Abstract: A semiconductor device can be transferred onto a circuit board with high accuracy, and a man-hour and a facility load in a process of peeling off the semiconductor device from a sapphire substrate are reduced. A semiconductor-device-formed sapphire substrate in which gallium-nitride-based semiconductor devices are arrayed and formed on a sapphire substrate includes a nitrogen-gallium re-fusion layer A at an interface between the sapphire substrate and the semiconductor devices. An adhesive strength of the nitrogen-gallium re-fusion layer is smaller than an adhesive strength of an adhesive layer for bonding the semiconductor devices to a circuit board.

Abstract: A substrate mounting method of an electronic component on a wiring substrate includes steps of patterning to form a conductive elastic protrusion on an electrode pad provided on the wiring substrate to correspond to a contact point of the electronic component, forming an adhesive layer made of a photosensitive thermosetting resin on the wiring substrate, lowering viscosity of the adhesive layer by heating the adhesive layer to a first temperature zone, electrically connecting the contact point of the electronic component to the electrode pad on the wiring substrate through the conductive elastic protrusion, under a state where the viscosity of the adhesive layer is lowered, by pressing the electronic component after the electronic component is positioned on the wiring substrate, and fixing the electronic component onto the wiring substrate by heating the adhesive layer to a second temperature zone higher than the first temperature zone to cure the adhesive layer.

Abstract: The present invention provides a method for manufacturing an LED display including a wiring board and LEDs arranged at a constant distance from the wiring board. The method includes: aligning an LED substrate 1 having LEDs 11 with a wiring board 2, and pressing and joining the LED substrate onto the wiring board. Each LED has a bonding surface. The wiring board includes bonding layers. The aligning step is performed so that the bonding surfaces are joined on the bonding layers in the pressing and joining step. The method further includes: temporarily bonding the LEDs onto the wiring board by curing the bonding layers through irradiation with ultraviolet light UV; peeling off the LEDs from the LED substrate through irradiation with laser light L; and permanently bonding the LEDs onto the wiring board by heating the bonding layers of the LEDs so as to further cure the bonding layers.

Abstract: Provided is a board connection structure for mounting a micro LED 3 on a wiring board 4. A conductive elastic protrusion 7 is formed by patterning on an electrode pad 6 provided on the wiring board 4 at a position corresponding to a position of a corresponding electrode 5 of the micro LED 3. The elastic protrusion 7 is configured to electrically connect the electrode 5 and the electrode pad 6. This enables mounting of electronic components with a narrow electrode spacing.

Abstract: An inspection method for multiple LED chips 6 formed on a sapphire substrate 7, comprising: a first step of positioning the sapphire substrate 7 above an inspection wiring board 11 such that each electrode 10 of the multiple LED chips 6 is arranged above a corresponding electrode pad 12 provided on the inspection wiring board 11 at a position corresponding to the electrode 10, and then placing the sapphire substrate 7 on the inspection wiring board 11; a second step of electrically connecting each electrode 10 of the multiple LED chips 6 and the corresponding electrode pad 12 of the inspection wiring board 11; and a third step of supplying a current to the multiple LED chips 6 through the inspection wiring board 11, and determining the quality of the LED chips 6.

Abstract: The present invention provides a laser lift-off processing method performed on a laminate 1 including a sapphire substrate 11 and micro LEDs 12 formed on a first surface of the sapphire substrate, by irradiating the laminate with pulse-oscillated laser light from a second surface of the sapphire substrate and thereby separating the micro LEDs therefrom. The method includes: flattening the sapphire substrate by pressing it with an external force to correct its warpage; and separating the micro LEDs from the flattened sapphire substrate by irradiating the laminate with the laser light from the second surface while moving the laminate placed on a stage 91 relative to an optical system 6 such that the laser focal point sequentially coincides with boundary portions between the sapphire substrate and the micro LEDs. The method allows for satisfactorily separating the micro LEDs from the sapphire substrate even if it is warped.

Abstract: An exposure apparatus is provided with: a conveying device that conveys the subject to be exposed in a given direction; a spatial light modulating device having a plurality of light modulating elements, which are composed of an electro-optical crystalline material and arranged at least in one row in a direction intersecting a conveying direction of the subject to be exposed; an optical beam shaping device that limits the width of light emitted from each light modulating element in the conveying direction to a predetermined width; and a control device that on/off-controls light transmitted through the spatial light modulating device so as to generate a predetermined pattern. The light modulating element is formed tilted by a predetermined angle with respect to an axis parallel to the conveying direction. The control device shifts the optical beam shaping device in the conveying direction.

Abstract: An exposure apparatus is provided with: a conveying device that conveys the subject to be exposed in a given direction; a spatial light modulating device having a plurality of light modulating elements, which are composed of an electro-optical crystalline material and arranged at least in one row in a direction intersecting a conveying direction of the subject to be exposed; an optical beam shaping device that limits the width of light emitted from each light modulating element in the conveying direction to a predetermined width; and a control device that on/off-controls light transmitted through the spatial light modulating device so as to generate a predetermined pattern. The light modulating element is formed tilted by a predetermined angle with respect to an axis parallel to the conveying direction. The control device shifts the optical beam shaping device in the conveying direction.