Abstract: A semiconductor device provided on a semiconductor substrate includes an element region including an element, a moisture-resistant frame surrounding the element region, an insulating layer provided between the moisture-resistant frame and an outer peripheral edge of the semiconductor device and on the semiconductor substrate, a first metal line extending along the outer peripheral edge and provided in the insulating layer, and a groove provided in the insulating layer.

Abstract: A semiconductor device provided on a semiconductor substrate includes an element region including an element, a moisture-resistant frame surrounding the element region, an insulating layer provided between the moisture-resistant frame and an outer peripheral edge of the semiconductor device and on the semiconductor substrate, a first metal line extending along the outer peripheral edge and provided in the insulating layer, and a groove provided in the insulating layer.

Abstract: A semiconductor device provided on a semiconductor substrate includes an element region including an element, a moisture-resistant frame surrounding the element region, an insulating layer provided between the moisture-resistant frame and an outer peripheral edge of the semiconductor device and on the semiconductor substrate, a first metal line extending along the outer peripheral edge and provided in the insulating layer, and a groove provided in the insulating layer.

Abstract: A semiconductor device provided on a semiconductor substrate includes an element region including an element, a moisture-resistant frame surrounding the element region, an insulating layer provided between the moisture-resistant frame and an outer peripheral edge of the semiconductor device and on the semiconductor substrate, a first metal line extending along the outer peripheral edge and provided in the insulating layer, and a groove provided in the insulating layer.

Abstract: A semiconductor device provided on a semiconductor substrate includes an element region including an element, a moisture-resistant frame surrounding the element region, an insulating layer provided between the moisture-resistant frame and an outer peripheral edge of the semiconductor device and on the semiconductor substrate, a first metal line extending along the outer peripheral edge and provided in the insulating layer, and a groove provided in the insulating layer.

Abstract: A semiconductor device provided on a semiconductor substrate includes an element region including an element, a moisture-resistant frame surrounding the element region, an insulating layer provided between the moisture-resistant frame and an outer peripheral edge of the semiconductor device and on the semiconductor substrate, a first metal line extending along the outer peripheral edge and provided in the insulating layer, and a groove provided in the insulating layer.

Abstract: A semiconductor device provided on a semiconductor substrate includes an element region including an element, a moisture-resistant frame surrounding the element region, an insulating layer provided between the moisture-resistant frame and an outer peripheral edge of the semiconductor device and on the semiconductor substrate, a first metal line extending along the outer peripheral edge and provided in the insulating layer, and a groove provided in the insulating layer.

Abstract: A diagnostic apparatus is disclosed, which includes a processor configured to extract, from a plurality of components included in an integrated circuit to be diagnosed, a failure candidate based on test results obtained from actual operations of the integrated circuit, the actual operations being implemented by individually applying a plurality of types of test patterns to the integrated circuit, extract, from a plurality of pass patterns of the test patterns, a pass pattern with which a signal is transmitted to the failure candidate, based on log data obtained from simulations with the test patterns, the test results of the plurality of pass patterns being normal, and execute, using a fail pattern of the test patterns and the extracted pass patterns, a failure simulation assuming that the failure candidate is failed, the test result of the fail pattern being abnormal.

Abstract: A semiconductor device provided on a semiconductor substrate includes an element region including an element, a moisture-resistant frame surrounding the element region, an insulating layer provided between the moisture-resistant frame and an outer peripheral edge of the semiconductor device and on the semiconductor substrate, a first metal line extending along the outer peripheral edge and provided in the insulating layer, and a groove provided in the insulating layer.

Abstract: A semiconductor device provided on a semiconductor substrate includes an element region including an element, a moisture-resistant frame surrounding the element region, an insulating layer provided between the moisture-resistant frame and an outer peripheral edge of the semiconductor device and on the semiconductor substrate, a first metal line extending along the outer peripheral edge and provided in the insulating layer, and a groove provided in the insulating layer.

Abstract: A semiconductor device provided on a semiconductor substrate includes an element region including an element, a moisture-resistant frame surrounding the element region, an insulating layer provided between the moisture-resistant frame and an outer peripheral edge of the semiconductor device and on the semiconductor substrate, a first metal line extending along the outer peripheral edge and provided in the insulating layer, and a groove provided in the insulating layer.

Abstract: A driving mode switching apparatus for a four-wheel-drive vehicle, which switches driving modes of the four-wheel drive vehicle, includes a motor, a reduction mechanism being transmitted with a rotational force of the motor, an output rod connected to the reduction mechanism and switching the driving modes by being displaced, a housing housing the motor and the reduction mechanism, a temperature sensor arranged at a position away from the motor within the housing and detecting ambient temperature in the housing, and a controller varying an output property of the motor in response to a detected temperature by the temperature sensor.

