Abstract: A compact fall detection sensor includes a case. A magnet is housed in the case. A reed switch with a pair of reeds are integrally positioned around the central axis of the case at the bottom of the case. In an upright state, the magnet is gravitationally positioned in the longitudinal direction of the reed switch around the central axis of the curved surface of the case, each magnetic pole magnetizing the corresponding reed of the reed switch, allowing one of the reeds to be magnetized to N pole and the other reed to S pole to turn on the switch. When inclined from the upright state, the magnet slides along the curved surface of the case and deviates from the central axis, to position only one of the magnetic poles of the magnet around the central axis to turn off the reed switch.

Abstract: A fixing component for releasably fixing an object housed within a hollow portion of a housing unit is provided with an opening narrower than the inside thereof. The fixing component has a head disposed rotatably at the opening of the housing unit. The head has a head main body disposed between the opposing surfaces of the opening. On the side peripheral surface of the head main body, radially loose-fit portions, which are loosely fitted between the opposing surfaces of the opening, and radially locked portions, which are locked between the opposing surfaces of the opening, are provided in the circumferential direction, and at positions corresponding to the radially locked portions of the head, axially locked portions, which protrude outward from the radially locked portions in the radial direction, are provided to allow attachment/detachment of the housed object and prevent the housed object from falling through the opening.

Abstract: A push switch includes a vertically arranged reed switch, a hollow case disposed to surround the reed switch, an annular first magnet fixedly disposed on the lower side in the case to surround the reed switch and magnetized in the axial direction, an annular second magnet disposed to be axially movable on the upper side in the case to surround the reed switch and magnetized in a direction opposite to the first magnet, and a pushing member mounted to the second magnet to move the second magnet to an operating position close to the first magnet at the time of downward operation. The case is positioned so that in a non-operating state, the pushing member is not pressed down within the case. The contact point of the reed switch comes at the center between the first magnet and the second magnet in the axial direction.

Abstract: A compact fall detection sensor includes a case. A magnet is housed in the case. A reed switch with a pair of reeds are integrally positioned around the central axis of the case at the bottom of the case. In an upright state, the magnet is gravitationally positioned in the longitudinal direction of the reed switch around the central axis of the curved surface of the case, each magnetic pole magnetizing the corresponding reed of the reed switch, allowing one of the reeds to be magnetized to N pole and the other reed to S pole to turn on the switch. When inclined from the upright state, the magnet slides along the curved surface of the case and deviates from the central axis, to position only one of the magnetic poles of the magnet around the central axis to turn off the reed switch.

Abstract: A rotation angle detection sensor detects the rotation angle of a rotating part attached to a structure including a fixed part and a rotating part that rotates around a rotary shaft. The rotation angle detection sensor includes a reed switch attached to the fixed or rotating part with reeds placed near the rotary shaft. An annular magnet is attached to the rotating or fixed part. A magnetic circuit is formed with respect to the reed switch, with its central axis arranged concentrically with the rotary shaft. When the magnet rotates around the central axis with respect to the reed switch, if the same poles of the magnet are lined up in the longitudinal direction of the reed switch, the reed switch is turned off. If opposite poles of the magnet are lined up in the longitudinal direction of the reed switch, the reed switch is turned on.

Abstract: A switch-containing cable when bended does not conduct electricity, but conducts electricity when pressurized with fingers. The cable has belt-like first and second oppositely disposed conductor films including respective first and second belt-like base materials on inner surfaces of which respective first and conductors are disposed; an insulating spacer arranged to maintain a gap therebetween; and a belt-like sheath configured with the first and second conductor films sandwiching the spacer and containing a belt-like conductor film functioning as a switch member in a hollow cavity. The first conductor film constituting the belt-like conductor film is movably overlaid on the insulating spacer, and the hollow cavity of the sheath includes a gap allowing for lengthwise relative displacement of at least the first belt-like base material caused by bending the sheath with respect to the belt-like conductor film housed in the hollow cavity, thereby preventing the cable from conducting electricity when bended.

Abstract: An earphone device includes first and second earphone bodies into which respective electro-acoustic transducers are built; first and second cables, one end of each of which is connected to the respective earphone body and within each of which a switch member to be turned on by one-way press is disposed over a predetermined range along the length direction of the cable so that the cable has switch functions; wherein a switch is shunted into two switches by the first and second cables, portions of the first and second cables having switch functions are arranged one on top of the other, and an overlapped portion is unidirectionally pressed to simultaneously turn on the respective switches. In addition, a sound-reproducing system is configured by combining a mobile terminal which operates in conjunction with this earphone device.

Abstract: An earphone device includes first and second earphone bodies into which respective electro-acoustic transducers are built; first and second cables, one end of each of which is connected to the respective earphone body and within each of which a switch member to be turned on by one-way press is disposed over a predetermined range along the length direction of the cable so that the cable has switch functions; wherein a switch is shunted into two switches by the first and second cables, portions of the first and second cables having switch functions are arranged one on top of the other, and an overlapped portion is unidirectionally pressed to simultaneously turn on the respective switches. In addition, a sound-reproducing system is configured by combining a mobile terminal which operates in conjunction with this earphone device.

Abstract: A switch-containing cable when bended does not conduct electricity, but conducts electricity when pressurized with fingers. The cable has belt-like first and second oppositely disposed conductor films including respective first and second belt-like base materials on inner surfaces of which respective first and conductors are disposed; an insulating spacer arranged to maintain a gap therebetween; and a belt-like sheath configured with the first and second conductor films sandwiching the spacer and containing a belt-like conductor film functioning as a switch member in a hollow cavity. The first conductor film constituting the belt-like conductor film is movably overlaid on the insulating spacer, and the hollow cavity of the sheath includes a gap allowing for lengthwise relative displacement of at least the first belt-like base material caused by bending the sheath with respect to the belt-like conductor film housed in the hollow cavity, thereby preventing the cable from conducting electricity when bended.

