Patents by Inventor Koichiro Yoshida

Koichiro Yoshida has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11912053
    Abstract: To provide a coating liquid for release layer with which a release layer having a small variation in the performance difference can be stably formed, to provide a method for producing a thermal transfer sheet using this coating liquid for release layer, and to provide a thermal transfer sheet having stable releasability. A thermal transfer sheet having a substrate, a release layer provided on the substrate, and a transfer layer provided on the release layer, wherein the transfer layer is provided peelably from the release layer, and the release layer contains a silsesquioxane.
    Type: Grant
    Filed: September 15, 2021
    Date of Patent: February 27, 2024
    Assignee: Dai Nippon Printing Co., Ltd.
    Inventors: Kazuya Yoshida, Tomohiko Imoda, Yoshihiro Imakura, Yasuyuki Shouji, Daisuke Fukui, Ryoji Hattori, Koichiro Kuroda
  • Publication number: 20150183991
    Abstract: Provided is a flame-retardant thermoplastic resin composition including (A) a thermoplastic resin other than a polyphenylene ether, (B) polyphenylene ether, (C) at least one phosphinate selected from the group consisting of a phosphinate having a particular structure, a diphosphinate having a particular structure and a condensate thereof, and (D) at least one colorant selected from the group consisting of an organic pigment, an inorganic pigment and an organic dye, wherein a content of an iron element is less than 50 ppm on a mass basis.
    Type: Application
    Filed: November 18, 2014
    Publication date: July 2, 2015
    Applicant: ASAHI KASEI CHEMICALS CORPORATION
    Inventors: Mihoko YAMAMOTO, Koichiro YOSHIDA, Shunichiro I, Chihiro MAEDA
  • Patent number: 8991602
    Abstract: The present invention provides a module used for stacking thin panels that allows for stacking of a plurality of thin panels in the vertical direction efficiently and stably. The module includes a sandwiching support portion, a load transmitting portion, and a positioning portion. The sandwiching support portion sandwiches and supports the thin panel. The load transmitting portion is coupled with the sandwiching support portion, and transmits the weight of the thin panel in the vertical direction. The positioning portion relatively positions thin panels, which are stacked in the vertical direction, in the horizontal direction. The sandwiching support portion includes a lower plate-shaped body and a vertical wall. The lower plate-shaped body is disposed on a lower portion of the module. The vertical wall extends upward from an outer edge of the lower plate-shaped body to form an approximately C-shaped cross-sectional surface in conjunction with the lower plate-shaped body.
    Type: Grant
    Filed: December 16, 2011
    Date of Patent: March 31, 2015
    Assignees: Hitachi Transport System, Ltd., Kyoraku Co., Ltd.
    Inventors: Nobuyuki Kashima, Hiroshi Kobayashi, Takeshi Matsue, Hiroyuki Hashimoto, Koichiro Yoshida
  • Patent number: 8946356
    Abstract: A resin composition having a high thermal aging property and molding stability in mass production of molded articles while keeping molding fluidity and thermal creep resistance is provided. A resin composition, containing 100 parts by mass in total of a polypropylene resin (a) and a polyphenylene ether resin (b), and 1 to 20 parts by mass of a compatibilizer (c), wherein in the component (a), the proportion of the component having a molecular weight of 30,000 or less is from 3.0 to 5.1% of the entire component (a), and the proportion of the component having a molecular weight of 10,000,000 or more is from 1.0 to 1.6% of the entire component (a).
    Type: Grant
    Filed: July 5, 2012
    Date of Patent: February 3, 2015
    Assignee: Asahi Kasei Chemicals Corporation
    Inventors: Shunichiro I, Koichiro Yoshida, Takaaki Miyoshi
  • Publication number: 20140206810
    Abstract: A resin composition having a high thermal aging property and molding stability in mass production of molded articles while keeping molding fluidity and thermal creep resistance is provided. A resin composition, containing 100 parts by mass in total of a polypropylene resin (a) and a polyphenylene ether resin (b), and 1 to 20 parts by mass of a compatibilizer (c), wherein in the component (a), the proportion of the component having a molecular weight of 30,000 or less is from 3.0 to 5.1% of the entire component (a), and the proportion of the component having a molecular weight of 10,000,000 or more is from 1.0 to 1.6% of the entire component (a).
    Type: Application
    Filed: July 5, 2012
    Publication date: July 24, 2014
    Applicant: ASAHI KASEI CHEMICALS CORPORATION
    Inventors: Shunichiro I, Koichiro Yoshida, Takaaki Miyoshi
  • Publication number: 20130334397
    Abstract: The present invention provides a module used for stacking thin panels that allows for stacking of a plurality of thin panels in the vertical direction efficiently and stably. The module includes a sandwiching support portion, a load transmitting portion, and a positioning portion. The sandwiching support portion sandwiches and supports the thin panel. The load transmitting portion is coupled with the sandwiching support portion, and transmits the weight of the thin panel in the vertical direction. The positioning portion relatively positions thin panels, which are stacked in the vertical direction, in the horizontal direction. The sandwiching support portion includes a lower plate-shaped body and a vertical wall. The lower plate-shaped body is disposed on a lower portion of the module. The vertical wall extends upward from an outer edge of the lower plate-shaped body to form an approximately C-shaped cross-sectional surface in conjunction with the lower plate-shaped body.
    Type: Application
    Filed: December 16, 2011
    Publication date: December 19, 2013
    Applicants: KYORAKU CO., LTD, HITACHI TRANSPORT SYSTEM, LTD
    Inventors: Nobuyuki Kashima, Hiroshi Kobayashi, Takeshi Matsue, Hiroyuki Hashimoto, Koichiro Yoshida