Abstract: A semiconductor device provided on a semiconductor substrate includes an element region including an element, a moisture-resistant frame surrounding the element region, an insulating layer provided between the moisture-resistant frame and an outer peripheral edge of the semiconductor device and on the semiconductor substrate, a first metal line extending along the outer peripheral edge and provided in the insulating layer, and a groove provided in the insulating layer.

Abstract: A driving mode switching apparatus for a four-wheel-drive vehicle, which switches driving modes of the four-wheel drive vehicle, includes a motor, a reduction mechanism being transmitted with a rotational force of the motor, an output rod connected to the reduction mechanism and switching the driving modes by being displaced, a housing housing the motor and the reduction mechanism, a temperature sensor arranged at a position away from the motor within the housing and detecting ambient temperature in the housing, and a controller varying an output property of the motor in response to a detected temperature by the temperature sensor.

Abstract: Disclosed is a fuel cell separator molded from a fuel cell separator composition mainly containing a conductive material and a binder, characterized in that said separator is specified such that after 3.5 g of a test piece cut from said fuel cell separator is put in 305 mL of pure water and the water is heated at 90° C. for 500 hr, an electric conductivity of the water is 50 &mgr;S/cm or less. The fuel cell separator thus obtained is effective to reduce elution of ions and exhibit a high moldability and a high dimensional stability. Further, a polymer electrolyte fuel cell using the fuel cell separators is effective to exhibit a stable output without reduction in output during operation and enhance the operational efficiency.

Abstract: A thin, electromagnetic wave shielding laminate for displays, which is thin, light, excellent in flexibility, has improved resistance of its near-infrared reducing function to ultraviolet rays, heat and moisture, requires only a simple production process, easily produced, excellent in productivity and easily attached to a display, and process for producing the same, in which the thin, electromagnetic wave shielding laminate for displays with a mesh-shape electroconductive material having openings which is provided, at least on one side, with an optical film via an adhesive layer to form a monolithic structure, wherein (a) the optical film having a near-infrared reducing function is arranged on the display side from the mesh-shape electroconductive material, and (b) the openings of said mesh-shape electroconductive material or the openings and surface layer section are filled or coated with a transparent resin composition satisfying a specific optical requirement, and the process for producing the same.

Abstract: There are disclosed a transparent electromagnetic wave-shielding laminate for display, the laminate comprising an electromagnetic wave-shielding layer wherein at least periphery of a terminal cross section of the layer and/or periphery of an edge thereof is covered with an electroconductive elastomer composition containing an electroconductive filler and a thermoplastic elastomer; a process for producing an electromagnetic wave-shielding laminate comprising bringing an electroconductive elastomer composition into contact with at least periphery of a terminal cross section of an electromagnetic wave-shielding layer and/or periphery of an edge of the layer, and in this state, heat press bonding the composition from a lamination direction and/or cross sectional direction to form an exposed portion on at least peripheral end of the laminate, the portion comprising the composition which is grounded to the layer; other processes for producing the same; and a display unit comprising the transparent electromagnetic w

Abstract: A differential device for 4WD vehicles having a reduced size and capable of being produced at lower costs makes it possible to select between a 2WD state, a differential-free 4WD state, and a differential-locked 4WD state. The differential device includes a differential case, a side gear, a hub, and a switching mechanism which establishes and interrupts a connection between each of the differential case, the side gear, and the hub. The switching mechanism includes, among other possible features, a first sleeve, a second sleeve which is separate from the first sleeve, and a pin. A sole actuator moves the second sleeve between first, second and third positions to establish the 2WD state, the differential-free 4WD state, and the differential-locked 4WD state.

Abstract: A transparent electromagnetic radiation shielding sheet having sufficient visible light transmittance and electromagnetic radiation shielding performance is disclosed. The transparent electromagnetic radiation shielding sheet includes a hot melt adhesive resin comprising a resin having a structure where organic acid is not produced by hydrolysis. The transparent electromagnetic radiation shielding sheet is light, excellent in durability and is favorably used in various display devices. A method of producing the transparent electromagnetic radiation shielding sheet and a display device such as a plasma display device and a CRT (cold-cathode ray tube) having the transparent electromagnetic radiation shielding sheet placed on the front surface of a display panel of the display device are also disclosed.

Abstract: A method of determining wire layouts of a circuit in a semiconductor device that includes a plurality of modules each corresponding to a circuit block includes the steps of providing module terminals of modules to be connected together in a same single layer, determining layouts of wires connected to the module terminals inside the respective modules by laying out the wires in one or more layers no higher than the single layer, and determining layouts of inter-module wires connecting between the module terminals by laying out the inter-module wires in the one or more layers no higher than the single layer.