Abstract: A photolithographic mask for use in the fabrication of semiconductor integrated circuit devices, comprising a transparent substrate having a major surface, and a metallic film formed on the major surface of the transparent substrate and impermeable to ultraviolet rays having wavelengths within a predetermined range, wherein the metallic film is doped with sulfur ions to provide a reduced angle of contact between the surface of the film and a body of pure water to achieve an increased degree of adaptability of the photomask to cleaning with pure water when the photomask is put to repeated use over a prolonged period of time.