Abstract: An adhesion method including: a step (1), disposing a stickable-curable adhesive layer on a first adherend; a step (2), disposing a curing agent layer on a second adherend, the curing agent layer being able to cure the stickable-curable adhesive layer by contacting and reacting with the stickable-curable adhesive layer; and a step (3), bringing the stickable-curable adhesive layer into contact with the curing agent layer so that they are sandwiched by the first adherend and the second adherend.

Abstract: An adhesion method including: a step (1), disposing a stickable-curable adhesive layer on a first adherend; a step (2), disposing a curing agent layer on a second adherend, the curing agent layer being able to cure the stickable-curable adhesive layer by contacting and reacting with the stickable-curable adhesive layer; and a step (3), bringing the stickable-curable adhesive layer into contact with the curing agent layer so that they are sandwiched by the first adherend and the second adherend.

Abstract: An adhesion method including: a step (1), disposing a stickable-curable adhesive layer on a first adherend; a step (2), disposing a curing agent layer on a second adherend, the curing agent layer being able to cure the stickable-curable adhesive layer by contacting and reacting with the stickable-curable adhesive layer; and a step (3), bringing the stickable-curable adhesive layer into contact with the curing agent layer so that they are sandwiched by the first adherend and the second adherend.

Abstract: An object of the present invention is to provide an electrically debondable composition for forming an electrically debondable adhesive layer suitable for suppressing corrosion of a metal adherend surface. The present invention further provides an adhesive sheet having the electrically debondable adhesive layer, and an adhered body including the adhesive sheet. An electrically debondable composition of the present invention includes a polymer, an ionic liquid, and at least one additive selected from the group consisting of a carbodiimide compound, an adsorptive inhibitor and a chelate-forming metal deactivator.

Abstract: An adhesion method including: a step (1), disposing a stickable-curable adhesive layer on a first adherend; a step (2), disposing a curing agent layer on a second adherend, the curing agent layer being able to cure the stickable-curable adhesive layer by contacting and reacting with the stickable-curable adhesive layer; and a step (3), bringing the stickable-curable adhesive layer into contact with the curing agent layer so that they are sandwiched by the first adherend and the second adherend.

Abstract: The present invention relates to an optical-semiconductor device, which is prepared by: arranging a sheet for optical-semiconductor element encapsulation including an encapsulating resin layer capable of embedding an optical-semiconductor element and a wavelength conversion layer containing light wavelength-converting particles and being laminated directly or indirectly on the encapsulating resin layer, on an optical-semiconductor element-mounting substrate so that the encapsulating resin layer faces the optical-semiconductor element-mounting substrate; followed by compression-molding, in which the wavelength conversion layer is present on an upper part of a molded body in which the optical-semiconductor element is embedded therein, but is not present on a side surface of the molded body.

Abstract: The present invention relates to a sheet-shaped, optical-semiconductor encapsulating material including: a first resin layer containing inorganic particles; and a second resin layer containing a phosphor and being superposed directly or indirectly on the first resin layer, and relates to a kit for optical-semiconductor encapsulation including: a sheet-shaped molded body including a first resin layer containing inorganic particles; and a sheet-shaped molded body including a second resin layer containing a phosphor.

Abstract: The present invention relates to an optical-semiconductor device, which is prepared by: arranging a sheet for optical-semiconductor element encapsulation including an encapsulating resin layer capable of embedding an optical-semiconductor element and a wavelength conversion layer containing light wavelength-converting particles and being laminated directly or indirectly on the encapsulating resin layer, on an optical-semiconductor element-mounting substrate so that the encapsulating resin layer faces the optical-semiconductor element-mounting substrate; followed by compression-molding, in which the wavelength conversion layer is present on an upper part of a molded body in which the optical-semiconductor element is embedded therein, but is not present on a side surface of the molded body.

Abstract: The present invention relates to an optical semiconductor device including: a substrate having mounted thereon an LED chip; an encapsulation resin layer embedding the LED chip; an inorganic high-heat conductive layer; and a wavelength conversion layer containing an inorganic phosphor powder, in which the encapsulation resin layer, the inorganic high-heat conductive layer and the wavelength conversion layer are laminated in this order on the substrate either directly or indirectly.

Abstract: The present invention relates to an optical semiconductor device including: a substrate having mounted thereon an LED chip; an encapsulation resin layer embedding the LED chip; an inorganic high-heat conductive layer; and a wavelength conversion layer containing an inorganic phosphor powder, in which the encapsulation resin layer, the inorganic high-heat conductive layer and the wavelength conversion layer are laminated in this order on the substrate either directly or indirectly.

Abstract: The present invention relates to an optical-semiconductor device, which is prepared by: arranging a sheet for optical-semiconductor element encapsulation including an encapsulating resin layer capable of embedding an optical-semiconductor element and a wavelength conversion layer containing light wavelength-converting particles and being laminated directly or indirectly on the encapsulating resin layer, on an optical-semiconductor element-mounting substrate so that the encapsulating resin layer faces the optical-semiconductor element-mounting substrate; followed by compression-molding, in which the wavelength conversion layer is present on an upper part of a molded body in which the optical-semiconductor element is embedded therein, but is not present on a side surface of the molded body.

