Abstract: A polyvinyl acetal resin film, having an average surface roughness Rz of at least one surface of 3.0 ?m or less; a birefringence ?n of 3.0×10?4 or less; and an average thickness of 200 ?m or less.

Abstract: The present invention relates to a polyvinyl acetal resin film, comprising a polyvinyl acetal resin material, wherein the polyvinyl acetal resin film has a thickness of 5 to 350 ?m, and satisfies the following Formulae (1) and (2) where, comparing one surface and the other surface, a mean value of the 10-point average roughness of a rougher surface A and a mean value of the 10-point average roughness of a smoother surface B are defined as Rz1(a) ?m and Rz2(a) ?m, respectively: Rz1(a)>1.1×Rz2(a)??(1) 3>Rz2(a)??(2), a value obtained by dividing the standard deviation of the 10-point average roughness of the surface A by Rz1(a) and a value obtained by dividing the standard deviation of the 10-point average roughness of the surface B by Rz2(a) are each 0 to 0.30, a viscosity of a toluene/ethanol (1:1, mass ratio) solution containing 10%-by-mass of a polyvinyl acetal resin contained in the polyvinyl acetal resin material, which is measured at 20° C.

Abstract: A circuit-including film comprising: a resin film (1); and a conductive fine wire circuit (A) and a conductive circuit (B) independent of the conductive fine wire circuit (A), which are arranged on one surface of the resin film (1), wherein the resin film (1) contains at least one resin selected from the group consisting of a polyvinyl acetal resin, an ionomer resin and an ethylene-(vinyl acetate) copolymer resin.

Abstract: A laminate comprising a base material film, a resin layer (1) having a detachable surface, and a heat-generating conductive layer in this order.

Abstract: A polyvinyl acetal resin film for laminated glass, a viscosity of toluene/ethanol=1/1 (by mass ratio) solution of a polyvinyl acetal resin in a resin composition constituting the polyvinyl acetal resin film with a concentration of 10% by mass, measured at 30 rpm and 20° C. by using a Brookfield-type (B-type) viscometer, being more than 200 mPa·s, the polyvinyl acetal resin film comprising a plasticizer in an amount of 0 to 20% by mass based on a total mass of the resin composition constituting the polyvinyl acetal resin film, and the polyvinyl acetal resin film having a thickness of 10 to 350 ?m.

Abstract: Provided is an antenna system useful for communication using high-frequency waves. The antenna system (100) comprises a first glass layer (101) that transmits high-frequency waves; a low-dielectric layer (103) having a lower dielectric constant than that of the first glass layer (101), the low-dielectric layer disposed adjacent to the first glass layer (101) and transmitting the high-frequency waves entering through the first glass layer (101); and an antenna circuit board (107) disposed adjacent to the low-dielectric layer (103) and including a high-frequency insulation layer (105) that receives the high-frequency waves entering through the low-dielectric layer (103).

Abstract: The present invention relates to a polyvinyl acetal resin film, comprising a polyvinyl acetal resin material, wherein at least one surface has a relative diffuse reflectance of 3% or higher at a wavelength of 550 nm, an absolute difference between the relative diffuse reflectance of one surface at a wavelength of 550 nm and that of the other surface at a wavelength of 550 nm is 0.5% or larger, and the amount of a plasticizer in the polyvinyl acetal resin film is 0 to 20% by mass based on a total mass of the polyvinyl acetal resin film.

Abstract: The present invention relates to a method for producing a polyvinyl acetal resin film containing a plasticizer absorbed therein, comprising: a contact step of bringing a liquid plasticizer into contact with a polyvinyl acetal resin film; and a heating step of heating the polyvinyl acetal resin film that has been contacted with the liquid plasticizer, wherein an amount of a plasticizer in the polyvinyl acetal resin film before the contact step is 0 to 20% by mass based on a total mass of the polyvinyl acetal resin film.

Abstract: The present invention relates to a polyvinyl acetal resin film, comprising a polyvinyl acetal resin material, wherein the polyvinyl acetal resin film has a thickness of 5 to 350 ?m, and satisfies the following Formulae (1) and (2) where, comparing one surface and the other surface, a mean value of the 10-point average roughness of a rougher surface A and a mean value of the 10-point average roughness of a smoother surface B are defined as Rz1(a) ?m and Rz2(a) ?m, respectively: Rz1(a)>1.1×Rz2(a)??(1) 3>Rz2(a)??(2), a value obtained by dividing the standard deviation of the 10-point average roughness of the surface A by Rz1(a) and a value obtained by dividing the standard deviation of the 10-point average roughness of the surface B by Rz2(a) are each 0 to 0.30, a viscosity of a toluene/ethanol (1:1, mass ratio) solution containing 10%-by-mass of a polyvinyl acetal resin contained in the polyvinyl acetal resin material, which is measured at 20° C.

