Patents by Inventor Koichiro Matsuo

Koichiro Matsuo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240099013
    Abstract: According to one embodiment, the array chip includes a three-dimensionally disposed plurality of memory cells and a memory-side interconnection layer connected to the memory cells. The circuit chip includes a substrate, a control circuit provided on the substrate, and a circuit-side interconnection layer provided on the control circuit and connected to the control circuit. The circuit chip is stuck to the array chip with the circuit-side interconnection layer facing to the memory-side interconnection layer. The bonding metal is provided between the memory-side interconnection layer and the circuit-side interconnection layer. The bonding metal is bonded to the memory-side interconnection layer and the circuit-side interconnection layer.
    Type: Application
    Filed: November 27, 2023
    Publication date: March 21, 2024
    Applicant: Kioxia Corporation
    Inventors: Yoshiaki FUKUZUMI, Hideaki AOCHI, Mie MATSUO, Kenichiro YOSHII, Koichiro SHINDO, Kazushige KAWASAKI, Tomoya SANUKI
  • Patent number: 4888242
    Abstract: A refractory heat-insulating graphite sheet material characterized in that the material comprises a graphite sheet.
    Type: Grant
    Filed: May 26, 1987
    Date of Patent: December 19, 1989
    Assignee: Toyo Tanson Co., Ltd.
    Inventors: Koichiro Matsuo, Kazuhiro Maekawa, Teruhisa Kondo