulating protective layer 7 that covers the resistive element 5. Further, end-face electrodes 9 are positioned on both longitudinal end faces of the ceramic substrate 2. The second electrode layers 6 and end-face electrodes 9 are covered with plating layers 10-13. This chip resistor 1 is to be face-down mounted with the first and second electrodes 4, 6 positioned on a wiring pattern 21 of a circuit board 20.

Abstract: [Problem] To provide a chip resistor that is unlikely to suffer from mounting failure and capable of readily lowering its resistance. [Solution] Disclosed is a chip resistor 1 that includes a ceramic substrate 2, a pair of bank-raising foundation sections 3 positioned on both longitudinal ends of the lower surface of the ceramic substrate 2, a pair of first electrode layers 4 that cover at least parts of the bank-raising foundation sections 3 and are positioned at a predetermined distance from each other, a resistive element 5 that is made mainly of a copper-nickel alloy to bridge the first electrode layers 4, a pair of second electrode layers 6 that cover the pair of first electrode layers 4, and an insulating protective layer 7 that covers the resistive element 5. Further, end-face electrodes 9 are positioned on both longitudinal end faces of the ceramic substrate 2. The second electrode layers 6 and end-face electrodes 9 are covered with plating layers 10-13.

Abstract: [Problem] To provide a chip resistor that readily lowers its resistance and exhibits excellent manufacturing yield. [Solution] The chip resistor 10 includes a ceramic substrate 11 that is shaped like a rectangular parallelepiped. Mounted on the lower surface of the ceramic substrate 11 are a resistive element 12 that is made mainly of a low-resistance, low-TCR copper-nickel alloy, first and second electrode layers 13, 14 that form a two-layer structure and cover both longitudinal ends of the resistive element 12, and an insulating protective layer 15 for covering the remaining area of the resistive element 12. The resistive element 12 is positioned within a region inside the peripheral border of the lower surface of the ceramic substrate 11. The chip resistor 10 also includes end-face electrodes 17 that are positioned on both longitudinal end faces of the ceramic substrate 11. The second electrode layers 14 and end-face electrodes 17 are covered by plating layers 18-21.

Abstract: A control system for effecting ultra-precision temperature control for a controlled system having large load fluctuations or including a dead time component. A control unit (5) instructs a high-precision PID temperature controller (10) to renew and correct a control target value T.sub.0,NEW for the supply fluid temperature T.sub.0 only by a temperature difference .DELTA.T=T.sub.C -T.sub.2 between a set value T.sub.C for the return fluid temperature T.sub.2 of a heat transfer fluid and the actually controlled return fluid temperature T.sub.2. In response to the instruction, the high-precision PID temperature controller (10) controls the heating power of a heater (17) for heating control through a constant-power thyristor phase controller (16). The heater (17) heats the heat transfer fluid and sends it to a machining apparatus (1) through a closed damping tank (21). The heat transfer fluid exchanges heat with the machining apparatus (1) and is then returned to a precooling means.

Abstract: A temperature control apparatus for a machine tool includes four temperature sensors for detecting a reference temperature, outlet temperature of heat transfer fluid at an outlet of a heat exchanger, and temperatures of the heat transfer fluid at both inlet and an outlet of a machine tool element having a heat generating source. The four temperature sensors are arranged to constitute a differential temperature detecting means that activates control means to control temperature of the heat transfer fluid from the heat exchanger so as to minimize both deviations of heat transfer fluid temperature and steady-state deviations of machine tool body temperature.