Patents by Inventor Koichiro SEKIMOTO

Koichiro SEKIMOTO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220288677
    Abstract: The present invention relates to a powder material including metal particles, in which in a mass basis cumulative particle size distribution, the metal particles have a 10% particle diameter d10 of less than 16 ?m and a 90% particle diameter d90 of more than 35 ?m and when a specific energy obtained as a value yielded by dividing a flow energy measured as an energy acting on a blade spiraling upward in the powder material by a mass of the powder material is normalized with a bulk density of the powder material, a resulting value is less than 0.47 mJ·ml/g2 and relates to a producing method for the same.
    Type: Application
    Filed: March 8, 2022
    Publication date: September 15, 2022
    Inventors: Koichiro SEKIMOTO, Daisuke KANAI, Teruki USUDA, Toshiyuki YAMANAKA, Takuya SAKAI, Shinnosuke YAMADA
  • Patent number: 11154929
    Abstract: The present invention relates to a metal powder material containing: metal particles having a particle diameter d10 of 10 ?m or more and 100 ?m or less; and nanoparticles containing a metal or a metal compound, in which the particle diameter d10 is a particle diameter at which an under-sieve cumulative fraction in a mass base distribution of particle diameter reaches 10%, and the nanoparticles are adhered to or mixed with the metal particles.
    Type: Grant
    Filed: December 13, 2018
    Date of Patent: October 26, 2021
    Assignee: DAIDO STEEL CO., LTD.
    Inventors: Teppei Okumura, Koichiro Sekimoto
  • Publication number: 20190193151
    Abstract: The present invention relates to a metal powder material containing: metal particles having a particle diameter d10 of 10 ?m or more and 100 ?m or less; and nanoparticles containing a metal or a metal compound, in which the particle diameter d10 is a particle diameter at which an under-sieve cumulative fraction in a mass base distribution of particle diameter reaches 10%, and the nanoparticles are adhered to or mixed with the metal particles.
    Type: Application
    Filed: December 13, 2018
    Publication date: June 27, 2019
    Inventors: Teppei OKUMURA, Koichiro SEKIMOTO