Abstract: An intermediate laminate having a first adhesive layer and a first cross-linked cured resin layer laminated directly with no other layer interposed therebetween, the first adhesive layer having a polyvinyl acetal resin and/or an ionomer resin.

Abstract: The present invention relates to a polyvinyl acetal resin film, comprising a polyvinyl acetal resin material, wherein the polyvinyl acetal resin film has a thickness of 10 to 350 ?m, one surface has a 10-point average roughness Rz value of less than 2 ?m and a friction angle of larger than 31° but 40° or smaller, the other surface has a 10-point average roughness Rz value of 2 ?m to 7 ?m and a friction angle of 20° to 31°, a viscosity of a toluene/ethanol (1:1, mass ratio) solution containing 10%-by-mass of a polyvinyl acetal resin contained in the polyvinyl acetal resin material, which is measured at 20° C. and 30 rpm using a Brookfield-type (B-type) viscometer, is 100 to 1,000 mPa·s, and the amount of a plasticizer in the polyvinyl acetal resin film is 0 to 20% by mass based on a total mass of the polyvinyl acetal resin film.

Abstract: The present invention provides an interlayer film for laminated glass which has excellent sound insulating properties even when the thickness is reduced, and also has a low degree of orientation and low shrinkability.

Abstract: A circuit-including film comprising: a resin film (1); and a conductive fine wire circuit (A) and a conductive circuit (B) independent of the conductive fine wire circuit (A), which are arranged on one surface of the resin film (1), wherein the resin film (1) contains at least one resin selected from the group consisting of a polyvinyl acetal resin, an ionomer resin and an ethylene-(vinyl acetate) copolymer resin.

Abstract: A polyvinyl acetal resin film, having an average surface roughness Rz of at least one surface of 3.0 ?m or less; a birefringence ?n of 3.0×10?4 or less; and an average thickness of 200 ?m or less.

Abstract: A laminate comprising a base material film, a resin layer (1) having a detachable surface, and a heat-generating conductive layer in this order.

Abstract: A first object of the invention is to provide an interlayer film for laminated glass which has excellent sound insulating properties and heat shielding properties, and a laminated glass using the same. Further, a second object of the invention is to provide an interlayer film for laminated glass capable of maintaining the sound insulating properties, weather resistance, and heat creep resistance at a high level even if the thickness is reduced, and a laminated glass using the same. The invention relates to an interlayer film for laminated glass, including at least one layer A containing a thermoplastic elastomer, wherein a laminated glass in which the interlayer film for laminated glass is disposed between two clear glasses with the total thickness of the clear glasses being 4 mm or less has a visible light transmittance of 70% or more and an average transmittance of infrared light in the wavelength range of 800 to 1,100 nm of 72% or less.

Abstract: The present invention provides an interlayer film for laminated glass which has excellent sound insulating properties even when the thickness is reduced, and also hardly causes optical unevenness. An interlayer film for laminated glass includes at least one layer A containing a thermoplastic elastomer, wherein the shear storage modulus of the layer A at 70° C. as measured by performing a dynamic viscoelasticity test at a frequency of 1,000 Hz in accordance with ASTM D4065-06 is 1 MPa or more, and a layer having a higher shear storage modulus than the layer A is provided on at least one surface of the layer A, and at least one surface of the interlayer film for laminated glass is in a state of having been shaped.

Abstract: To provide a composite film which comprises a heat-generating conductive structure and is suitable for a laminated glass that can achieve both of the heating of the whole area of the laminated glass and the efficient heating of a region surrounding an electronic member (e.g., a camera, a sensor, an antenna) while keeping the good sensitivity of the electronic member. A composite film comprising: a resin film; and a heat-generating conductive structure arranged on the resin film and comprising at least a plurality of main conductive fine wires, wherein the composite film has at least one electronic member attachment region not comprising the plurality of main conductive fine wires.

Abstract: The present invention relates to a production method of a conductive structure-containing film with a substrate film, the production method comprising: a step (1) of forming a resin layer (X) by coating a thermoplastic resin composition (A) containing at least one thermoplastic resin selected from the group consisting of a polyvinyl acetal resin, an ionomer resin, and an ethylene-vinyl acetate copolymer resin on one side of a substrate film; and a step (2) of forming a conductive structure on the resin layer (X).

Abstract: An intermediate film for laminated glasses, the intermediate film having at least a sound insulation layer that comprises a resin composition A containing 100 parts by mass of a thermoplastic resin and 10 to 1000 parts by mass of a damping-property-imparting agent, wherein the damping-property-imparting agent has a molecular weight of 100 to 10000 and does not have a melting point at a temperature higher than 30° C., and the resin composition A has a maximum value of tan ? at a temperature of 30° C. or lower, and the maximum value is more than 3.1.