Patents by Inventor Koichiro Hyodo

Koichiro Hyodo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20060022788
    Abstract: An object is to provide a highly reliable surface mount coil component quickly and reliably forming thermo-compression bonding on an occasion of thermo-compression bonding by a heater chip, and reliably fixing the metal plate terminal, in a surface mount coil component having thermo-compression bonding of a winding wire and a metal plate terminal. In a surface mount coil component including a winding wire 2, a core 1 and a metal plate terminal 3, the metal plate terminal 3 integrally includes a fixing part 3b which is bonded and fixed to the core 1, a joint part 3a to which an end of the winding wire is bonded by thermo-compression bonding, and a mount part 3c which is connected to an external circuit, the fixing part 3c is integrally included between the joint part 3a and the mount part 3b, and a sectional reduced portion 5 is formed between the joint part 3a and the fixing part 3b.
    Type: Application
    Filed: July 29, 2005
    Publication date: February 2, 2006
    Inventors: Kunio Sasamori, Koichiro Hyodo