Patents by Inventor Koichiro Nakashima

Koichiro Nakashima has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11969487
    Abstract: A non-cellular dental tissue regeneration promoting kit is provided that makes effective dental tissue regeneration possible without transplantation of autologous or allogeneic stem cells or components derived from stem cells. The kit comprises: a pretreatment agent comprising a serine protease; and a non-cellular root canal filling material, the non-cellular root canal filling material comprising: a regeneration promoting compound including at least one of a CCR3 antagonist, a CCL11 neutralizing antibody, and an ALK5 inhibitor; and an extracellular matrix. The kit is preferably used for middle-aged or elderly individuals.
    Type: Grant
    Filed: September 21, 2018
    Date of Patent: April 30, 2024
    Assignee: Kowa Company, Ltd.
    Inventors: Misako Nakashima, Koichiro Iohara
  • Patent number: 11885621
    Abstract: A sensor device includes a sensor element, a substrate, and a bonding wire. Over the substrate, provided is the sensor element. The bonding wire forms at least part of a connection path that electrically connects the sensor element and the substrate together. The bonding wire is provided to connect two connection surfaces that intersect with each other.
    Type: Grant
    Filed: February 4, 2020
    Date of Patent: January 30, 2024
    Assignee: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
    Inventors: Koichiro Nakashima, Takashi Uchida, Yusuke Nakamura, Hideki Ueda, Naruhito Noda, Toshitsugu Konishi, Toshio Yamazaki
  • Publication number: 20230076794
    Abstract: A sensor device includes a conductive layer. The conductive layer is interposed between a first principal surface of an IC chip and a sensor element and faces the sensor element via a resin-based adhesive layer. The sensor element includes: a moving part including a moving electrode; a fixed part including a fixed electrode forming capacitance between the moving electrode and itself; a first terminal connected to the moving electrode; and a second terminal connected to the fixed electrode. The IC chip includes: a signal processor that processes a detection signal from the second terminal; a first voltage generator that generates a first voltage as an operating voltage for the processor; and a second voltage generator that generates a second voltage corresponding to the sensor element's reference potential applied to the first terminal. The conductive layer is electrically connected to the first terminal.
    Type: Application
    Filed: August 5, 2022
    Publication date: March 9, 2023
    Inventors: Hideki UEDA, Koichiro NAKASHIMA
  • Publication number: 20220364864
    Abstract: A sensor device includes a sensor element, a supporting member, a substrate, and a bonding wire. The supporting member is electrically connected to the sensor element. The substrate is electrically connected to the supporting member. The bonding wire forms at least part of a connection path that electrically connects the sensor element and the supporting member together. The substrate and an installation member on which the sensor element is installed intersect with each other. The sensor element and the supporting member are separated from each other.
    Type: Application
    Filed: November 6, 2020
    Publication date: November 17, 2022
    Inventors: Hideki UEDA, Yusuke NAKAMURA, Koichiro NAKASHIMA, Takashi UCHIDA, Toshio YAMAZAKI, Hiroyuki FUJII, Chikara NARA
  • Publication number: 20220057211
    Abstract: A sensor device includes a sensor element, a substrate, and a bonding wire. Over the substrate, provided is the sensor element. The bonding wire forms at least part of a connection path that electrically connects the sensor element and the substrate together. The bonding wire is provided to connect two connection surfaces that intersect with each other.
    Type: Application
    Filed: February 4, 2020
    Publication date: February 24, 2022
    Inventors: Koichiro NAKASHIMA, Takashi UCHIDA, Yusuke NAKAMURA, Hideki UEDA, Naruhito NODA, Toshitsugu KONISHI, Toshio YAMAZAKI
  • Publication number: 20170082508
    Abstract: A strain sensor includes a cylindrical strain body extending in an axial direction, a first fixed part, a second fixed part, and a strain detection element. The first fixed part is connected to the strain body at a first connection part and extends from an opening of a first end of the strain body in the axial direction. The second fixed part is connected to the strain body at a second connection part and extends from an opening of a second end of the strain body in a direction opposite to the first fixed part with a gap interposed between the strain body and the second fixed part. The strain detection element is disposed such that a center of the strain detection element is closer to the second fixed part than a center of the gap in the axial direction.
    Type: Application
    Filed: March 30, 2015
    Publication date: March 23, 2017
    Inventors: TAKAAKI OGAWA, KAZUHIRO NOMURA, MASAHIKO OBAYASHI, ATSUO TAKEKAWA, KOUICHI ABURATA, KOUJI NABETANI, KOICHIRO NAKASHIMA, TOSHIHARU MOTOFUSA, SHINPEI ODA
  • Publication number: 20170023419
    Abstract: A strain sensor is configured to detect a load. The strain sensor includes a deformable section having an annular shape, a first pressure-receiving section configured to receive the load applied thereto, a second pressure-receiving section connected to the deformable section, and a strain detecting element provided on at least one of the first pressure-receiving section and the deformable section. The first pressure-receiving section is connected to the deformable section in a first direction away from the deformable section. The second pressure-receiving section is connected to the deformable section in a second direction opposite to the first direction from the deformable section. The first pressure-receiving section is provided only in the first direction from the deformable section. The strain sensor can stably detect the load regardless of a method for applying the load.
    Type: Application
    Filed: May 21, 2015
    Publication date: January 26, 2017
    Applicant: Panasonic Intellectual Property Management Co., Lt
    Inventors: SHINPEI ODA, MASAHIKO OBAYASHI, KOICHIRO NAKASHIMA, KOUJI NABETANI, KAZUHIRO NOMURA
  • Patent number: 8087296
    Abstract: An angular velocity sensor includes a substrate having an upper surface having a first recess provided therein, an electronic component mounted in the first recess, and a vibration element mounted onto the upper surface of the substrate. The first vibration element has a portion located directly above the electronic component. This angular velocity sensor has a small size.
    Type: Grant
    Filed: March 7, 2007
    Date of Patent: January 3, 2012
    Assignee: Panasonic Corporation
    Inventors: Shinjiro Ueda, Hiroaki Mouri, Koichiro Nakashima
  • Publication number: 20090165557
    Abstract: An angular velocity sensor includes a substrate having an upper surface having a first recess provided therein, an electronic component mounted in the first recess, and a vibration element mounted onto the upper surface of the substrate. The first vibration element has a portion located directly above the electronic component. This angular velocity sensor has a small size.
    Type: Application
    Filed: March 7, 2007
    Publication date: July 2, 2009
    Inventors: Shinjiro Ueda, Hiroaki Mouri, Koichiro Nakashima