Abstract: A semiconductor laser and an optical fiber are optically coupled via a first lens and a second lens, the second lens is previously fixed to a module package and these parts are mounted to the module package, when focal lengths of the first lens and the second lens are respectively designated by f1 and f2, an optical distance between a principal plane of the first lens on its side of the second lens and a principal plane of the second lens on its side of the first lens, is made substantially equal to f1+f2. Thereby, there is provided an optical transmission module having low price capable of achieving a high coupling efficiency with high yield.

Abstract: To provide economical high-speed optical communications through an optical module a silicon substrate with a ball lens and semiconductor luminescence element mounted thereon, and a laser driver IC are provided. A silicon subassembly includes a silicon substrate with a pyramidal cavity etched into the substrate near its edge. A ball lens is precision-mounted in the pyramidal cavity by bonding it at multiple points. This provides a high-strength connection and a small, inexpensive silicon substrate. Also provided on the silicon substrate is a semiconductor luminescence element and a slit on the opposite side of the ball lens. The slit enables collimated light emitted from the ball lens to be optically coupled without being blocked or reflected by the substrate. The semiconductor luminescence element and its laser driver IC are placed in close proximity to each other, and ribbon wires are kept short (approximately 300 &mgr;m) to reduce signal line impedance mismatch for high-speed transmission.

Abstract: A semiconductor laser and an optical fiber are optically coupled via a first lens and a second lens, the second lens is previously fixed to a module package and these parts are mounted to the module package, when focal lengths of the first lens and the second lens are respectively designated by f1 and f2, an optical distance between a principal plane of the first lens on its side of the second lens and a principal plane of the second lens on its side of the first lens, is made substantially equal to f1+f2. Thereby, there is provided an optical transmission module having low price capable of achieving a high coupling efficiency with high yield.

Abstract: To provide economical high-speed optical communications through an optical module a silicon substrate with a ball lens and semiconductor luminescence element mounted thereon, and a laser driver IC are provided. A silicon subassembly includes a silicon substrate with a pyramidal cavity etched into the substrate near its edge. A ball lens is precision-mounted in the pyramidal cavity by bonding it at multiple points. This provides a high-strength connection and a small, inexpensive silicon substrate. Also provided on the silicon substrate is a semiconductor luminescence element and a slit on the opposite side of the ball lens. The slit enables collimated light emitted from the ball lens to be optically coupled without being blocked or reflected by the substrate. The semiconductor luminescence element and its laser driver IC are placed in close proximity to each other, and ribbon wires are kept short (approximately 300 &mgr;m) to reduce signal line impedance mismatch for high-speed transmission.

Abstract: An optical semiconductor array module comprising an optical semiconductor array device constituted by a plurality of semiconductor laser diode, light-emitting diode elements or a plurality of semiconductor photo diode elements, an electronic device for driving and controlling the optical semiconductor array device, a cube-shaped package case for housing the optical semiconductor array device and the electronic device therein, an optical fiber array optically coupled to the optical semiconductor array device, a supporting member for holding and fixing the optical fiber array to one surface of the cube-shaped package case, and a terminal portion having a plurality of pins for electrically connecting an external circuit board to the electronic device.