Patents by Inventor Koichi Ushijima
Koichi Ushijima has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11502023Abstract: It is an object to reduce a difference in temperature of a refrigerant between an upstream side and a downstream side of a flow path even in a case where all semiconductor elements generate heat due to inverter operation and the like. A semiconductor device includes at least one semiconductor element, a base plate, a plurality of cooling fins, a jacket, and a partition. The partition is disposed below the plurality of cooling fins in the jacket. The partition has at least one inflow opening to allow the refrigerant having flowed in through the refrigerant inlet to flow through the plurality of cooling fins, and has a portion abutting the jacket on the side of the refrigerant inlet. The at least one inflow opening is located to correspond to the at least one semiconductor element.Type: GrantFiled: May 1, 2018Date of Patent: November 15, 2022Assignee: Mitsubishi Electric CorporationInventor: Koichi Ushijima
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Publication number: 20220216130Abstract: A semiconductor module includes a refrigerant jacket including a refrigerant passage thro ugh which a refrigerant circulates and an opening extending from an outer surface to the refrigerant passage, a base mounted on the refrigerant jacket and closing the opening, and a semiconductor element provided at the base. The base includes an annular peripheral wall positioned inside the opening, a bottom plate connected to an end portion of the peripheral wall on a side closer to the refrigerant passage, and a fin protrusion protruding from the bottom plate toward the inside of the refrigerant passage and formed on the bottom plate. The base has a recess formed with the peripheral wall and the bottom plate and extending toward the opening. The semiconductor element is disposed on the bottom plate inside the recess.Type: ApplicationFiled: July 26, 2019Publication date: July 7, 2022Applicant: Mitsubishi Electric CorporationInventor: Koichi USHIJIMA
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Publication number: 20220173012Abstract: The plurality of first active elements, the plurality of second active elements, and the passive element are disposed in a first range, a second range, and a third range in the first direction, respectively. The third range is between the first range and the second range. Pin fins are accommodated in an opening of a cooling jacket. The opening has a first outlet and a second outlet at a downstream end in a second direction. The first outlet and the second outlet are disposed in the first range and the second range, respectively. The cooling jacket has a flow dividing wall at a downstream end in the second direction. The flow dividing wall is disposed in the third range. The cooling jacket has a refrigerant introduction groove on a bottom surface.Type: ApplicationFiled: May 30, 2019Publication date: June 2, 2022Applicant: Mitsubishi Electric CorporationInventor: Koichi USHIJIMA
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Patent number: 10966348Abstract: An object is to provide a semiconductor cooling device which optimally keeps the mixing amount of microbubbles in the refrigerant and prevents the reduction of the cooling effect of the semiconductor module. The semiconductor cooling device includes a refrigerant circulation path through which refrigerant circulates, a heat exchanger provided on the refrigerant circulation path on which a semiconductor module is installable and configured to exchange heat between the refrigerant and the semiconductor module, a microbubble generator provided on the refrigerant circulation path, and configured to generate microbubbles in the refrigerant, a controller configured to control the microbubble generator, and a refrigerant sensor configured to measure a temperature, a flow rate, a flow velocity, or a pressure of the refrigerant circulating in the refrigerant circulation path.Type: GrantFiled: April 4, 2017Date of Patent: March 30, 2021Assignee: Mitsubishi Electric CorporationInventors: Koichi Ushijima, Shoji Saito
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Publication number: 20210057307Abstract: It is an object to reduce a difference in temperature of a refrigerant between an upstream side and a downstream side of a flow path even in a case where all semiconductor elements generate heat due to inverter operation and the like. A semiconductor device includes at least one semiconductor element, a base plate, a plurality of cooling fins, a jacket, and a partition. The partition is disposed below the plurality of cooling fins in the jacket. The partition has at least one inflow opening to allow the refrigerant having flowed in through the refrigerant inlet to flow through the plurality of cooling fins, and has a portion abutting the jacket on the side of the refrigerant inlet. The at least one inflow opening is located to correspond to the at least one semiconductor element.Type: ApplicationFiled: May 1, 2018Publication date: February 25, 2021Applicant: Mitsubishi Electric CorporationInventor: Koichi USHIJIMA
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Publication number: 20200243419Abstract: An object is to provide a semiconductor cooling device which optimally keeps the mixing amount of microbubbles in the refrigerant and prevents the reduction of the cooling effect of the semiconductor module. The semiconductor cooling device includes a refrigerant circulation path through which refrigerant circulates, a heat exchanger provided on the refrigerant circulation path on which a semiconductor module is installable and configured to exchange heat between the refrigerant and the semiconductor module, a microbubble generator provided on the refrigerant circulation path, and configured to generate microbubbles in the refrigerant, a controller configured to control the microbubble generator, and a refrigerant sensor configured to measure a temperature, a flow rate, a flow velocity, or a pressure of the refrigerant circulating the refrigerant circulation path.Type: ApplicationFiled: April 4, 2017Publication date: July 30, 2020Applicant: Mitsubishi Electric CorporationInventors: Koichi USHIJIMA, Shoji SAITO