Abstract: There is provided a method of manufacturing a lead block for a rotary connector. The rotary connector includes stationary and movable housings, a flexible cable, and lead blocks. The method includes forming a connection terminal connecting body, where connection terminals are connected to each other by connection parts, by performing blanking and bending on a metal plate, forming a base body made of an insulating resin by performing insert molding so that the connection terminal connecting body is embedded in the base body except for at least of the connection parts and first and second connection terminal portions, and making the connection terminals be electrically isolated from each other by removing predetermined portions of the connection parts. The second connection terminal portions of the connection terminals are arranged on parallel planes.

Abstract: A semiconductor wafer (W) where circuits are formed in the area divided by streets is split into semiconductor chips having individual circuits. By interposing an adhesive sheet, whose adhesive force is lowered by stimulation, between the semiconductor wafer (W) and the support plate (13), the front side of the semiconductor wafer (W) is adhered to the support plate (13), thereby exposing the rear face (10) of the semiconductor wafer (W). The rear face (10) of the semiconductor wafer (W) with the support plate (13) is ground. After the grinding is finished, the semiconductor wafer (W) held with the rear face (10) up is diced into semiconductor chips (C). The adhesive sheet is given stimulus to lower the adhesive force and the semiconductor chips (C) are removed from the support plate (13). The semiconductor wafer and semiconductor chips are always supported by the support plate, avoiding damage and deformation.

Abstract: In the rotating connector wherein the rotor having the inner tube is rotatably coupled with the stator having the outer tube, and the flat cable is contained in the annular space defined between the outer tube and the inner tube, the cable winding direction is reversed at the intermediate section, and the intermediate reversing section of the flat cable is passed through the opening of the holder that is rotatably arranged in the annular space. A guiding wall having the outer surface eccentric to the rotating axis of the rotor is provided on the annular flat plate of the holder, and the flat cable is wound on the outer surface of the guiding wall in the wound-back state.

Abstract: In manufacturing thinned semiconductor chips by grinding a semiconductor wafer supported on a rigid support substrate, in order to remove the semiconductor wafer or semiconductor chips from the support substrate without damage to the semiconductor wafer or semiconductor chips, a semiconductor wafer at its surface is bonded on a light-transmissive support substrate through an adhesive layer having an adhesion force that is reduced upon exposure to light radiation, thereby exposing the back surface of the semiconductor wafer. A tape is bonded to the backside of the semiconductor wafer integrated with the support substrate after grinding, wherein the tape is supported at the periphery. Before or after bonding of the tape, light radiation is applied to the adhesive layer at a side close to the support substrate to reduce the adhesion force in the adhesion layer.

Abstract: A water jet processing method for cutting a workpiece having a first group composed of first plural cutting lines extending in a predetermined direction and a second group composed of second plural cutting lines formed perpendicular to the plural cutting lines of the first group along the plural cutting lines of the first group and the plural cutting lines of the second group formed on the workpiece by injecting a water jet, which comprises a first cutting step for injecting a water jet to the cutting lines of the first group continuously and a second cutting step for injecting a water jet to the cutting lines of the second group continuously while the workpiece is supported by a support member.

Abstract: A water jet processing method for cutting a workpiece having a first group composed of first plural cutting lines extending in a predetermined direction and a second group composed of second plural cutting lines formed perpendicular to the plural cutting lines of the first group along the plural cutting lines of the first group and the plural cutting lines of the second group formed on the workpiece by injecting a water jet, which comprises a first cutting step for injecting a water jet to the cutting lines of the first group continuously and a second cutting step for injecting a water jet to the cutting lines of the second group continuously while the workpiece is supported by a support member.

Abstract: It is an object of the invention to provide a method for manufacturing an IC chip wherein a wafer is prevented from being damaged and the ease of handling thereof is improved so that the wafer can be appropriately processed into IC chips, even if a thickness of the wafer is extremely reduced to approximately 50 ?m.

Abstract: In the rotating connector wherein the rotor having the inner tube is rotatably coupled with the stator having the outer tube, and the flat cable is contained in the annular space defined between the outer tube and the inner tube, the cable winding direction is reversed at the intermediate section, and the intermediate reversing section of the flat cable is passed through the opening of the holder that is rotatably arranged in the annular space. A guiding wall having the outer surface eccentric to the rotating axis of the rotor is provided on the annular flat plate of the holder, and the flat cable is wound on the outer surface of the guiding wall in the wound-back state.

Abstract: A wafer support plate comprises a support surface on which a semiconductor wafer is supported, and a crystal orientation mark which indicates the crystal orientation of the semiconductor wafer. Even the semiconductor wafer thinned by grinding can be stably held on the support surface, and the crystal orientation can be recognized even when the outer periphery of the semiconductor wafer has chipped.

Abstract: A flat-object holder can hold a flat object-and-frame assembly, and the holder has the flat object fixed to the frame with protection tape. The flat-object holder includes at least a flat object supporting area for fixedly holding the flat object via the protection tape by applying a suction force, and a frame fixing area for fastening the frame. The flat-object holder bearing the flat object-and-frame assembly can be fixedly held by a selected chuck table by applying a negative pressure to the flat object supporting area. The flat-object holder can transfer and put the flat object-and-frame assembly in a container. Thus, no matter how thin the flat object may be, it can be handled without the fear of breaking.