Patents by Inventor Koichiro Yoshimoto
Koichiro Yoshimoto has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11978787Abstract: A power control switch assembly. The assembly may include a thyristor device, where the thyristor device includes a first device terminal, a second device terminal, and a gate terminal> The assembly may include a negative temperature coefficient (NTC) device, electrically coupled to the gate terminal of the thyristor device on a first end, and electrically coupled to the first device terminal of the thyristor device on a second end, wherein the NTC device is thermally coupled to the thyristor device.Type: GrantFiled: February 18, 2022Date of Patent: May 7, 2024Assignee: Littelfuse, Inc.Inventor: Koichiro Yoshimoto
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Patent number: 11970760Abstract: The present invention relates to a metal powder containing: 0.001 mass %?C?0.45 mass %, 0.01 mass %?Si?3.50 mass %, Mn?2.0 mass %, 7.5 mass %?Cr?21.0 mass %, 1.5 mass %?Ni?7.0 mass %, Mo?1.3 mass %, 0.05 mass %?V?2.0 mass %, Al?0.015 mass %, and N?0.20 mass %, with the balance being Fe and unavoidable impurities, satisfying 0.05 mass %?C+N?0.58 mass %, and satisfying: 10<15C+Mn+0.5Cr+Ni<20 and Creq/Nieq<5.6, where Creq=Cr+Mo+1.5Si+0.5Nb, and Nieq=Ni+30C+30N+0.5Mn.Type: GrantFiled: November 8, 2022Date of Patent: April 30, 2024Assignee: DAIDO STEEL CO., LTD.Inventors: Asako Kamimoto, Kenji Sugiyama, Takashi Yoshimoto, Koichiro Inoue
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Publication number: 20220173232Abstract: A power control switch assembly. The assembly may include a thyristor device, where the thyristor device includes a first device terminal, a second device terminal, and a gate terminal> The assembly may include a negative temperature coefficient (NTC) device, electrically coupled to the gate terminal of the thyristor device on a first end, and electrically coupled to the first device terminal of the thyristor device on a second end, wherein the NTC device is thermally coupled to the thyristor device.Type: ApplicationFiled: February 18, 2022Publication date: June 2, 2022Applicant: Littelfuse, Inc.Inventor: Koichiro Yoshimoto
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Patent number: 11349021Abstract: A power control switch assembly. The assembly may include a thyristor device, where the thyristor device includes a first device terminal, a second device terminal, and a gate terminal> The assembly may include a negative temperature coefficient (NTC) device, electrically coupled to the gate terminal of the thyristor device on a first end, and electrically coupled to the first device terminal of the thyristor device on a second end, wherein the NTC device is thermally coupled to the thyristor device.Type: GrantFiled: March 24, 2020Date of Patent: May 31, 2022Assignee: Littelfuse, Inc.Inventor: Koichiro Yoshimoto
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Publication number: 20210305415Abstract: A power control switch assembly. The assembly may include a thyristor device, where the thyristor device includes a first device terminal, a second device terminal, and a gate terminal> The assembly may include a negative temperature coefficient (NTC) device, electrically coupled to the gate terminal of the thyristor device on a first end, and electrically coupled to the first device terminal of the thyristor device on a second end, wherein the NTC device is thermally coupled to the thyristor device.Type: ApplicationFiled: March 24, 2020Publication date: September 30, 2021Applicant: Littelfuse, Inc.Inventor: Koichiro Yoshimoto
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Patent number: 10446477Abstract: A device may include a lead frame, where the lead frame includes a central portion, and a side pad, the side pad being laterally disposed with respect to the central portion. The device may further include a thyristor device, the thyristor device comprising a semiconductor die and further comprising a gate, wherein the thyristor device is disposed on a first side of the lead frame on the central portion. The device may also include a positive temperature coefficient (PTC) device electrically coupled to the gate of the thyristor device, wherein the PTC device is disposed on the side pad on the first side of the lead frame; and a thermal coupler having a first end connected to the thyristor device and a second end attached to the PTC device.Type: GrantFiled: December 5, 2018Date of Patent: October 15, 2019Assignee: LITTELFUSE, INC.Inventor: Koichiro Yoshimoto
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Publication number: 20190109078Abstract: A device may include a lead frame, where the lead frame includes a central portion, and a side pad, the side pad being laterally disposed with respect to the central portion. The device may further include a thyristor device, the thyristor device comprising a semiconductor die and further comprising a gate, wherein the thyristor device is disposed on a first side of the lead frame on the central portion. The device may also include a positive temperature coefficient (PTC) device electrically coupled to the gate of the thyristor device, wherein the PTC device is disposed on the side pad on the first side of the lead frame; and a thermal coupler having a first end connected to the thyristor device and a second end attached to the PTC device.Type: ApplicationFiled: December 5, 2018Publication date: April 11, 2019Applicant: LITTELFUSE, INC.Inventor: Koichiro Yoshimoto
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Patent number: 10177081Abstract: A device may include a lead frame, where the lead frame includes a central portion, and a side pad, the side pad being laterally disposed with respect to the central portion. The device may further include a thyristor device, the thyristor device comprising a semiconductor die and further comprising a gate, wherein the thyristor device is disposed on a first side of the lead frame on the central portion. The device may also include a positive temperature coefficient (PTC) device electrically coupled to the gate of the thyristor device, wherein the PTC device is disposed on the side pad on the first side of the lead frame; and a thermal coupler having a first end connected to the thyristor device and a second end attached to the PTC device.Type: GrantFiled: January 13, 2017Date of Patent: January 8, 2019Assignee: Littlefuse, Inc.Inventor: Koichiro Yoshimoto
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Publication number: 20180204789Abstract: A device may include a lead frame, where the lead frame includes a central portion, and a side pad, the side pad being laterally disposed with respect to the central portion. The device may further include a thyristor device, the thyristor device comprising a semiconductor die and further comprising a gate, wherein the thyristor device is disposed on a first side of the lead frame on the central portion. The device may also include a positive temperature coefficient (PTC) device electrically coupled to the gate of the thyristor device, wherein the PTC device is disposed on the side pad on the first side of the lead frame; and a thermal coupler having a first end connected to the thyristor device and a second end attached to the PTC device.Type: ApplicationFiled: January 13, 2017Publication date: July 19, 2018Applicant: Littelfuse, Inc.Inventor: Koichiro Yoshimoto
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Publication number: 20160141275Abstract: An electronic power module is disclosed. The module includes a baseplate and a plurality of internally isolated discrete electronic devices mounted to the baseplate such that their electrical leads are oriented away from the baseplate. Electrical leads may be coupled to a printed circuit board (PCB). Other features disclosed include a thermal interface material and an application-specific heat sink. The assembly may be overmolded via injection molding or potted using an encapsulant. Example electronic devices include thyristors, diodes, and transistors.Type: ApplicationFiled: November 19, 2014Publication date: May 19, 2016Applicant: LITTELFUSE, INC.Inventors: Richard J. Bono, Koichiro Yoshimoto