Patents by Inventor Koichiro Niwa

Koichiro Niwa has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Heat sink in the aperture of substrate
    Patent number: 9362200
    Abstract: A semiconductor package includes a support substrate arranged with a first aperture reaching a semiconductor device on a rear side, the semiconductor device is bonded via an adhesive to a surface of the support substrate, an insulating layer covering the semiconductor device, and wiring for connecting the semiconductor device and an external terminal through the insulating layer. The adhesive may form a part of the first aperture. In addition, a heat dissipation part may be arranged in the first aperture and a metal material may be filled in the first aperture.
    Type: Grant
    Filed: June 19, 2015
    Date of Patent: June 7, 2016
    Assignee: J-DEVICES CORPORATION
    Inventors: Hirokazu Honda, Shinji Watanabe, Toshihiro Iwasaki, Kiminori Ishido, Koichiro Niwa, Takeshi Miyakoshi, Sumikazu Hosoyamada, Yoshikazu Kumagaya, Tomoshige Chikai, Shingo Nakamura, Shotaro Sakumoto, Hiroaki Matsubara
  • SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
    Publication number: 20150371934
    Abstract: A semiconductor package includes a support substrate arranged with a first aperture reaching a semiconductor device on a rear side, the semiconductor device is bonded via an adhesive to a surface of the support substrate, an insulating layer covering the semiconductor device, and wiring for connecting the semiconductor device and an external terminal through the insulating layer. The adhesive may form a part of the first aperture. In addition, a heat dissipation part may be arranged in the first aperture and a metal material may be filled in the first aperture.
    Type: Application
    Filed: June 19, 2015
    Publication date: December 24, 2015
    Inventors: Hirokazu HONDA, Shinji WATANABE, Toshihiro IWASAKI, Kiminori ISHIDO, Koichiro NIWA, Takeshi MIYAKOSHI, Sumikazu HOSOYAMADA, Yoshikazu KUMAGAYA, Tomoshige CHIKAI, Shingo NAKAMURA, Shotaro SAKUMOTO, Hiroaki MATSUBARA
  • Semiconductor device and method of manufacturing the same
    Patent number: 6259154
    Abstract: A semiconductor device includes a semiconductor chip, a TAB tape, a stiffener, and a heat dissipation plate. The TAB tape has inner leads to be connected to electrodes of the semiconductor chip. The stiffener is adhered to the lower surface of the TAB tape to maintain flatness of the TAB tape. The heat dissipation plate has a surface on which the semiconductor chip and the stiffener surrounding the semiconductor chip are adhered. The heat dissipation plate dissipates heat generated by the semiconductor chip. The stiffener is molded with a synthetic resin material. A method of manufacturing a semiconductor device is also disclosed.
    Type: Grant
    Filed: April 20, 1999
    Date of Patent: July 10, 2001
    Assignee: NEC Corporation
    Inventor: Koichiro Niwa