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Patent number: 10462939Abstract: A semiconductor device includes a cooling jacket having an inlet for coolant and an outlet for the coolant, a base plate, a first semiconductor element provided on the base plate, a second semiconductor element provided on the base plate, a first fin provided directly under the first semiconductor element on a back surface of the base plate and placed within the cooling jacket, a second fin provided directly under the second semiconductor element on the back surface of the base plate and placed within the cooling jacket, and a separator provided within the cooling jacket to divide the coolant entering the cooling jacket through the inlet into portions respectively cooling the first fin and the second fin.Type: GrantFiled: January 22, 2015Date of Patent: October 29, 2019Assignee: Mitsubishi Electric CorporationInventor: Koichi Ushijima
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Patent number: 10340816Abstract: In the present invention, a lower arm control substrate, an insulation material and an upper arm control substrate are layered to be arranged in this order on a top surface of a small-sized power module. An upper arm main region and a lower arm main region are arranged to overlap the insulation material in plan view, and large parts of the upper arm main region and the lower arm main region overlap each other in plan view. The upper arm control substrate and the upper arm control substrate are configured with substrates of the same structure and the lower arm control substrate has a positional relation with the upper arm control substrate so as to be rotated by 180° from the upper arm control substrate in a horizontal direction.Type: GrantFiled: August 29, 2014Date of Patent: July 2, 2019Assignee: Mitsubishi Electric CorporationInventor: Koichi Ushijima
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Patent number: 9935034Abstract: A semiconductor module having a plurality of cooling fins and a fixing cooling fin longer than the plurality of cooling fins, the fixing cooling fin having a threaded hole provided in distal end portion thereof, a cooling jacket having a cooling medium passage in which the plurality of cooling fins and the fixing cooling fin are housed, and an opening formed so as to enable a screw to be inserted in the threaded hole, and a screw passed through the opening to be inserted in the threaded hole, the cooling jacket being fixed to the semiconductor module with the screw are provided.Type: GrantFiled: March 31, 2017Date of Patent: April 3, 2018Assignee: Mitsubishi Electric CorporationInventors: Koichi Ushijima, Khalid Hassan Hussein, Shoji Saito
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Publication number: 20170332522Abstract: A semiconductor device includes a cooling jacket having an inlet for coolant and an outlet for the coolant, a base plate, a first semiconductor element provided on the base plate, a second semiconductor element provided on the base plate, a first fin provided directly under the first semiconductor element on a back surface of the base plate and placed within the cooling jacket, a second fin provided directly under the second semiconductor element on the back surface of the base plate and placed within the cooling jacket, and a separator provided within the cooling jacket to divide the coolant entering the cooling jacket through the inlet into portions respectively cooling the first fin and the second fin.Type: ApplicationFiled: January 22, 2015Publication date: November 16, 2017Applicant: Mitsubishi Electric CorporationInventor: Koichi USHIJIMA
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Publication number: 20170207143Abstract: A semiconductor module having a plurality of cooling fins and a fixing cooling fin longer than the plurality of cooling fins, the fixing cooling fin having a threaded hole provided in distal end portion thereof, a cooling jacket having a cooling medium passage in which the plurality of cooling fins and the fixing cooling fin are housed, and an opening formed so as to enable a screw to be inserted in the threaded hole, and a screw passed through the opening to be inserted in the threaded hole, the cooling jacket being fixed to the semiconductor module with the screw are provided.Type: ApplicationFiled: March 31, 2017Publication date: July 20, 2017Applicant: Mitsubishi Electric CorporationInventors: Koichi USHIJIMA, Khalid Hassan HUSSEIN, Shoji SAITO
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Publication number: 20170201188Abstract: In the present invention, a lower arm control substrate, an insulation material and an upper arm control substrate are layered to be arranged in this order on a top surface of a small-sized power module. An upper arm main region and a lower arm main region are arranged to overlap the insulation material in plan view, and large parts of the upper arm main region and the lower arm main region overlap each other in plan view. The upper arm control substrate and the upper arm control substrate are configured with substrates of the same structure and the lower arm control substrate has a positional relation with the upper arm control substrate so as to be rotated by 180° from the upper arm control substrate in a horizontal direction.Type: ApplicationFiled: August 29, 2014Publication date: July 13, 2017Applicant: Mitsubishi Electric CorporationInventor: Koichi USHIJIMA
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Patent number: 9646912Abstract: A semiconductor module having a plurality of cooling fins and a fixing cooling fin longer than the plurality of cooling fins, the fixing cooling fin having a threaded hole provided in distal end portion thereof, a cooling jacket having a cooling medium passage in which the plurality of cooling fins and the fixing cooling fin are housed, and an opening formed so as to enable a screw to be inserted in the threaded hole, and a screw passed through the opening to be inserted in the threaded hole, the cooling jacket being fixed to the semiconductor module with the screw are provided.Type: GrantFiled: September 10, 2013Date of Patent: May 9, 2017Assignee: Mitsubishi Electric CorporationInventors: Koichi Ushijima, Khalid Hassan Hussein, Shoji Saito
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Publication number: 20160104654Abstract: A semiconductor module having a plurality of cooling fins and a fixing cooling fin longer than the plurality of cooling fins, the fixing cooling fin having a threaded hole provided in distal end portion thereof, a cooling jacket having a cooling medium passage in which the plurality of cooling fins and the fixing cooling fin are housed, and an opening formed so as to enable a screw to be inserted in the threaded hole, and a screw passed through the opening to be inserted in the threaded hole, the cooling jacket being fixed to the semiconductor module with the screw are provided.Type: ApplicationFiled: September 10, 2013Publication date: April 14, 2016Applicant: Mitsubishi Electric CorporationInventors: Koichi USHIJIMA, Khalid Hassan HUSSEIN, Shoji SAITO