Abstract: The present invention relates to a sheet-shaped optical-semiconductor encapsulating material including: a first resin layer containing inorganic particles; and a second resin layer containing a phosphor and being superposed directly or indirectly on the first resin layer, and relates to a kit for optical-semiconductor encapsulation including: a sheet-shaped molded body including a first resin layer containing inorganic particles; and a sheet-shaped molded body including a second resin layer containing a phosphor.

Abstract: The present invention relates to a kit for optical semiconductor encapsulation including a liquid first encapsulating material containing inorganic particles and a liquid second encapsulating material containing a phosphor; a kit for optical semiconductor encapsulation including a sheet-shaped first encapsulating material containing inorganic particles and a liquid second encapsulating material containing a phosphor; and a kit for optical semiconductor encapsulation including a liquid first encapsulating material containing inorganic particles and a sheet-shaped second encapsulating material containing a phosphor.

Abstract: The present invention relates to a sheet for photosemiconductor encapsulation having a release sheet and an encapsulating resin layer laminated thereon, in which the release sheet contains a concave-convex portion-forming layer having a concave shape and/or a convex shape, at an interface with the encapsulating resin layer, and the encapsulating resin layer has a convex shape fitted to the concave shape of the release sheet and/or a concave shape fitted to the convex shape of the release sheet at an interface with the release sheet.

Abstract: A curable re-release adhesive which, when subjected to a curing reaction caused by irradiation with radiation, shows a sufficient drop of adhesion and causes the adherend to be warped to a minimized extent as developed by the shrinkage force caused by the curing reaction. The re-release adhesive contains a radiation-reactive polymer including a main chain and a plurality of intramolecular side chains, each such side chain having a terminal carbon-carbon double bond, a chain length of 6 or more in terms of number of atoms, and the same or a different number of atoms as each other side chain in the polymer. The release adhesive shows a shrinkage force of 30 MPa or less as developed by a curing reaction upon irradiation. A re-release adhesive sheet is also disclosed, including a substrate film and an adhesive layer containing the re-release adhesive, provided on one surface thereof.

Abstract: A laminated sheet for adhering to a circuit side of a projected electrode-mounting wafer in a step of grinding a backside of the wafer, wherein the laminated sheet comprises at least a layer (layer A) contacting with the circuit side, made of a thermosetting resin, a layer (layer B) directly laminated on the layer A, made of a thermoplastic resin having a tensile modulus of from 1 to 300 MPa at 40° to 80° C., and an outermost layer (layer C) made of a thermoplastic resin which is non-plastic at a temperature of at least 25° C.; A method for manufacturing a semiconductor device, comprising the steps of grinding a backside of a projected electrode-mounting wafer wherein the laminated sheet is adhered to a circuit side of the wafer, removing other layers besides the layer A of the laminated sheet, and cutting the wafer into individual chips; and a semiconductor device obtainable by the method.

Abstract: A laminated sheet for adhering to a circuit side of a projected electrode-mounting wafer in a step of grinding a backside of the wafer, wherein the laminated sheet comprises at least a layer (layer A) contacting with the circuit side, made of a thermosetting resin, a layer (layer B) directly laminated on the layer A, made of a thermoplastic resin having a tensile modulus of from 1 to 300 MPa at 40° to 80° C., and an outermost layer (layer C) made of a thermoplastic resin which is non-plastic at a temperature of at least 25° C.; A method for manufacturing a semiconductor device, comprising the steps of grinding a backside of a projected electrode-mounting wafer wherein the laminated sheet is adhered to a circuit side of the wafer, removing other layers besides the layer A of the laminated sheet, and cutting the wafer into individual chips; and a semiconductor device obtainable by the method.

Abstract: A curable re-release adhesive which, when subjected to a curing reaction caused by irradiation with radiation, shows a sufficient drop of adhesion and causes the adherend to be warped to a minimized extent as developed by the shrinkage force caused by the curing reaction. The re-release adhesive contains a radiation-reactive polymer including a main chain and a plurality of intramolecular side chains, each such side chain having a terminal carbon-carbon double bond, a chain length of 6 or more in terms of number of atoms, and the same or a different number of atoms as each other side chain in the polymer. The release adhesive shows a shrinkage force of 30 MPa or less as developed by a curing reaction upon irradiation. A re-release adhesive sheet is also disclosed, including a substrate film and an adhesive layer containing the re-release adhesive, provided on one surface thereof.

Abstract: A dicing-die bonding film comprising an ultraviolet-transmitting substrate having provided thereon an ultraviolet-curable pressure-sensitive adhesive layer and an adhesive layer in this order, the pressure-sensitive adhesive layer having been partly ultraviolet-cured to have cured parts and uncured parts. The film has a well-balanced combination of a holding power for supporting a semiconductor wafer during dicing and release properties for enabling cut chips to be easily released together with the adhesive layer so that even large-sized chips as larger than 10 mm.times.10 mm can easily be picked up.

Abstract: A dicing-die bonding film comprising an ultraviolet-transmitting substrate having provided thereon an ultraviolet-curable pressure-sensitive adhesive layer and an adhesive layer in this order, the pressure-sensitive adhesive layer having been partly ultraviolet-cured to have cured parts and uncured parts. The film has a well-balanced combination of a holding power for supporting a semiconductor wafer during dicing and release properties for enabling cut chips to be easily released together with the adhesive layer so that even large-sized chips as larger than 10 mm.times.10 mm can easily be picked up.