Patents by Inventor Koichiro Fukui

Koichiro Fukui has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11148450
    Abstract: To provide a coating liquid for release layer with which a release layer having a small variation in the performance difference can be stably formed, to provide a method for producing a thermal transfer sheet using this coating liquid for release layer, and to provide a thermal transfer sheet having stable releasability. A thermal transfer sheet having a substrate 1, a release layer 2 provided on the substrate 1, and a transfer layer 10 provided on the release layer 2, wherein the transfer layer 10 is provided peelably from the release layer 2, and the release layer 2 contains a silsesquioxane.
    Type: Grant
    Filed: January 31, 2019
    Date of Patent: October 19, 2021
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventors: Kazuya Yoshida, Tomohiko Imoda, Yoshihiro Imakura, Yasuyuki Shouji, Daisuke Fukui, Ryoji Hattori, Koichiro Kuroda
  • Patent number: 6382502
    Abstract: A heat sink made of aluminum having both high strength and heat dissipation performance together is manufactured. In a method of manufacturing a heat sink made of aluminum by brazing a plurality of fins 13 on a heat dissipating substrate 11, the fin 13 comprises an Al—Mg—Si series alloy containing from 0.3 to 0.7% by weight of Mg, from 0.3 to 0.7% by weight of Si and the balance of Al and inevitable impurities, and is put to cooling at a rate of 50° C./min or more in a range from 450-500° C. to 300° C. in the cooling process after heating for brazing and, subsequently, artificial aging is applied at 100 to 250° C.
    Type: Grant
    Filed: March 8, 2000
    Date of Patent: May 7, 2002
    Assignee: Showa Denko K.K.
    Inventors: Koichiro Fukui, Shunta Ushioda, Ichizo Tsukuda
  • Patent number: 6239390
    Abstract: Provided is a personal computer keyboard in which base and reinforcement plates excellent in heat dissipativity and homogeneous in heat dissipation, and with a mechanical strength are incorporated. The keyboard includes a base plate 24 on which key caps K1 to K9 are mounted; and a reinforcement plate 25 disposed on the lower side of the base plate 24, wherein the base plate 24 is constituted of an Al—Mg—Si based alloy plate including 0.2 to 0.8 wt % of Si, 0.3 to 0.9 wt % of Mg, 0.35 wt % or less of Fe and 0.20 wt % or less of Cu with the rest of Al and inevitable impurities and wherein the reinforcement plate 25 is constituted of a heat pipe panel.
    Type: Grant
    Filed: March 3, 2000
    Date of Patent: May 29, 2001
    Assignee: Showa Aluminum Corporation
    Inventors: Koichiro Fukui, Shunta Ushioda, Ichizo Tsukuda
  • Patent number: 5076351
    Abstract: In a heat pipe container having a working fluid enclosed therein, the container includes a container body in the form of a horizontal straight tube and having an evaporator portion, a heat insulating portion and a condenser portion as arranged from one end of the body to the other end thereof, and an upward hollow projecting portion provided on the condenser portion of the container body.
    Type: Grant
    Filed: July 17, 1990
    Date of Patent: December 31, 1991
    Assignee: Showa Aluminum Corporation
    Inventors: Masaaki Munekawa, Chuichi Takahashi, Kaoru Hasegawa, Koichiro Fukui, Yuichi Furukawa
  • Patent number: 4933007
    Abstract: A heat-resistant aluminum-base composite which includes an aluminum matrix of not smaller than 99.0% purity, Si particles whose average diameter falls in the range of 0.1 to 100 .mu.m, and Al.sub.2 O.sub.3 and Al.sub.4 C.sub.3 particles, the particles being dispersed in the aluminum matrix at volume percents Vf(Si) and V.sub.f (Al.sub.2 O.sub.3 +Al.sub.4 C.sub.3) wherein Vf(Si).gtoreq.9%, Vf(Al.sub.2 O.sub.3 +Al.sub.4 C.sub.3).ltoreq.20% and Vf (Al.sub.2 O.sub.3 +Al.sub.4 C.sub.3)+Vf(Si).ltoreq.40%.
    Type: Grant
    Filed: October 19, 1989
    Date of Patent: June 12, 1990
    Assignee: Showa Aluminum
    Inventors: Tsunemasa Miura, Koichiro Fukui
  • Patent number: 4782890
    Abstract: A heat pipe comprising a container having water enclosed therein as a working fluid and made of a material reactive with water to evolve hydrogen gas. The heat pipe is characterized in that the container has placed therein a solid oxidizing agent for oxidizing the hydrogen gas to water. The hydrogen gas produced by the reaction of the working fluid, i.e. water, with the container is oxidized to water by the oxidizing agent without remaining in the form of a gas within the condensing portion of the pipe.
    Type: Grant
    Filed: April 20, 1987
    Date of Patent: November 8, 1988
    Assignee: Showa Aluminum Corporation
    Inventors: Saburo Shimodaira, Isamu Uchida, Minoru Hasegawa, Koichiro Fukui, Yuichi Furukawa, Kazunari Noguchi
  • Patent number: 4760878
    Abstract: A process for producing a heat pipe including the steps of treating the inner surface of a steel container with an aqueous solution of a vanadate with heating, and enclosing in the container a working liquid prepared by adding an alkalinizing pH adjusting agent to pure water and having an adjusted pH of 8 to 12. When the container inner surface is treated with the aqueous vanadate solution with heating, a protective layer covering the inner surface is formed. The working liquid, when in the range of 8 to 12 in pH, maintains the protective layer in a stable state over a prolonged period of time.
    Type: Grant
    Filed: December 5, 1986
    Date of Patent: August 2, 1988
    Assignee: Showa Aluminum Corporation
    Inventors: Koichiro Fukui, Yuichi Furukawa, Kazunari Noguchi
  • Patent number: 4408655
    Abstract: A heat pipe comprising an iron container having enclosed therein an aqueous solution of a vanadate as a working liquid.
    Type: Grant
    Filed: December 14, 1981
    Date of Patent: October 11, 1983
    Assignee: Showa Aluminum Corporation
    Inventors: Michitaka Hashimoto, Koichiro Fukui