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Patent number: 8648462Abstract: A semiconductor power module includes an active element and a passive element serving as semiconductor elements each having a first electrode on a front surface and a second electrode on a back surface thereof, a heat pipe having a first region defined as arrangement parts of the active element and the passive element on its one end side and electrically connected to one of the first and second electrodes of the active element and the passive element arranged in the first region, a cooling fin arranged in a second region defined on the other end side of the heat pipe, and a heat pipe provided to sandwich the active element, the passive element, and the cooling fin arranged on the heat pipe along with the heat pipe and electrically connected to the other of the first and second electrodes of the active element and passive element.Type: GrantFiled: May 24, 2011Date of Patent: February 11, 2014Assignee: Mitsubishi Electric CorporationInventor: Koichi Ushijima
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Publication number: 20120043652Abstract: A semiconductor power module includes an active element and a passive element serving as semiconductor elements each having a first electrode on a front surface and a second electrode on a back surface thereof, a heat pipe having a first region defined as arrangement parts of the active element and the passive element on its one end side and electrically connected to one of the first and second electrodes of the active element and the passive element arranged in the first region, a cooling fin arranged in a second region defined on the other end side of the heat pipe, and a heat pipe provided to sandwich the active element, the passive element, and the cooling fin arranged on the heat pipe along with the heat pipe and electrically connected to the other of the first and second electrodes of the active element and passive element.Type: ApplicationFiled: May 24, 2011Publication date: February 23, 2012Applicant: MITSUBISHI ELECTRIC CORPORATIONInventor: Koichi USHIJIMA
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Patent number: 7899563Abstract: A system control device includes a protective control section for providing protective control while allowing a first control command value computation section to perform computations during a period during which a first feedback control section exercises control; a control command value decrease section; a termination time acquisition section for acquiring the information about the termination time for the protective control; and a termination control section which uses a control command value decreased by the control command value decrease section as the initial control command value after the termination time.Type: GrantFiled: July 10, 2008Date of Patent: March 1, 2011Assignee: Mitsubishi Electric CorporationInventors: Noboru Miyamoto, Koichi Ushijima
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Publication number: 20090149970Abstract: Disclosed is a system control device that includes a semiconductor element; an actual control value acquisition section; a deviation computation section for computing the deviation between the actual control value and a target control value; an integral term computation means for computing an integral term contained in a control command value; a first control command value computation section for determining the next control command value from the immediately preceding integral term and the deviation; a first feedback control section for exercising control in accordance with the first control command value; a protective control section for providing protective control while allowing the first control command value computation section to perform computations during a period during which the first feedback control section exercises control; a control command value decrease section; a termination time acquisition section for acquiring the information about the termination time for the protective control; and a tType: ApplicationFiled: July 10, 2008Publication date: June 11, 2009Applicant: MITSUBISHI ELECTRIC CORPORATIONInventors: Noboru MIYAMOTO, Koichi USHIJIMA
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Patent number: 7436672Abstract: A transfer mold type power module (“TPM”) is provided with a projection at each of the four corners on its front main surface. The TPM is also provided a first screw hole at its center. A shielding plate is provided with a second crew hole in a position that corresponds to the first screw hole. A control substrate is provided with third screw holes in positions that correspond to the projections. The shielding plate and the TPM are joined by putting a first screw through the first and second screw holes and temporarily fastening the tip of the first screw by a temporary fastening member at the rear main surface of the TPM. The control substrate and the TPM are joined by second screws via the third screw holes.Type: GrantFiled: April 20, 2005Date of Patent: October 14, 2008Assignee: Mitsubishi Denki Kabushiki KaishaInventors: Koichi Ushijima, Hussein Khalid Hassan, Noboru Miyamoto
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Publication number: 20060067059Abstract: A transfer mold type power module (“TPM”) is provided with a projection at each of the four corners on its front main surface. The TPM is also provided a first screw hole at its center. A shielding plate is provided with a second crew hole in a position that corresponds to the first screw hole. A control substrate is provided with third screw holes in positions that correspond to the projections. The shielding plate and the TPM are joined by putting a first screw through the first and second screw holes and temporarily fastening the tip of the first screw by a temporary fastening member at the rear main surface of the TPM. The control substrate and the TPM are joined by second screws via the third screw holes.Type: ApplicationFiled: April 20, 2005Publication date: March 30, 2006Applicants: MITSUBISHI DENKI KABUSHIKI KAISHA, Renesas Device Design Corp.Inventors: Koichi Ushijima, Hussein Hassan, Noboru Miyamoto