Patents by Inventor Koichi Urano

Koichi Urano has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200189960
    Abstract: This thick-film resistive element paste is a resistive element paste containing: an electrically conductive metal powder including a copper powder and a manganese powder; a glass powder; and an organic vehicle, and is characterized in that the glass powder contains primarily an alkaline-earth metal.
    Type: Application
    Filed: August 22, 2018
    Publication date: June 18, 2020
    Inventors: Natsuki IGUCHI, Yuya IGUCHI, Koichi URANO
  • Patent number: 7782174
    Abstract: Disclosed is a chip resistor 1 that includes a ceramic substrate 2, a pair of bank-raising foundation sections 3 positioned on both longitudinal ends of the lower surface of the ceramic substrate 2, a pair of first electrode layers 4 that cover at least parts of the bank-raising foundation sections 3 and are positioned at a predetermined distance from each other, a resistive element 5 that is made mainly of a copper-nickel alloy to bridge the first electrode layers 4, a pair of second electrode layers 6 that cover the pair of first electrode layers 4, and an insulating protective layer 7 that covers the resistive element 5. Further, end-face electrodes 9 are positioned on both longitudinal end faces of the ceramic substrate 2. The second electrode layers 6 and end-face electrodes 9 are covered with plating layers 10-13. This chip resistor 1 is to be face-down mounted with the first and second electrodes 4, 6 positioned on a wiring pattern 21 of a circuit board 20.
    Type: Grant
    Filed: September 15, 2006
    Date of Patent: August 24, 2010
    Assignee: KOA Corporation
    Inventor: Koichi Urano
  • Patent number: 7782173
    Abstract: The chip resistor 10 includes a ceramic substrate 11 that is shaped like a rectangular parallelepiped. Mounted on the lower surface of the ceramic substrate 11 are a resistive element 12 that is made mainly of a low-resistance, low-TCR copper-nickel alloy, first and second electrode layers 13, 14 that form a two-layer structure and cover both longitudinal ends of the resistive element 12, and an insulating protective layer 15 for covering the remaining area of the resistive element 12. The resistive element 12 is positioned within a region inside the peripheral border of the lower surface of the ceramic substrate 11. The chip resistor 10 also includes end-face electrodes 17 that are positioned on both longitudinal end faces of the ceramic substrate 11. The second electrode layers 14 and end-face electrodes 17 are covered by plating layers 18-21. This chip resistor 10 is to be face-down mounted with both electrode layers 13, 14 positioned on a wiring pattern 31 of a circuit board 30.
    Type: Grant
    Filed: September 21, 2006
    Date of Patent: August 24, 2010
    Assignee: KOA Corporation
    Inventors: Koichi Urano, Yasushi Akahane
  • Publication number: 20090115569
    Abstract: [Problem] To provide a chip resistor that is unlikely to suffer from mounting failure and capable of readily lowering its resistance. [Solution] Disclosed is a chip resistor 1 that includes a ceramic substrate 2, a pair of bank-raising foundation sections 3 positioned on both longitudinal ends of the lower surface of the ceramic substrate 2, a pair of first electrode layers 4 that cover at least parts of the bank-raising foundation sections 3 and are positioned at a predetermined distance from each other, a resistive element 5 that is made mainly of a copper-nickel alloy to bridge the first electrode layers 4, a pair of second electrode layers 6 that cover the pair of first electrode layers 4, and an insulating protective layer 7 that covers the resistive element 5. Further, end-face electrodes 9 are positioned on both longitudinal end faces of the ceramic substrate 2. The second electrode layers 6 and end-face electrodes 9 are covered with plating layers 10-13.
    Type: Application
    Filed: September 15, 2006
    Publication date: May 7, 2009
    Applicant: KOA Corporation
    Inventor: Koichi Urano
  • Publication number: 20090108986
    Abstract: [Problem] To provide a chip resistor that readily lowers its resistance and exhibits excellent manufacturing yield. [Solution] The chip resistor 10 includes a ceramic substrate 11 that is shaped like a rectangular parallelepiped. Mounted on the lower surface of the ceramic substrate 11 are a resistive element 12 that is made mainly of a low-resistance, low-TCR copper-nickel alloy, first and second electrode layers 13, 14 that form a two-layer structure and cover both longitudinal ends of the resistive element 12, and an insulating protective layer 15 for covering the remaining area of the resistive element 12. The resistive element 12 is positioned within a region inside the peripheral border of the lower surface of the ceramic substrate 11. The chip resistor 10 also includes end-face electrodes 17 that are positioned on both longitudinal end faces of the ceramic substrate 11. The second electrode layers 14 and end-face electrodes 17 are covered by plating layers 18-21.
    Type: Application
    Filed: September 21, 2006
    Publication date: April 30, 2009
    Applicant: KOA CORPORATION
    Inventors: Koichi Urano, Yasushi Akahane
  • Patent number: 5476137
    Abstract: A control system for effecting ultra-precision temperature control for a controlled system having large load fluctuations or including a dead time component. A control unit (5) instructs a high-precision PID temperature controller (10) to renew and correct a control target value T.sub.0,NEW for the supply fluid temperature T.sub.0 only by a temperature difference .DELTA.T=T.sub.C -T.sub.2 between a set value T.sub.C for the return fluid temperature T.sub.2 of a heat transfer fluid and the actually controlled return fluid temperature T.sub.2. In response to the instruction, the high-precision PID temperature controller (10) controls the heating power of a heater (17) for heating control through a constant-power thyristor phase controller (16). The heater (17) heats the heat transfer fluid and sends it to a machining apparatus (1) through a closed damping tank (21). The heat transfer fluid exchanges heat with the machining apparatus (1) and is then returned to a precooling means.
    Type: Grant
    Filed: September 6, 1994
    Date of Patent: December 19, 1995
    Assignees: Toshiba Kikai Kabushiki Kaisha, Kanto Seiki Co., Ltd.
    Inventors: Akira Ochiai, Kouya Watanabe, Kyoichi Ebisawa, Koichi Urano
  • Patent number: 5197537
    Abstract: A temperature control apparatus for a machine tool includes four temperature sensors for detecting a reference temperature, outlet temperature of heat transfer fluid at an outlet of a heat exchanger, and temperatures of the heat transfer fluid at both inlet and an outlet of a machine tool element having a heat generating source. The four temperature sensors are arranged to constitute a differential temperature detecting means that activates control means to control temperature of the heat transfer fluid from the heat exchanger so as to minimize both deviations of heat transfer fluid temperature and steady-state deviations of machine tool body temperature.
    Type: Grant
    Filed: October 2, 1989
    Date of Patent: March 30, 1993
    Assignee: Kanto Seiki Co., Ltd.
    Inventors: Junji Chigira, Koichi Urano