Patents by Inventor Koichiro Ohbai

Koichiro Ohbai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Foam filler and hollow structure
    Patent number: 8726590
    Abstract: A foam filler is provided with a base for forming a foam and placed inside a hollow structure having a through hole. An opening having an area larger than the opening of the through hole is created in the base and surrounding the through hole. The foam filler is provided with an upper wall which follows the flow and the thermal expansion of the base at the time of heating. The upper wall closes at least part of the opening of the through hole when following the flow and the thermal expansion of the base, and thus prevents the base from entering into the through hole. The upper wall is provided in a peripheral portion of the opening and placed in a part of an area surrounding the through hole.
    Type: Grant
    Filed: September 21, 2007
    Date of Patent: May 20, 2014
    Assignee: Iida Industry Co., Ltd.
    Inventors: Kenichi Miura, Koichiro Ohbai, Koji Tokuyama
  • Foam filler and hollow structure
    Publication number: 20080073923
    Abstract: A foam filler is provided with a base for forming a foam and placed inside a hollow structure having a through hole. An opening having an area larger than the opening of the through hole is created in the base and surrounding the through hole. The foam filler is provided with an upper wall which follows the flow and the thermal expansion of the base at the time of heating. The upper wall closes at least part of the opening of the through hole when following the flow and the thermal expansion of the base, and thus prevents the base from entering into the through hole. The upper wall is provided in a peripheral portion of the opening and placed in a part of an area surrounding the through hole.
    Type: Application
    Filed: September 21, 2007
    Publication date: March 27, 2008
    Inventors: Kenichi Miura, Koichiro Ohbai, Koji Tokuyama